Disclosed is a method for manufacturing a horological component according to which a silicon-based piece having the desired shape of the horological component is produced and the piece is subjected to a thermal oxidation and deoxidation treatment to remove a predetermined thickness of silicon in order to increase the mechanical strength of the piece. This method is characterized in that the thermal oxidation and deoxidation treatment is carried out in several steps, each step including a thermal oxidation phase followed by a deoxidation phase.

The present invention is directed to a permanent photoimageable compositions and the cured products thereof useful for making negative-tone, permanent photoresist relief patterns on low surface energy polymer substrates, comprising: (A) one or more alkali soluble, film forming resins or one or more film forming resins that become soluble in alkali solutions by action of an acid, (B) one or more cationic photoinitiators, (C) one or more film casting solvents, and (D) one or more fluorinated compounds. The present invention is also directed to methods of forming a permanent photoresist relief pattern on a low surface energy polymer substrate using the disclosed compositions.

The present invention provides a method for covering a substrate, and includes the following operations: (a) admixing at least four different silane monomers and at least one bi-silane to a first solvent(s) to form a mixture, with the proviso that at least one of the silane monomers or the bi-silane comprises an active group capable of achieving cross-linking to adjacent siloxane polymer chains of the siloxane polymer composition; (b) subjecting the mixture to an acid treatment so that the silane monomers are at least partially hydrolysed, and the hydrolysed silane monomers, the silane monomers and the bi-silane are at least partially polymerized and cross-linked; (c) optionally changing the first solvent to a second solvent; and (d) subjecting the mixture to further cross-linking of the siloxane polymer to achieve a predetermined degree of cross-linking, depositing the siloxane polymer composition on the substrate, and optionally curing the deposited siloxane polymer composition.

The present invention provides a method for covering a substrate, and includes the following operations: (a) admixing at least four different silane monomers and at least one bi-silane to a first solvent(s) to form a mixture, with the proviso that at least one of the silane monomers or the bi-silane comprises an active group capable of achieving cross-linking to adjacent siloxane polymer chains of the siloxane polymer composition; (b) subjecting the mixture to an acid treatment so that the silane monomers are at least partially hydrolysed, and the hydrolysed silane monomers, the silane monomers and the bi-silane are at least partially polymerized and cross-linked; (c) optionally changing the first solvent to a second solvent; and (d) subjecting the mixture to further cross-linking of the siloxane polymer to achieve a predetermined degree of cross-linking, depositing the siloxane polymer composition on the substrate, and optionally curing the deposited siloxane polymer composition.

A composition for forming an organic film contains a polymer having a partial structure shown by the following general formula (1) as a repeating unit, and an organic solvent. Each of AR1 and AR2 represents a benzene ring or naphthalene ring which optionally have a substituent; W.sub.1 represents a particular partial structure having a triple bond, and the polymer optionally contains two or more kinds of W.sub.1; and W.sub.2 represents a divalent organic group having 6 to 80 carbon atoms and at least one aromatic ring. This invention provides: a polymer curable even under film formation conditions in an inert gas and capable of forming an organic film which has not only excellent heat resistance and properties of filling and planarizing a pattern formed in a substrate, but also favorable film formability onto a substrate with less sublimation product; and a composition for forming an organic film, containing the polymer. ##STR00001##

A composition for resist underlayer film formation, includes: a polysiloxane compound including a first structural unit represented by formula (1); and a solvent. X represents an organic group comprising at least one structure selected from the group consisting of a hydroxy group, a carbonyl group, and an ether bond; a is an integer of 1 to 3, wherein in a case in which a is no less than 2, a plurality of Xs are identical or different from each other; R.sup.1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms, wherein is a group other than X; and b is an integer of 0 to 2, wherein in a case in which b is 2, two R.sup.1s are identical or different from each other, and wherein a sum of a and b is no greater than 3.

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To provide a negative type photosensitive composition curable at a low temperature and capable of forming a cured film excellent in transparency, in chemical resistance and in environmental durability, and also to provide a pattern-formation method employing the composition. [Means] The present invention provides a negative type photosensitive composition comprising: an alkali-soluble resin, a compound having two or more (meth)acryloyloxy groups, a polysiloxane, a polymerization initiator, and a solvent. The alkali-soluble resin is a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit.

To provide a negative type photosensitive composition curable at a low temperature and capable of forming a cured film excellent in transparency, in chemical resistance and in environmental durability, and also to provide a pattern-formation method employing the composition. [Means] The present invention provides a negative type photosensitive composition comprising: an alkali-soluble resin, a compound having two or more (meth)acryloyloxy groups, a polysiloxane, a polymerization initiator, and a solvent. The alkali-soluble resin is a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit.

Provided are a coating composition for producing an interlayer insulation film, the coating composition making it possible to produce an interlayer insulation film patterned and having a high Young’s modulus and a low relative dielectric constant in high throughput, a method for producing the interlayer insulation film, and a semiconductor element including the interlayer insulation film. Specifically, the coating composition for producing the interlayer insulation film includes: a polymerizable compound (A) being a polymerizable silicon compound having two or more polymerizable groups, at least one of the two or more polymerizable groups being a polymerizable group Q expressed by *-O-R-Y (wherein * represents a bond with a silicon atom, R represents a single bond, an unsubstituted or substituted alkylene group having 1 to 12 carbon atoms and optionally containing a heteroatom, or a phenylene group, and Y represents a polymerizable group); and a photopolymerization initiator (B).

An organic film forming composition, containing: a material shown by formula (I) and/or (II); and an organic solvent, where R.sub.1 and R.sub.4 each represent a hydrogen atom, an allyl or propargyl group, R.sub.2 and R.sub.5 each represent a substituent, R.sub.3 and R.sub.6 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkynyl group having 2 to 4 carbon atoms, or an alkenyl group having 2 to 4 carbon atoms. “m” and “i” represent 0 or 1, “k” and “q” represent an integer of 0 to 2, “n” represent 1 or 2, “h”, and “j” represent an integer of 0 to 2 and satisfy the relationship 1≤h+j≤4, and “1” and “r” represent 0 or 1. W represents a single bond or divalent group shown by formulae (3). Each V independently represents a hydrogen atom or linking moiety.

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