In a method of reprogramming data in a nonvolatile memory device including a plurality of pages each of which includes a plurality of memory cells, first page data programmed in a first page is read from among a plurality of page data programmed in the plurality of pages. The plurality of page data have a threshold voltage distribution including a plurality of states. An error correction code (ECC) decoding is performed on the first page data. A reprogram operation is selectively performed on target bits in which an error occurs among a plurality of bits included in the first page data based on a result of performing the ECC decoding on the first page data and a reprogram voltage. The target bits correspond to a first state among the plurality of states. A voltage level of the reprogram voltage is adaptively changed.

A current value for a reference voltage for a block family is determined. An amount of voltage shift for a memory page of the block family is determined based on the current value for the reference voltage and a prior value for the reference voltage. The block family is associated with a first voltage bin or a second voltage bin based on the determined amount of voltage shift. The first voltage bin is associated with a first voltage offset and the second voltage bin is associated with a second voltage offset.

A method includes performing a first read operation involving a set of memory cells using a first voltage, determining a quantity of bits associated with the set of memory cells based on the first read operation, performing a second read operation involving the set of memory cells using a second voltage that is greater than the first voltage when the quantity of bits is above a threshold quantity of bits for the set of memory cells, and performing the second read operation involving the set of memory cells using a third voltage that is less than the first voltage when the quantity of bits is below the threshold quantity of bits for the set of memory cells.

A semiconductor device may include an operation control circuit configured to generate a detection signal based on an internal temperature of the semiconductor device. The semiconductor device may include an error correction circuit configured to output read data as output data with or without performing an error correction operation and with or without performing a scrub operation based on the detection signal.

A system includes a memory device having groups of managed units and a processing device coupled to the memory device. The processing device, during power on of the memory device, causes a read operation to be performed at a subset of a group of managed units and determines a bit error rate related to data read from the subset of the group of managed units. The bit error rate is a directional bit error rate resulting from an erroneously determined state compared to a programmed state that transitions between two opposing states. In response to the bit error rate satisfying a threshold criterion, the processing device causes a rewrite of the data stored at the group of managed units.

A magnetoresistive random access memory (MRAM) device is provided. The MRAM device includes a main magnetic tunnel junction (MTJ) array comprising a plurality of memory cells configured to store memory data and a reference MTJ array comprising a plurality of reference cells having MTJ structures. The MRAM device further includes a controller operatively associated with the main MTJ array and the reference MTJ array. The controller is configured to receive a gross resistance of the reference MTJ array being related to a strength of an external magnetic field, determine whether the external magnetic field is fatal based on the received gross resistance of the reference MTJ array and a pre-determined threshold, and provide notification indicating that the memory data stored in the main MTJ array is untrustworthy if it is determined that the external magnetic field around the MRAM device is fatal.

Several embodiments of systems incorporating memory devices are disclosed herein. In one embodiment, a memory device can include a controller and a memory component operably coupled to the controller. The controller can include a memory manager, a quality metrics first in first out (FIFO) circuit, and an error correction code (ECC) decoder. In some embodiments, the ECC decoder can generate quality metrics relating to one or more codewords saved in the memory component and read into the controller. In these and other embodiments, the ECC decoder can stream the quality metrics to the quality metrics FIFO circuit, and the quality metrics FIFO circuit can stream the quality metrics to the memory manager. In some embodiments, the memory manager can save all or a subset of the quality metrics in the memory component and/or can use the quality metrics in post-processing, such as in error avoidance operations of the memory device.

Described herein are embodiments related to defect detection in memory components of memory systems with time-varying bit error rate. A processing device determines that a bit error rate (BER) corresponding to a read operation to read a unit of data in a memory component satisfies a threshold criterion, determines a write-to-read (W2R) delay for the read operation, wherein the W2R delay comprises a difference between a time of the read operation and a write timestamp indicating when the unit of data was written to the memory component, and determines whether the W2R delay is within a W2R delay range corresponding to an initial read voltage level used by the read operation to read the unit of data. The processing device initiates a defect detection operation responsive to the W2R delay being within the W2R delay range, the defect detection operation to detect time-varying defects in the memory component.

According to one embodiment, a memory system includes: a first memory cell area where a first memory cell is provided; a second memory cell area where a second memory cell is provided; an ECC circuit which corrects an error of data stored by the first memory cell; and a control circuit which replaces the first memory cell with the second memory cell if the number of times an error is successfully corrected in the first memory cell reaches a first value.

A method of operating a memory device includes; receiving a refresh command, performing a refresh operation on a target row of a bank memory array, and providing status information to a memory controller for an adjacent row, relative to the target row, during a refresh operation period defining a refresh operation performed by the memory device.