A variety of nanostructures are provided having a metal nanowire having a plurality of faces extending along a length of the nanowire, and a plurality of semiconductor nanorods forming two or more nanorod arrays, wherein each of the nanorod arrays is attached to a different surface of the nanowire. For example, in some embodiments, the nanostructure is a silver nanowire having a pentagonal cross section and five faces extending along the length of the nanowire, and metal oxide nanorods forming five nanorod arrays extending along each of the five faces of the silver nanowire. The nanostructures can demonstrate high temperature coefficients of resistance, and can be used in a variety of bolometric materials. In some embodiments, bolometric materials are provided including a plurality of the nanostructures deposited onto a surface of a substrate. Methods of making the nanostructures and bolometers are also provided.

A terahertz imager includes an array of pixel circuits. Each pixel circuit has an antenna and a detector. The detector is coupled to differential output terminals of the antenna. A frequency oscillator is configured to generate a frequency signal on an output line. The output line is coupled to an input terminal of the antenna of at least one of the pixel circuits.

A terahertz imager includes an array of pixel circuits. Each pixel circuit has an antenna and a detector. The detector is coupled to differential output terminals of the antenna. A frequency oscillator is configured to generate a frequency signal on an output line. The output line is coupled to an input terminal of the antenna of at least one of the pixel circuits.

A pixel for an image sensor includes a resistive microbolometer sensor portion, a visible image sensor portion, and an output path. The resistive microbolometer sensor portion outputs a signal corresponding to an infrared (IR) image sensed by the resistive microbolometer sensor portion. The resistive microbolometer sensor portion uses no bias current. The visible image sensor portion outputs a signal corresponding to a visible image sensed by the visible image sensor portion. The output path is shared by the resistive microbolometer sensor portion and the visible image sensor portion, and may be controlled to selectively output the signal corresponding to the IR image, the signal corresponding to the visible image, or a fused image based on the IR image and the visible image. The resistive microbolometer sensor portion may sense a near infrared image or a longwave infrared image.

A pixel for an image sensor includes a resistive microbolometer sensor portion, a visible image sensor portion, and an output path. The resistive microbolometer sensor portion outputs a signal corresponding to an infrared (IR) image sensed by the resistive microbolometer sensor portion. The resistive microbolometer sensor portion uses no bias current. The visible image sensor portion outputs a signal corresponding to a visible image sensed by the visible image sensor portion. The output path is shared by the resistive microbolometer sensor portion and the visible image sensor portion, and may be controlled to selectively output the signal corresponding to the IR image, the signal corresponding to the visible image, or a fused image based on the IR image and the visible image. The resistive microbolometer sensor portion may sense a near infrared image or a longwave infrared image.

In some embodiments, apparatus and systems, as well as methods, may operate to select from multiple optical detectors and/or multiple detector amplifiers to form combinations of detectors and amplifiers as part of an optical detection system. The selection may be based on minimizing noise equivalent power (NEP) of the optical detector or a combination of an optical detector and a detector amplifier over a desired temperature range. Additional apparatus, systems, and methods are disclosed.

An infrared imaging micro-bolometer integrates a membrane assembled in suspension on a substrate by support arms. The membrane includes an absorbing material configured to capture infrared radiations and a thermometric material connected to the absorbing material configured to perform a transduction of the infrared radiations captured by the absorbing material The thermometric material is arranged on a surface area smaller than 0.4 times a surface area of the membrane. The membrane also includes at least one central dielectric layer arranged between the absorbing material and the thermometric material. Recesses are formed in the absorbing material and in the at least one dielectric layer in portions of the membrane devoid of the thermometric material.

An infrared imaging micro-bolometer integrates a membrane assembled in suspension on a substrate by support arms. The membrane includes an absorbing material configured to capture infrared radiations and a thermometric material connected to the absorbing material configured to perform a transduction of the infrared radiations captured by the absorbing material The thermometric material is arranged on a surface area smaller than 0.4 times a surface area of the membrane. The membrane also includes at least one central dielectric layer arranged between the absorbing material and the thermometric material. Recesses are formed in the absorbing material and in the at least one dielectric layer in portions of the membrane devoid of the thermometric material.

Techniques are disclosed for facilitating multiple microbolometer selection for simultaneous readout. In one example, a device includes a plurality of microbolometers. The plurality of microbolometers includes a first set and a second set of serially-connected microbolometers. The device further includes a first plurality of switches configured to selectively short the plurality of microbolometers. The device further includes a second plurality of switches configured to selectively couple the plurality of microbolometers to ground. The device further includes a third plurality of switches configured to selectively provide a bias signal to the plurality of microbolometers. The device further includes a processing circuit configured to configure the first plurality, second plurality, and third plurality of switches to cause simultaneous read out of one microbolometer of the first set and one microbolometer of the second set. Related methods and systems are also provided.

Techniques are disclosed for facilitating multiple microbolometer selection for simultaneous readout. In one example, a device includes a plurality of microbolometers. The plurality of microbolometers includes a first set and a second set of serially-connected microbolometers. The device further includes a first plurality of switches configured to selectively short the plurality of microbolometers. The device further includes a second plurality of switches configured to selectively couple the plurality of microbolometers to ground. The device further includes a third plurality of switches configured to selectively provide a bias signal to the plurality of microbolometers. The device further includes a processing circuit configured to configure the first plurality, second plurality, and third plurality of switches to cause simultaneous read out of one microbolometer of the first set and one microbolometer of the second set. Related methods and systems are also provided.