A compact, low-loss and wavelength insensitive Y-junction for submicron silicon waveguides. The design was performed using FDTD and particle swarm optimization (PSO). The device was fabricated in a 248 nm CMOS line. Measured average insertion loss is 0.280.02 dB across an 8-inch wafer. The device footprint is less than 1.2 m2 m, orders of magnitude smaller than MMI and directional couplers.

Structures including a waveguide arrangement and methods of fabricating a structure that includes a waveguide arrangement. A second waveguide spaced in a lateral direction from a first waveguide, a third waveguide spaced in a vertical direction from the first waveguide, and a fourth waveguide spaced in the vertical direction from the second waveguide. The third waveguide is arranged in the lateral direction to provide a first overlapping relationship with the first waveguide. The fourth waveguide is arranged in the lateral direction to provide a second overlapping relationship with the second waveguide.

An integrated thermal sensor comprising photonic crystal elements that enable photonic elements for photonic sourcing, spectral switching and filtering, sensing of an exposed analyte and detection. In embodiments, applications are disclosed wherein these photonic elements provide a spectrophotometer, a photonic channel switch and a standalone sensor for toxic gases and vapors. An application coupled with a mobile phone is disclosed.

The present invention relates to an optical interconnection for interconnecting a first contact and a second contact, which need to be optically interconnected, the optical interconnection comprising: a nanorod formed on at least one of the first contact and the second contact; and a nanowire extending from the first contact or the nanorod formed on the first contact so as to transmit an optical signal toward the second contact or the nanorod formed on the second contact. The optical interconnection according to the present invention shows improved optical signal characteristics due to a reduction in coupling loss.

A method for attaching at least one optical fiber to a chip includes the steps of: providing at least one nanowaveguide of a chip including at least one nanowaveguide end to be attached to at least one off-chip fiber respectively; forming at least one oxide taper over or adjacent to each of the at least one nanowaveguide end; cleaving at least one fiber end; aligning the chip so that an end face of each of the at least one oxide taper is mechanically aligned substantially adjacent to each corresponding cleaved fiber end; and fusing each of the at least one oxide taper with each of the at least one fiber end respectively to modally couple each of the nanowaveguides to each of the at least one fiber end via each of the oxide tapers. A device for attaching at least one optical fiber to a chip is also described.

A SOI device may include a waveguide adapter that couples light between an external light sourcee.g., a fiber optic cable or laserand a silicon waveguide on the silicon surface layer of the SOI device. In one embodiment, the waveguide adapter is embedded into the insulator layer. Doing so may enable the waveguide adapter to be formed before the surface layer components are added onto the SOI device. Accordingly, fabrication techniques that use high-temperatures may be used without harming other components in the SOI devicee.g., the waveguide adapter is formed before heat-sensitive components are added to the silicon surface layer.

An optical waveguide includes a diamond layer including a first surface, a second surface and a diamond layer including a complex defect; a first clad layer in contact with the first surface; a second clad layer in contact with the second surface and including a polarity; and a metal layer in Schottky contact with the second clad layer.

Provided is a method of forming a micro/nanowire having a nanometer- to micrometer-sized diameter at predetermined positions of an object. The method includes: preparing a micro/nanopipette having a tip with an inner diameter which is substantially the same as the diameter of the micro/nanowire to be formed; filling the micro/nanopipette with a solution containing a micro/nanowire-forming material; brining the solution into contact with the object through the tip of the micro/nanopipette; and pulling the micro/nanopipette from the object at a pulling speed lower than or equal to a predetermined critical speed (.sub.c) to obtain a micro/nanowire having substantially the same diameter as the inner diameter of the micro/nanopipette tip.

Provided are a Fourier lens, a method for designing a Fourier lens, and a schlieren apparatus. The Fourier lens includes a substrate and a plurality of cuboid waveguides. The plurality of waveguides are arranged on the substrate in parallel and spaced from each other at a preset interval. The material of the substrate and the material of the waveguides are all transparent to the working waveband of the Fourier lens. The preset interval is smaller than a quotient obtained by dividing a center wavelength of the working waveband by the refractive index of the substrate. The waveguide has a plurality of widths, and the waveguides of different widths correspond to different phase delays. The individual waveguides are arranged on the substrate according to phase delays required at different positions. According to the embodiments, the range of the working angle of the Fourier lens can be increased.

An integrated optical component includes at least one input waveguide, at least one output waveguide; a first slab waveguide having a first refractive index, n1. The first slab waveguide may be disposed between at least one of the input waveguides and at least one of the output waveguides. The integrated optical component may further include a second slab waveguide having a second refractive index, n2. The integrated optical component may also include a third cladding slab having a third refractive index, n3. The third cladding slab may be disposed between the first slab and the second slab. The thickness of the second slab waveguide and the thickness of the third slab waveguide are adjustable to reduce a birefringence of the integrated optical component.