Methods, systems, and devices for system and method for reading and writing memory management data through a non-volatile cell based register are described. A memory device may include a set of latch units addressable via a set of row lines and a set of column lines. Each latch unit may include a sense amplifier coupled with a first line and a first non-volatile capacitor coupled with the first line and a second line, where the first capacitor is configured to store a charge representing one or more bits. Additionally, each latch unit may include a second capacitor coupled with the first line and a third line, where the second capacitor is configured to amplify a voltage at the first line based on the charge stored in the first capacitor.

A memory device may include at least one multinary memory cell. Each multinary memory cell includes a parallel connection of N sub-bit units. N is an integer greater than 1. Each of the N sub-bit units includes a series connection of a respective transistor and a respective capacitor. A first sub-bit unit includes a first capacitor having a capacitance of C, and each i-th sub-unit includes an i-th capacitor having a capacitance of about 2.sup.i-1×C. A multinary bit having 2.sup.N values may be stored. A device network including multiple multinary logic units is also provided. Each of multiple multinary logic unit includes a parallel connection of N sub-bit units. Each sub-bit unit includes a series connection of a respective transistor and a respective capacitor having capacitance ratios of powers of 2.

The present disclosure relates to circuits, systems, and methods of operation for a memory device. In an example, a memory device includes a plurality of memory cells, each memory cell having a variable impedance that varies in accordance with a respective data value stored therein; and a read circuit configured to read the data value stored within a selected memory cell based upon a variable time delay determination of a signal node voltage change corresponding to the variable impedance of the selected memory cell.

A memory device includes a plurality of memory cells. A first memory cell of the plurality of memory cells includes a first write transistor includes a first write gate, a first write source, and a first write drain. A first read transistor includes first read gate, a first read source, a first read drain, and a first body region separating the first read source from the first read drain. The first read source is coupled to the first write source. A first capacitor has a first upper capacitor plate coupled to the first write drain and a first lower capacitor plate coupled to the first body region of the first read transistor.

A memory device may include at least one multinary memory cell. Each multinary memory cell includes a parallel connection of N sub-bit units. N is an integer greater than 1. Each of the N sub-bit units includes a series connection of a respective transistor and a respective capacitor. A first sub-bit unit includes a first capacitor having a capacitance of C, and each i-th sub-unit includes an i-th capacitor having a capacitance of about 2.sup.i-1×C. A multinary bit having 2.sup.N values may be stored. A device network including multiple multinary logic units is also provided. Each of multiple multinary logic unit includes a parallel connection of N sub-bit units. Each sub-bit unit includes a series connection of a respective transistor and a respective capacitor having capacitance ratios of powers of 2.

The present disclosure describes analog memories for use in a computer, such as a computer using a combination of analog and digital components/elements used in a cohesive manner.

Systems and methods are disclosed including a memory device and a processing device operatively coupled to the memory device. The processing device can perform operations including determining a voltage distribution metric associated with a at least part of a block of the memory device; determining a threshold value for the voltage distribution metric associated with the block; and responsive to determining that the voltage distribution metric exceeds the threshold value, performing a media management operation with respect to the block.

Technologies for a three-dimensional (3D) multi-bit non-volatile dynamic random access memory (nvDRAM) device, which may include a DRAM array having a plurality of DRAM cells with single or dual transistor implementation and a non-volatile memory (NVM) array having a plurality of NVM cells with single or dual transistor implementations, where the DRAM array and the NVM array are arranged by rows of word lines and columns of bit lines. The nvDRAM device may also include one or more of isolation devices coupled between the DRAM array and the NVM array and configured to control connection between the dynamic random access bit lines (BLs) and the non-volatile BLs. The word lines run horizontally and may enable to select one word of memory data, whereas bit lines run vertically and may be connected to storage cells of different memory address.

A semiconductor device storing data as a multilevel potential is provided. The semiconductor device includes a memory cell, first and second reference cells, first and second sense amplifiers, and first to third circuits. The first circuit has a function of outputting, to a first wiring and a third wiring, a first potential corresponding to a first signal output from the memory cell. The second circuit has a function of outputting, to a second wiring, a first reference potential corresponding to a second signal output from the first reference cell. The third circuit has a function of outputting, to the fourth wiring, a second reference potential corresponding to a third signal output from the second reference cell when a second switch is in an off state. The first sense amplifier refers to the first potential and the first reference potential and changes potentials of the first wiring and the second wiring. The second sense amplifier refers to the first potential and the second reference potential and changes potentials of the third wiring and the fourth wiring.

In some examples, a device includes a dielectric material, a ferromagnetic material, and a topological material positioned between the dielectric material and the ferromagnetic material. The device is configured to trap electric charge inside the dielectric material or at an interface of the dielectric material and the topological material. The device is configured to switch a magnetization state of the ferromagnetic material based on a current through the topological material or based on a voltage in the topological material.