G03F1/64

Pellicle, exposure original plate, exposure device, and semiconductor device manufacturing method

A pellicle for EUV exposure that has a high transmittance to EUV light, causes little outgassing, and is not much contaminated, and a method for manufacturing the same are provided. A pellicle (100) includes a pellicle film (101); a support frame (103); and a first adhesive layer (109) provided at an end of the support frame, the end being opposite to an end on which the pellicle film is extended. The pellicle further includes an inorganic layer (111) on a side surface of the first adhesive layer, the side surface extending in a direction crossing a surface of the pellicle film, and the pellicle film being extended on the side surface. The inorganic layer has a mass absorption coefficient (μ.sub.m) in the range of 5×10.sup.3 cm.sup.2/g to 2×10.sup.5 cm2/g.

Pellicle holder, pellicle inspection apparatus, and pellicle inspection method

Provided is a pellicle holder. The pellicle holder includes: an outer frame formed therein with a pellicle seating space; and a plurality of holding legs extending in a direction from the outer frame toward a center of the pellicle seating space, wherein the holding leg is extended or contracted in the extension direction and has one end on which a portion of a pellicle is mounted to support the pellicle.

Pellicle holder, pellicle inspection apparatus, and pellicle inspection method

Provided is a pellicle holder. The pellicle holder includes: an outer frame formed therein with a pellicle seating space; and a plurality of holding legs extending in a direction from the outer frame toward a center of the pellicle seating space, wherein the holding leg is extended or contracted in the extension direction and has one end on which a portion of a pellicle is mounted to support the pellicle.

APPARATUS FOR POSITIONING AND CLAMPED CURING

An apparatus including: a first gripping member having a first magnetic element and moveable between a first position and a second position; a first biasing member configured to bias the first gripping member toward the first position; and a second magnetic element selectively operable in a first mode, in which the second magnetic element interacts with the first magnetic element to overcome the first biasing member and move the first gripping member to the second position, and a second mode, in which the second magnetic element does not overcome the first biasing member such that the first gripping member rests in the first position.

APPARATUS FOR POSITIONING AND CLAMPED CURING

An apparatus including: a first gripping member having a first magnetic element and moveable between a first position and a second position; a first biasing member configured to bias the first gripping member toward the first position; and a second magnetic element selectively operable in a first mode, in which the second magnetic element interacts with the first magnetic element to overcome the first biasing member and move the first gripping member to the second position, and a second mode, in which the second magnetic element does not overcome the first biasing member such that the first gripping member rests in the first position.

Method for manufacturing of pellicle
11119402 · 2021-09-14 · ·

A method for manufacturing of a pellicle that can simplify the manufacturing process is provided. The method for manufacturing of a pellicle comprises a step for forming a SiC film on a bottom surface of a Si substrate, a step for bonding a supporting member including a through hole to a bottom surface of the SiC film, and a step for removing the Si substrate, after bonding the supporting member.

Method for manufacturing of pellicle
11119402 · 2021-09-14 · ·

A method for manufacturing of a pellicle that can simplify the manufacturing process is provided. The method for manufacturing of a pellicle comprises a step for forming a SiC film on a bottom surface of a Si substrate, a step for bonding a supporting member including a through hole to a bottom surface of the SiC film, and a step for removing the Si substrate, after bonding the supporting member.

PELLICLE
20210286257 · 2021-09-16 · ·

A pellicle characterized by having an amount of released aqueous gas of 1×10.sup.−3 Pa.Math.L/s or less per pellicle, an amount of released hydrocarbon-based gas of 1×10.sup.−5 Pa.Math.L/s or less per pellicle in a range of measured mass number of 45 to 100 amu, and an amount of released hydrocarbon-based gas of 4×10.sup.−7 Pa.Math.L/s or less per pellicle in a range of measured mass number of 101 to 200 amu, under vacuum after the pellicle has been left to stand for 10 minutes in an atmosphere of 23° C. and 1×10.sup.−3 Pa or less.

PELLICLE
20210286257 · 2021-09-16 · ·

A pellicle characterized by having an amount of released aqueous gas of 1×10.sup.−3 Pa.Math.L/s or less per pellicle, an amount of released hydrocarbon-based gas of 1×10.sup.−5 Pa.Math.L/s or less per pellicle in a range of measured mass number of 45 to 100 amu, and an amount of released hydrocarbon-based gas of 4×10.sup.−7 Pa.Math.L/s or less per pellicle in a range of measured mass number of 101 to 200 amu, under vacuum after the pellicle has been left to stand for 10 minutes in an atmosphere of 23° C. and 1×10.sup.−3 Pa or less.

PELLICLE AND PELLICLE ASSEMBLY

A pellicle suitable for use with a patterning device for a lithographic apparatus. The pellicle comprising at least one breakage region which is configured to preferentially break, during normal use in a lithographic apparatus, prior to breakage of remaining regions of the pellicle. At least one breakage region comprises a region of the pellicle which has a reduced thickness when compared to surrounding regions of the pellicle.