A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

An optical power prism that may be used in folded lens systems that consists of a glass prism and a glass lens attached to a surface of the prism using a thin layer of optical glue or by optical contact. The glass lens does not have a flange and thus the prism can be smaller than prisms used in conventional power prisms with the same lens effective area, thus reducing the Z-height of the power prism when compared to conventional power prisms. An optical glass may be used for the lens that has a higher refractive index than can be provided by optical plastic which allows the lens to be thinner than plastic lenses. The lenses may be formed by molding a glass wafer to form lens shapes on a first surface of the wafer; the molded wafer is then ground from a second surface to singulate the lenses.

An optical power prism that may be used in folded lens systems that consists of a glass prism and a glass lens attached to a surface of the prism using a thin layer of optical glue or by optical contact. The glass lens does not have a flange and thus the prism can be smaller than prisms used in conventional power prisms with the same lens effective area, thus reducing the Z-height of the power prism when compared to conventional power prisms. An optical glass may be used for the lens that has a higher refractive index than can be provided by optical plastic which allows the lens to be thinner than plastic lenses. The lenses may be formed by molding a glass wafer to form lens shapes on a first surface of the wafer; the molded wafer is then ground from a second surface to singulate the lenses.

A method for assembling an optical lens includes preparing a first lenses part including a first lens and a second lenses part including a second lens, capturing the first lenses part, and adjusting a posture of the first lenses part according to a distance measurement result, so that an included angle between a first end surface of the first lenses part and a second end surface of the second lenses part is less than a threshold of inclination angle. The method also includes adjusting the first lenses part at degree of freedom of linear movement to complete pre-positioning, performing an active alignment of a position of the first lenses part at the degree of freedom of linear movement according to an actual imaging result, and fixing the first and second lenses parts together, so that their relative positions are maintained at the relative positions determined by the active alignment.

A camera module includes a circuit board; an image sensor mounted on the circuit board and electrically connected with the circuit boards, the image sensor comprising an array of focal planes; a barrel mounted on the circuit board with a cavity formed between the barrel and the circuit board, the image sensor being received in the cavity; and a lens stack array mounted to the barrel and spaced from the image sensor, the lens stack array comprising a plurality of first lens stacks, second lens stacks, third lens stacks, each of the lens stacks corresponding to one of the focal planes. The first lens stacks, the second lens stacks and the third lens stacks have different field of view and are combined in a single camera module, which enables a compact solution in a form of single camera module that traditionally requires multiple camera modules.

The present disclosure relates to a solid-state imaging device and electronic equipment that enable improvement of image quality of a captured image. In the solid-state imaging device, two or more photoelectric conversion layers including a photoelectric converter and a charge detector are laminated. The solid-state imaging device is configured to include a state in which light having entered one pixel of a first photoelectric conversion layer closer to an optical lens is received by the photoelectric converter of a plurality of pixels of the second photoelectric conversion layer farther from the optical lens. The technology of the present disclosure can be applied to, for example, a solid-state imaging device that performs imaging.

A method of manufacturing a plurality of optical elements (140), the method comprising providing a first wafer (120) having hardened replication material forming optical elements (140) on a first side of the first wafer (120), providing a second wafer (121) having hardened replication material forming optical elements (140) on a first side of the second wafer (121), depositing liquid droplets (180) on the first side of the first wafer (120) between the optical elements (140) aligning the first side of the first wafer (120) with the first side of the second wafer (121), and bringing the two wafers (120, 121) together such that the liquid droplets (180) on the first side of the first wafer (120) adhere to the first side of the second wafer (121).

The present disclosure relates to a camera package, a method for manufacturing a camera package, and an electronic device with which it is possible to reduce manufacturing cost for lens formation.

The camera package according to the present disclosure includes: a solid-state imaging element; and a lens formed above a transparent substrate that protects the solid-state imaging element. A lens formation region in which the lens is formed above the transparent substrate and a lens free region around the lens formation region differ in contact angle. The present disclosure can be applied to, for example, a camera package in which a lens is disposed above a solid-state imaging element, or the like.

A microlens array-based ultrathin microscope is provided. The microlens array-based ultrathin microscope includes a filter unit configured to selectively transmit fluorescence manifested in a measurement sample, and an image unit configured to acquire an image from light transmitted by the filter unit. The filter unit is formed to be in contact with or spaced apart from one surface of a transparent substrate, and the image unit includes a microlens array formed on an opposite surface to the transparent substrate in which the filter unit is formed, and an image sensor configured to collect image information of the microlens array.

An example optical substrate, according to aspects of the present disclosure, includes a support structure, a plurality of optical components, and a plurality of flexures. Each flexure is engaged with the support structure and a respective optical component for allowing independent lateral movements of the optical components during assembly of the optical substrate with another layer of an optical assembly.