A controller controls a semiconductor memory device including a plurality of memory blocks. The controller may include a controller control unit and a storing unit. The controller control unit compares the number of times of a read of an original memory block among the plurality of memory blocks with a predetermined copy generation reference value, determines whether to generate copy data of original data stored in the original memory block, and generates a command corresponding to the determination. The storage unit stores the copy generation reference value and address information about the original memory block.

A method of operating a memory device includes performing a data read operation on at least one victim sub-block within a memory block containing a plurality of sub-blocks therein, in response to an erase command directed to a selected sub-block within the plurality of sub-blocks. Next, a soft program operation is performed on the at least one victim sub-block. This soft programming operation is then followed by an operation to erase the selected sub-block within the plurality of sub-blocks. This operation to erase the selected sub-block may include providing an erase voltage to a bulk region of a substrate on which the memory block extends, and the at least one victim sub-block may be disposed between the selected sub-block and the substrate.

Described herein are embodiments related to first-pass continuous read level calibration (cRLC) operations on memory cells of memory systems. A processing device determines that a first programming pass of a programming operation has been performed on a memory cell of a memory component. The processing device performs a cRLC operation on the memory cell to calibrate a read level threshold between a first first-pass programming distribution and a second first-pass programming distribution before a second programming pass of the programming operation is performed on the memory cell.

Described herein are embodiments related to first-pass dynamic program targeting (DPT) operations on memory cells of memory systems. A processing device determines that a first programming pass of a programming operation has been performed on a memory cell of a memory component. The processing device performs a DPT operation on the memory cell to calibrate a first program-verify (PV) target corresponding to a first first-pass programming distribution and a second PV target corresponding to a second first-pass programming distribution before a second programming pass of the programming operation is performed on the memory cell.

Described herein are embodiments related to first-pass dynamic program targeting (DPT) operations on memory cells of memory systems. A processing device determines that a first programming pass of a programming operation has been performed on a memory cell of a memory component. The processing device performs a DPT operation on the memory cell to calibrate a first program-verify (PV) target corresponding to a first first-pass programming distribution and a second PV target corresponding to a second first-pass programming distribution before a second programming pass of the programming operation is performed on the memory cell.

Described herein are embodiments related to first-pass continuous read level calibration (cRLC) operations on memory cells of memory systems. A processing device determines that a first programming pass of a programming operation has been performed on a memory cell of a memory component. The processing device performs a cRLC operation on the memory cell to calibrate a read level threshold between a first first-pass programming distribution and a second first-pass programming distribution before a second programming pass of the programming operation is performed on the memory cell.

Apparatuses, systems, and methods are disclosed for concurrently programming non-volatile storage cells, such as those of an SLC NAND array. The non-volatile storage cells may be arranged into a first block comprising a first string of storage cells that intersects with a first word line at a first storage cell, a second block comprising a second string of storage cells that intersects with a second word line at a second storage cell, a bit line electrically connectable to the first string and the second string, and controller configured to apply a programming pulse, at an elevated voltage, to the first word line and second word line to concurrently program the first and second storage cells.

Described herein are embodiments related to first-pass continuous read level calibration (cRLC) operations on memory cells of memory systems. A processing device determines that a first programming pass of a programming operation has been performed on a memory cell of a memory component. The processing device then adjusts a read level threshold of the memory cell to be centered between a first programming distribution and a second programming distribution before the second programming pass of the programming operation is performed on the memory cell.

When selectively erasing one sub-block, a control circuit applies, in a first sub-block, a first voltage to bit lines and a source line, and applies a second voltage smaller than the first voltage to the word lines. Then, the control circuit applies a third voltage lower than the first voltage by a certain value to a drain-side select gate line and a source-side select gate line, thereby performing the erase operation in the first sub-block. The control circuit applies, in a second sub-block existing in an identical memory block to the selected sub-block, a fourth voltage substantially identical to the first voltage to the drain side select gate line and the source side select gate line, thereby not performing the erase operation in the second sub-block.

When selectively erasing one sub-block, a control circuit applies, in a first sub-block, a first voltage to bit lines and a source line, and applies a second voltage smaller than the first voltage to the word lines. Then, the control circuit applies a third voltage lower than the first voltage by a certain value to a drain-side select gate line and a source-side select gate line, thereby performing the erase operation in the first sub-block. The control circuit applies, in a second sub-block existing in an identical memory block to the selected sub-block, a fourth voltage substantially identical to the first voltage to the drain side select gate line and the source side select gate line, thereby not performing the erase operation in the second sub-block.