A line voltage thermostat having a multiple heatsink switch. A total switch may have a semiconductor switch mounted on each heatsink of the multiple heatsink switch. The semiconductor switches of the respective heatsinks may be connected in parallel to represent the total switch. Each of the two or more heatsinks, having a semiconductor switch for switching, and in total conveying the same power as one equivalent switch with one total heatsink, may have higher maximum operating temperatures and higher thermal resistances than twice the thermal resistance of the one total heatsink. The two or more heatsinks may be situated within a housing of the line voltage thermostat, and be easier to distribute in the housing to achieve an efficient layout of a display and control buttons for the thermostat.

A line voltage thermostat having a multiple heatsink switch. A total switch may have a semiconductor switch mounted on each heatsink of the multiple heatsink switch. The semiconductor switches of the respective heatsinks may be connected in parallel to represent the total switch. Each of the two or more heatsinks, having a semiconductor switch for switching, and in total conveying the same power as one equivalent switch with one total heatsink, may have higher maximum operating temperatures and higher thermal resistances than twice the thermal resistance of the one total heatsink. The two or more heatsinks may be situated within a housing of the line voltage thermostat, and be easier to distribute in the housing to achieve an efficient layout of a display and control buttons for the thermostat.

A semiconductor package, comprising: a substrate; an analog circuitry that is formed on the substrate; a first heating element that is formed on the substrate; a first temperature sensing element that is formed on the substrate; a first heating control circuitry that is formed on the substrate, the first heating control circuitry being configured to detect whether a first temperature measurement that is taken with the first temperature sensing element is below a first threshold, and turn on the first heating element in response to detecting that the first temperature measurement is below the first threshold, the first heating element being turned on only when the first temperature measurement is below the first threshold; and an encapsulating material configured to encapsulate the substrate, the analog circuitry, the first temperature sensing element, the first heating element, and the first heating control circuitry.

A temperature-controllable human body charging apparatus includes a thermally conductive temperature control unit and a charging unit, where the temperature control unit includes a phase change material, and the temperature control unit is configured to absorb heat released by the charging unit. The charging apparatus can effectively reduce or inhibit the risk of burning organ and tissue in the human body caused by the temperature rise phenomenon of the charging apparatus.

A heating control circuit and a ventilator are provided. The heating control circuit includes a control device and a switching device, an input end of the control device being connected to an alternating-current power source, an output end thereof being connected to a control end of the switching device, and an output end of the switching device is connected to a heating member; and the control device is configured to generate, according to different output voltages of the alternating-current power source, a driving signal for controlling a duty ratio of the switch device to adaptively change, so that the power output from the switching device to the heating member is constant.

A power consumption control method includes acquiring first data. The first data is configured to indicate power consumption information of a grid. The method further includes, in a case where an energy storage device is connected to the grid, regulating a temperature of the energy storage device according to the first data.

An electric drive system includes a power electronics module (PEM) having a DC-link capacitor and an inverter. A controller reduces power output of the inverter while a sensed temperature of an inverter power switch, a sensed current of the PEM, such as a sensed ripple current of the DC-link capacitor, and parameter values of the DC-link capacitor are indicative of a predicted temperature of the capacitor being greater than a threshold to maintain capacitor temperature lower than the threshold. The parameter values are obtainable from a thermal model of the DC-link capacitor. The thermal model may be derived from testing a test version of the PEM under different drive cycles in which for each drive cycle a set of information is recorded including a sensed temperature of the inverter power switch test version, a current of the PEM test version, and a sensed temperature of the DC-link capacitor test version.

A system includes at least one capacitor comprising a dielectric material having a Curie temperature, each capacitor exhibiting an increased capacitance at a temperature below the Curie temperature and exhibiting a decreased capacitance at a temperature above the Curie temperature, a liquid source positioned adjacent to the capacitor and having a temperature above the Curie temperature, and means for exposing the capacitor to the liquid source for a predetermined time so the temperature of the dielectric material exceeds the Curie temperature, at which point the capacitance decreases. A voltage storage is connected to the capacitors to capture the increased voltage discharged from the capacitors. The capacitors are then removed from the liquid source and cooled. The capacitors may iteratively be recharged, exposed to the liquid source until their temperature exceeds the Curie temperature, connected to the voltage storage, removed from the liquid source, and cooled.

A system for modifying controllable elements of a structure based on an array of conditions, particularly a distance of a user or operator from the structure, deviations from an expected travel path to the structure, activities conducted either along or while deviating from the expected travel path, traffic, a core body temperature of the user or operator, and other factors. The controllable structure elements can include, for example, heating and air conditioning (HVAC), alarm, lights, and appliances.

The present invention generally relates to a system and method for high accuracy temperature control of an oven used to operate an electronic device, sensor or resonator (device) at a fixed temperature. The fixed temperature operation may result in high stability and operation accuracy of the devices across varying environment temperature conditions. Specifically, the present invention relates to systems and methods that enable realizing, sensing, and controlling the temperature of an ovenized device with high temperature control, accuracy, relaxed temperature sense, and control electronics requirements.