A lift pin assembly includes a lift pin having a first longitudinal axis substantially parallel with a first direction, a pin connection block combined with a lower end portion of the lift pin and including a first guide recess in a lower end portion of the pin connection block, the first guide recess extending in a second direction substantially perpendicular to the first direction, and a lift pin holder having a second longitudinal axis substantially parallel with the first direction and including a first sliding portion to be received movably in the second direction within the first guide recess by an eccentricity distance of the second longitudinal axis from the first longitudinal axis when the lift pin holder is connected to the lower end portion of the pin connection block.

An exposure method and apparatus expose a substrate with illumination light via a projection optical system and a liquid of a liquid immersion area formed under the projection optical system. A second stage on which the substrate is held and a third stage are relatively moved, based on outer periphery positional information of the second stage, in order to cause the second stage to come close, from one side in a first direction, to the third stage that faces the projection optical system. The second and third stages that have come close together are moved from the one side to an other side in the first direction with respect to the projection optical system to place the second stage to face the projection optical system instead of the third stage while substantially maintaining the liquid immersion area under the projection optical system.

The invention relates to a method for detecting the position of a mask holder for photolithographic masks, said method including the following steps: positioning the mask holder with the mask on a measuring table of a measurement apparatus, measuring the mask holder by use of an algorithm, storing the absolute position of the mask holder on the measuring table, and recording and storing at least one reference image.

The present invention provides a conveyance hand for holding a conveyed object, the conveyance hand including a base, a pad configured to suction the conveyed object, and a first elastic member fixed to the base and configured to support the pad, wherein the first elastic member includes three or more support units each configured to support the pad, and is configured so that a rigidity in a vertical direction is lower than a rigidity in a horizontal direction such that the pad conforms to a shape of the conveyed object.

A metrology system includes a timing estimator, a sensor, and a position estimator. The timing estimator receives a control signal transmitted at a first timing of a first control loop and estimates a second timing at which the control signal is transmitted in a second control loop subsequent to the first control loop. The sensor senses position information of a wafer. The position estimator estimates the position information of the wafer at the estimated second timing based on the sensed position information of the wafer and outputs the estimated position information of the wafer based on a position request signal.

A piezoelectric positioning device (1) has at least one piezoelectric actuator (3) having a first connection contact (4) and a second connection contact (5). A control device (6) with digital/analog converters (12, 16) connected to the connection contacts (4, 5) is used to control the at least one piezoelectric actuator (3). In comparison with a coarse converter (12), a fine converter (16) has a comparatively smaller voltage range and lower voltage levels, with the result that a high degree of positioning accuracy can be achieved.

A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of a thin film stack forming an electronic component. The planarization layer is of substantially uniform thickness and/or its outer surface has a peak to valley distance of less than 10 m. The planarization layer may be formed by applying two solutions of different concentration. A surface treatment may be applied to the burls to repel a solution of the planarization layer material.

A lithographic apparatus includes an illumination system to illuminate a pattern of a patterning device, a projection system to project an image of the pattern onto a substrate, a movable stage to support the patterning device or the substrate, a slotted object, and a locking device (700) to prevent a motion of the movable stage. The locking device comprises an actuator (702) and a wheel device (704) comprising a ring feature (708) and coupled to the actuator. The actuator rotates the wheel device about a rotation axis (706). The ring feature has a width (710) defined parallel to the rotation axis. The width is variable with respect to azimuthal direction of the wheel device. The ring feature engages a slot of the slotted object. The rotating adjusts the width of the ring feature within the slot such that a relative motion between the device and the slotted object is prevented.

An arrangement apparatus includes a stage, an arrangement part, and a control part. The stage supports a substrate. The arrangement part holds a die and arranges multiple dies on the substrate supported by the stage. The control part has a map data indicating arrangement positions of the dies and generated based on a positional relationship among patterns formed by an exposure apparatus, and controls, based on the map data, relative positions between the stage and the arrangement part when arranging the dies on the substrate.

A photolithography tool and a method for compensating for surface deformation in a carrier of the photolithography tool are disclosed. In the photolithography tool, carrier surface deformation compensation elements are provided at the bottom of the carrier, which are capable of compensating for the surface deformation in the carrier. In the method, the surface deformation is detected by carrier surface deformation detection modules, and an automated closed-loop controller controls compensating forces exerted by the carrier surface deformation compensation elements based on the detected deformation. This allows more accurate compensation for the carrier surface deformation.