A flow sensor including a fluid flow path, a first sensor configured to determine a first measurement of a thermal diffusivity and/or a viscosity of a fluid in the fluid flow path, a second sensor configured to determine a second measurement of a fluid flow velocity and/or a volumetric flow rate of the fluid in the fluid flow path, and at least one processor configured to adjust the second measurement based on the first measurement. A method including receiving fluid in a fluid flow path of a flow sensor, determining a first measurement of a thermal diffusivity and/or a viscosity of the fluid in the fluid flow path, determining a second measurement of a fluid flow velocity and/or a volumetric flow rate of the fluid in the fluid flow path, and adjusting the second measurement based on the first measurement.

A flow sensor including a fluid flow path, a first sensor configured to determine a first measurement of a thermal diffusivity and/or a viscosity of a fluid in the fluid flow path, a second sensor configured to determine a second measurement of a fluid flow velocity and/or a volumetric flow rate of the fluid in the fluid flow path, and at least one processor configured to adjust the second measurement based on the first measurement. A method including receiving fluid in a fluid flow path of a flow sensor, determining a first measurement of a thermal diffusivity and/or a viscosity of the fluid in the fluid flow path, determining a second measurement of a fluid flow velocity and/or a volumetric flow rate of the fluid in the fluid flow path, and adjusting the second measurement based on the first measurement.

A system and method for monitoring fluid flow in a downhole reservoir, characterized by at least one energy source (1), which simultaneously sends two or more utility pulses. The pulse can be a fast propagating and flow-independent acoustic pulse, a somewhat slower propagating and flow-dependent pressure pulse, a slow propagating heat pulse or a slow-propagating tracer pulse. The energy sources are connected via said pulses, without cable, and at least an upper heat source (1′) is connected to equipment on the surface via a cable (4).

A system and method for monitoring fluid flow in a downhole reservoir, characterized by at least one energy source (1), which simultaneously sends two or more utility pulses. The pulse can be a fast propagating and flow-independent acoustic pulse, a somewhat slower propagating and flow-dependent pressure pulse, a slow propagating heat pulse or a slow-propagating tracer pulse. The energy sources are connected via said pulses, without cable, and at least an upper heat source (1′) is connected to equipment on the surface via a cable (4).

We disclose herein a fluid sensor for sensing a concentration or composition of a fluid, the sensor comprising a semiconductor substrate comprising a first etched portion, a dielectric region located on the semiconductor substrate, wherein the dielectric region comprises a first dielectric membrane located over the first etched portion of the semiconductor substrate, a heating element located within the first dielectric membrane, and a first temperature sensing element spatially separated from the heating element. The fluid sensor further comprises a second temperature sensing element within the dielectric membrane, or the heating element may be further configured to operate as a second temperature sensing element. The separation between the second temperature sensing element and the first temperature sensing element introduces a temperature difference between the second temperature sensing element and the first temperature sensing element, such that a differential signal between the first temperature sensing element and the second temperature sensing element is indicative of the concentration or composition of the fluid based on a thermal conductivity of the fluid.

A method of electronically deriving a conclusion of a condition of slurry flow in a non-vertical conduit having a conduit wall and which contains a slurry to flow or flowing along the conduit is provided.

A method of electronically deriving a conclusion of a condition of slurry flow in a non-vertical conduit having a conduit wall and which contains a slurry to flow or flowing along the conduit is provided.

A thermal flowmeter including a measurement tube that has an inflow port into which a liquid flows and an outflow port that allows the liquid which flows in from the inflow port to flow out, and has an internal flow passage where the liquid flows formed to extend along an axis, and a plurality of detection sections each of which has a heating resistor and a temperature detecting resistor along the axis and is provided at the measurement tube, and a control section that calculates a flow rate of the liquid flowing through the internal flow passage based on signals from the plurality of detection sections, wherein the plurality of detection sections are respectively provided with predetermined intervals left in a circumferential direction with the axis as a center.

A flow sensor including a fluid flow path, a first sensor configured to determine a first measurement of a thermal diffusivity and/or a viscosity of a fluid in the fluid flow path, a second sensor configured to determine a second measurement of a fluid flow velocity and/or a volumetric flow rate of the fluid in the fluid flow path, and at least one processor configured to adjust the second measurement based on the first measurement. A method including receiving fluid in a fluid flow path of a flow sensor, determining a first measurement of a thermal diffusivity and/or a viscosity of the fluid in the fluid flow path, determining a second measurement of a fluid flow velocity and/or a volumetric flow rate of the fluid in the fluid flow path, and adjusting the second measurement based on the first measurement.

We disclose herein a flow and thermal conductivity sensor comprising a semiconductor substrate comprising an etched portion, a dielectric region located on the semiconductor substrate, wherein the dielectric region comprises at least one dielectric membrane located over the etched portion of the semiconductor substrate and a heating element located within the dielectric membrane. The dielectric membrane comprises one or more discontinuities located between the heating element and an edge of the dielectric membrane.