Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

To suppress occurrence of flare and ghost while reducing the size or height of an imaging apparatus. The imaging apparatus is configured by mounting a cover structure on a solid-state imaging element. The solid-state imaging element generates a pixel signal by photoelectric conversion according to a light amount of incident light. The cover structure includes a non-flat surface for focusing incident light on a light receiving surface of the solid-state imaging element. The non-flat surface of the cover structure may have either a concave shape or a convex shape. It is assumed that the cover structure includes an inorganic material such as glass, silicon, or germanium.

An imaging module includes an imager having an optical member on a light receiving surface, an electronic component having a front surface facing the same direction as the one to which an incidence surface of the optical member faces, a resin portion that has a first surface flush with the incidence surface of the optical member and the front surface of the electronic component, and a second surface that is a surface on a side opposite to the first surface while having the imager and the electronic component being embedded therein such that the incidence surface and the front surface are exposed to the first surface, an external connection terminal provided on the second surface, and a through wiring that extends through the resin portion to connect at least one of the imager and the electronic component with the external connection terminal.

There is provided a camera module including a first lens substrate having a light-incident side. The first lens substrate includes a lens disposed at an inner side of a through-hole of the first lens substrate, and a wiring layer disposed at an opposite side of the light-incident side of the first lens substrate. The camera module may include an imaging element including a pixel array disposed at a light-incident side of a substrate, where the imaging element is electrically connected to the wiring layer of the first lens substrate, and where a width of the imaging element in a direction parallel to the light-incident surface of the imaging element is smaller than a width of the first lens substrate in the direction parallel to the light-incident surface of the first lens substrate.

The present disclosure relates to a stacked lens structure and a method of manufacturing the same, and an electronic apparatus by which it is possible to realize miniaturization of a lens module. A stacked lens structure includes plural substrates with lens stacked on one another, the substrate with lens each having a lens disposed on inside of a through-hole formed in the substrate. In regard of side surfaces at side parts corresponding to sides of a rectangle surrounding the substrate with lens in plan view as viewed in an optical axis direction, a width and a shape are the same among all the substrates with lens, whereas in regard of side surfaces at opposite angle parts corresponding to opposite angles of the rectangle, the width or shape differs between at least two substrates with lens. The present technology is applicable, for example, to a lens module or the like.

A meta lens assembly includes a first meta lens, a second meta lens arranged on an image side of the first meta lens, and a third meta lens arranged on an image side of the second meta lens, the first meta lens, the second meta lens, and the third meta lens being arranged from an object side of the meta lens assembly to an image side of the meta lens assembly facing an image sensor.

A wafer-level liquid-crystal-on-silicon (LCOS) projection assembly includes a LCOS display for spatially modulating light incident on the LCOS display and a polarizing beam-separating (PBS) layer for directing light to and from the LCOS display. A method for fabricating a LCOS projection system includes disposing a PBS wafer above an active-matrix wafer. The active-matrix wafer includes a plurality of active matrices for addressing liquid crystal display pixels. The method, further includes disposing a lens wafer above the PBS wafer. The lens wafer includes a plurality of lenses. Additionally, a method for fabricating a wafer-level polarizing beam includes bonding a PBS wafer and at least one other wafer to form a stacked wafer. The PBS wafer includes a PBS layer that contains a plurality of PBS film bands.

In the case of a camera module (1) including at least two camera functional units (2, 3, 4, 5, 22) arranged one behind another in a stack arrangement, it is provided to form the camera functional units (2, 3, 4, 5, 22) on a common main body (11), wherein the camera functional units (2, 3, 4, 5, 22) are aligned with respect to one another in the use position by a folding or bending process.

Certain aspects relate to wafer level optical designs for a folded optic stereoscopic imaging system. One example folded optical path includes first and second reflective surfaces defining first, second, and third optical axes, and where the first reflective surface redirects light from the first optical axis to the second optical axis and where the second reflective surface redirects light from the second optical axis to the third optical axis. Such an example folded optical path further includes wafer-level optical stacks providing ten lens surfaces distributed along the first and second optical axes. A variation on the example folded optical path includes a prism having the first reflective surface, wherein plastic lenses are formed in or secured to the input and output surfaces of the prism in place of two of the wafer-level optical stacks.