A thermal pattern sensor including a plurality of pixels arranged on a substrate. Each pixel has a pyroelectric capacitance formed by at least one pyroelectric material portion arranged between a lower electrode and an upper electrode. The sensor has an abrasion-resistance coating, located on the side opposite the substrate and including pillars embedded in an abrasion-resistance layer, the pillars having a thermal conductivity strictly higher than that of the abrasion-resistance layer. A high thickness of the anti-abrasion protection coating can be achieved with a high rate of thermal transfer through the latter.

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

A working machine, movable on a substrate, comprises a sensor arrangement, wherein the sensor arrangement comprises: at least one sensor housing (24) with a sensor accommodation space (26) open via a detecting aperture (30), at least one sensor (28) arranged in the sensor accommodation space (26) of the at least one sensor housing (24), at least one air-supply arrangement (32) for generating an air flow (L) flowing through the sensor accommodation space (26) in the at least one sensor housing (24).

A method for inspecting a nozzle includes: measuring a temperature of the nozzle; comparing the temperature of the nozzle with a reference temperature; and determining whether or not the nozzle is clogged based on the temperature of the nozzle.

A complementary metal oxide semiconductor (CMOS) device embedded with micro-electro-mechanical system (MEMS) components in a MEMS region. The MEMS components, for example, are infrared (IR) thermoconforms. The device is encapsulated with a CMOS compatible IR transparent cap to hermetically seal the MEMS sensors in the MEMS region. The CMOS cap includes a base cap with release openings and a seal cap which seals the release openings.

Device and method of forming the device are disclosed. The method includes providing a substrate prepared with a complementary metal oxide semiconductor (CMOS) region and a sensor region. A substrate cavity is formed in the substrate in the sensor region, the substrate cavity including cavity sidewalls and cavity bottom surface and a membrane which serves as a substrate cavity top surface. The cavity bottom surface includes a reflector. The method also includes forming CMOS devices in the CMOS region, forming a micro-electrical mechanical system (MEMS) component on the membrane, and forming a back-end-of-line (BEOL) dielectric disposed on the substrate having a plurality of interlayer dielectric (ILD) layers. The BEOL dielectric includes an opening to expose the MEMS component. The opening forms a BEOL cavity above the MEMS component.

An explosion-proof thermal imaging system is provided. The system include an explosion-proof housing having a window that is configured to allow thermal radiation therethrough. An infrared camera is positioned within the explosion-proof housing and is disposed to receive and image thermal radiation that passes through the window. An emissivity target is disposed within a field of view of the infrared camera, but on an opposite side of the window from the infrared camera. A temperature sensor is operably coupled to the infrared camera and is configured to provide an indication of temperature proximate the emissivity target.

Device and method of forming the device are disclosed. The method includes providing a substrate prepared with a complementary metal oxide semiconductor (CMOS) region and a sensor region. A substrate cavity is formed in the substrate in the sensor region, the substrate cavity including cavity sidewalls and cavity bottom surface and a membrane which serves as a substrate cavity top surface. The cavity bottom surface includes a reflector. The method also includes forming CMOS devices in the CMOS region, forming a micro-electrical mechanical system (MEMS) component on the membrane, and forming a back-end-of-line (BEOL) dielectric disposed on the substrate having a plurality of interlayer dielectric (ILD) layers. The BEOL dielectric includes an opening to expose the MEMS component. The opening forms a BEOL cavity above the MEMS component.

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

A fire detection apparatus 1A includes a heat detection unit 110A provided such that a part of the heat detection unit 110A is accommodated in an outer cover 20A and another part of the heat detection unit 110A is exposed to an outside of the fire detection apparatus 1A through an insertion hole 120A formed in a top surface portion 22A, and a guard portion 130A which is provided to cover a periphery of the insertion hole 120A and another part of the heat detection unit 110A in the top surface portion 22A and has a plurality of ribs, in which a material of a rib corresponding to a first guard side rib 131A among the plurality of ribs is made different from a material of some other ribs, or a shape of the first guard side rib 131A among the plurality of ribs is made different from a shape of some other ribs.