A chemically amplified resist material comprises a polymer component that is capable of being made soluble or insoluble in a developer solution by an action of an acid, and a generative component that is capable of generating a radiation-sensitive sensitizer and an acid upon an exposure. The radiation-sensitive acid generating agent included in the generative component comprises a compound represented by the formula (B). R.sup.B3 and R.sup.B4 each independently represent a monovalent organic group, or taken together represent a cyclic structure together with the OCO. At least one of R.sup.B3 and R.sup.B4 comprises a halogen atom, a nitro group, a cyano group, a formyl group, a carbonyl group, a carboxy group, a sulfo group, a sulfonyl group or a combination thereof, or the cyclic structure having 4 to 30 ring atoms is a spiro cyclic structure, a fused cyclic structure or a bridged cyclic structure. ##STR00001##

A chemically amplified resist material comprises a polymer component that is capable of being made soluble or insoluble in a developer solution by an action of an acid, and a generative component that is capable of generating a radiation-sensitive sensitizer and an acid upon an exposure. The radiation-sensitive acid generating agent included in the generative component comprises a compound represented by the formula (B). R.sup.B3 and R.sup.B4 each independently represent a monovalent organic group, or taken together represent a cyclic structure together with the OCO. At least one of R.sup.B3 and R.sup.B4 comprises a halogen atom, a nitro group, a cyano group, a formyl group, a carbonyl group, a carboxy group, a sulfo group, a sulfonyl group or a combination thereof, or the cyclic structure having 4 to 30 ring atoms is a spiro cyclic structure, a fused cyclic structure or a bridged cyclic structure. ##STR00001##

According to various embodiments, systems, methods, and computer program products for click-chemistry compatible structures, additive manufacturing resins for forming the same, and method of formation of such structures and resins, as well as techniques for functionalizing click-chemistry compatible structures are disclosed. The inventive structures generally include a plurality of photo polymerized molecules structurally arranged according to a three-dimensional pattern, while surfaces of the structure are functionalized with one or more click-chemistry compatible molecules each having one or more click-chemistry compatible functional groups. The structures may be formed from single- or dual-component resins, each having unique synthetic pathways. The resulting structures may be functionalized for utility in a wide range of applications by leveraging click chemistry to further functionalize the structure with organic additives also compatible with click-chemistry reaction schemes.

According to various embodiments, systems, methods, and computer program products for click-chemistry compatible structures, additive manufacturing resins for forming the same, and method of formation of such structures and resins, as well as techniques for functionalizing click-chemistry compatible structures are disclosed. The inventive structures generally include a plurality of photo polymerized molecules structurally arranged according to a three-dimensional pattern, while surfaces of the structure are functionalized with one or more click-chemistry compatible molecules each having one or more click-chemistry compatible functional groups. The structures may be formed from single- or dual-component resins, each having unique synthetic pathways. The resulting structures may be functionalized for utility in a wide range of applications by leveraging click chemistry to further functionalize the structure with organic additives also compatible with click-chemistry reaction schemes.

According to several embodiments, a composition of matter includes: a three-dimensional structure comprising photo polymerized molecules. At least some of the photo polymerized molecules further comprise one or more protected click-chemistry compatible functional groups; and at least portions of one or more surfaces of the three-dimensional structure are functionalized with one or more of the protected click-chemistry compatible functional groups. An additive manufacturing resin suitable for fabricating a click-chemistry compatible composition of matter includes: a photo polymerizable compound; and a click-chemistry compatible compound. A method of forming an additive manufacturing resin suitable for fabricating a click-chemistry compatible composition of matter includes: reacting a compound comprising a terminal alkyne group or a terminal azide group with a protecting reagent to form a protected reactive diluent precursor, reacting the precursor with a compound to form a protected reactive diluent; and mixing the protected reactive diluent with a photo polymerizable compound.

According to several embodiments, a composition of matter includes: a three-dimensional structure comprising photo polymerized molecules. At least some of the photo polymerized molecules further comprise one or more protected click-chemistry compatible functional groups; and at least portions of one or more surfaces of the three-dimensional structure are functionalized with one or more of the protected click-chemistry compatible functional groups. An additive manufacturing resin suitable for fabricating a click-chemistry compatible composition of matter includes: a photo polymerizable compound; and a click-chemistry compatible compound. A method of forming an additive manufacturing resin suitable for fabricating a click-chemistry compatible composition of matter includes: reacting a compound comprising a terminal alkyne group or a terminal azide group with a protecting reagent to form a protected reactive diluent precursor, reacting the precursor with a compound to form a protected reactive diluent; and mixing the protected reactive diluent with a photo polymerizable compound.

A resist underlayer film-forming composition improves an ability to fill patterns during baking by improving heat-reflowability of a polymer; a resist underlayer film being a baked product of a coating film formed from the resist underlayer film-forming composition; and a method for producing a semiconductor device includes a step of forming the resist underlayer film. The resist underlayer film-forming composition includes a compound of the following formula (A) or (B) and a solvent.

##STR00001##

A resist underlayer film-forming composition improves an ability to fill patterns during baking by improving heat-reflowability of a polymer; a resist underlayer film being a baked product of a coating film formed from the resist underlayer film-forming composition; and a method for producing a semiconductor device includes a step of forming the resist underlayer film. The resist underlayer film-forming composition includes a compound of the following formula (A) or (B) and a solvent.

##STR00001##

A resist underlayer film-forming composition has excellent embedding and flattening properties for stepped substrates, excellent storage stability, low film-curing start temperature and small amount of sublimate generation, and can form a film that does not dissolve in photoresist solvents. The composition contains: a thermal acid generator; a Novolac resin polymer in which (i) a unit structure having an aromatic ring optionally having a substituent and (ii) a unit structure containing an aromatic cyclic organic group optionally having a substituent, a non-aromatic monocyclic organic group optionally having a substituent, or a 4to 25-membered bicyclic, tricyclic, or tetracyclic organic group containing at least one non-aromatic monocyclic ring and optionally having a substituent are bonded via a covalent bond between carbon atoms on the aromatic ring of (i) and the non-aromatic monocyclic ring of (ii); and a solvent.

A resist underlayer film-forming composition has excellent embedding and flattening properties for stepped substrates, excellent storage stability, low film-curing start temperature and small amount of sublimate generation, and can form a film that does not dissolve in photoresist solvents. The composition contains: a thermal acid generator; a Novolac resin polymer in which (i) a unit structure having an aromatic ring optionally having a substituent and (ii) a unit structure containing an aromatic cyclic organic group optionally having a substituent, a non-aromatic monocyclic organic group optionally having a substituent, or a 4to 25-membered bicyclic, tricyclic, or tetracyclic organic group containing at least one non-aromatic monocyclic ring and optionally having a substituent are bonded via a covalent bond between carbon atoms on the aromatic ring of (i) and the non-aromatic monocyclic ring of (ii); and a solvent.