A manufacturing method of an image pickup apparatus for endoscope includes: manufacturing two optical wafers each of which has a glass wafer as a base substrate and is a hybrid lens wafer including a plurality of resin lenses, and a spacer wafer including a plurality of spacers and being formed with an inorganic material; manufacturing a bonded wafer in which space in which the plurality of resin lenses are disposed is hermetically sealed by directly bonding the two optical wafers and the spacer wafer at a temperature lower than a softening point of the plurality of resin lenses; disposing a plurality of image pickup members on the bonded wafer; and cutting the bonded wafer on which the plurality of image pickup members are disposed.

An optical element including a substrate, a first optical film and a second optical film. The first optical film and the second optical film are disposed on at least one side of the substrate and are both formed on the substrate. The first optical film has a first surface facing away from the substrate and a plurality of first optical microstructures disposed on the first surface. The second optical film has a second surface facing away from the substrate and a plurality of second optical microstructures disposed on the second surface. The orthogonal projection of the first optical microstructures on the substrate does not overlap the orthogonal projection of the second optical microstructures on the substrate. A wafer level optical module adopting the optical element is also provided.

Techniques for facilitating wide field of view (FOV) imaging systems and methods are provided. In one example, an imaging device includes a lens system including a first lens group and a second lens group. The first lens group includes at least one spherical lens element and is associated with a first FOV. The first lens group is configured to transmit electromagnetic radiation associated with a scene. The second lens group includes wafer level optics aspherical lens elements and is associated with a second FOV narrower than the first FOV. The second lens group is configured to transmit the electromagnetic radiation received from the first lens group. The imaging device further includes a detector array including detectors. Each detector is configured to receive a portion of the electromagnetic radiation from the lens system and generate a thermal image based on the electromagnetic radiation. Related methods and systems are also provided.

The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.

An ultrathin camera device is provided. The ultrathin camera device comprises an optical module including a microlens array in which microlenses are arranged, an image sensor that outputs electrical image signals by sensing light coming through the microlens array, spacers that form a focal length by separating the optical module from the image sensor, and a processor that outputs a final image by reconstructing array images generated from the image signals with a designated imaging process depending on a distance at which the object is located. Here, each microlens convexly protrudes toward the image sensor.

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

The present disclosure describes optical and optoelectronic assemblies that, in some cases, include screen-printed micro-spacers, as well as methods for manufacturing such assemblies and modules. For example, an optoelectronic device mounted on a substrate can include an optical sub-assembly including a first optical element and a first micro-spacer on the optical element. The optical sub-assembly can be disposed over the optoelectronic device, with a first air or vacuum gap separating the first optical element from the optoelectronic device, and the first micro-spacer laterally surrounding the first air or vacuum gap.

The present technology relates to a camera module, a method of manufacturing the same, and an electronic apparatus capable of suppressing generation of a ghost or a flare. The camera module includes an image sensor, a lens unit that is provided on a light receiving surface of the image sensor, and at least one refractive index adjustment layer that is formed between the image sensor and the lens unit. The present technology can be applied to, for example, a camera module including a complementary metal oxide semiconductor (CMOS) image sensor.

Manufacturing an imaging apparatus including, in an imaging lens optical system, a function to correct aberration is facilitated. A meta-lens and an imaging element constituting the imaging apparatus are formed by a semiconductor process. The meta-lens corrects aberration in the imaging lens optical system. The imaging element images incident light incident via the imaging lens optical system. The meta-lens may be formed inside the imaging element or on a surface of the imaging element or may be formed as a part of a wafer level chip size package.

The present invention provides a lens substrate stacking position calculating apparatus capable of calculating a stacking position at which the number of lens sets whose optical axis deviation falls within an allowable range is maximized, when a plurality of wafer lens arrays are bonded together even if the position of each lens formed on a wafer substrate is deviated between wafer lens arrays to be stacked. The lens substrate stacking position calculating apparatus calculates the positional relationship of two or more transparent substrates to be stacked when the two or more transparent substrates on which a plurality of lenses are two-dimensionally arranged are stacked to form a plurality of lens sets each including two or more lenses. A position of each lens is specified in advance in a common coordinate system.