A temperature sensor including a body made from a thermally and electrically conductive material, the body defined by a peripheral wall extending along a longitudinal axis from an open proximal end to a closed distal end. The proximal end defining an opening to an internal cavity of the body. A thermally responsive element including an outer surface, a temperature sensitive resistor electrically connected to a first lead, a second lead, and a connector block disposed substantially within the internal cavity. The inner surface of the peripheral wall defines the shape of a right circular cone at the distal end. The outer surface of the temperature sensitive resistor is in direct contact with the inner surface of the peripheral wall at the distal end. One of a thermally conductive and curable potting material and a thermally conductive grease disposed in the cavity and substantially surrounding the temperature responsive element.

A temperature sensing circuit includes a current source circuit, a resistor, a bandgap voltage generation circuit, a voltage-equalizing circuit and a temperature determining circuit. The current source circuit has a first current output terminal and a second current output terminal. The bandgap voltage generation circuit includes a pair of bipolar junction transistors. The voltage-equalizing circuit equalizes voltages of a first current output terminal and the second current output terminal. The temperature determining circuit includes a sampling capacitor and a calculation circuit. The sampling capacitor samples a first voltage of a first terminal of the resistor and a second voltage of a second terminal of the resistor. The calculation circuit generates a temperature value by calculating a voltage difference between the first voltage and the second voltage.

A temperature sensing circuit includes a current source circuit, a resistor, a bandgap voltage generation circuit, a voltage-equalizing circuit and a temperature determining circuit. The current source circuit has a first current output terminal and a second current output terminal. The bandgap voltage generation circuit includes a pair of bipolar junction transistors. The voltage-equalizing circuit equalizes voltages of a first current output terminal and the second current output terminal. The temperature determining circuit includes a sampling capacitor and a calculation circuit. The sampling capacitor samples a first voltage of a first terminal of the resistor and a second voltage of a second terminal of the resistor. The calculation circuit generates a temperature value by calculating a voltage difference between the first voltage and the second voltage.

A circuit board is disclosed that has a pre-warming function. The circuit board includes a substrate and one or more conductive paths embedded in the substrate. The one or more electrically conductive paths include a logic control circuit containing a heating element and a temperature-sensitive element configured to control the heating element and deliver an input when the temperature-sensitive element has reached a threshold temperature. The one or more electrically conductive paths further includes a heater power circuit configured to deliver power to the logic control circuit. The one or more electrically conductive paths further includes an operational power circuit configured to switch off power to the heater power circuit and switch on power to the operational power circuit upon a delivery of the input from the logic control circuit.

A circuit board is disclosed that has a pre-warming function. The circuit board includes a substrate and one or more conductive paths embedded in the substrate. The one or more electrically conductive paths include a logic control circuit containing a heating element and a temperature-sensitive element configured to control the heating element and deliver an input when the temperature-sensitive element has reached a threshold temperature. The one or more electrically conductive paths further includes a heater power circuit configured to deliver power to the logic control circuit. The one or more electrically conductive paths further includes an operational power circuit configured to switch off power to the heater power circuit and switch on power to the operational power circuit upon a delivery of the input from the logic control circuit.

A semiconductor drive device includes a drive circuit that drives a semiconductor switching element, a passive element connected to a gate of the semiconductor switching element to prevent a gate current of the semiconductor switching element, a switching element connected in series to the passive element, a control circuit that controls the switching element, and a temperature detection circuit that detects a temperature of the semiconductor switching element. The control circuit controls the switching element such that when the temperature detected by the temperature detection circuit is high, the gate current is prevented more than when the temperature is low.

Low-cost techniques for sensing ambient temperatures in a container or package using phase change materials are provided. In one aspect, a temperature sensor is provided. The temperature sensor includes: at least one phase change material configured to transition from an amorphous state to a crystalline state upon exposure to temperatures above a predetermined threshold temperature for a given duration. A method of monitoring temperature exposure of a consumer good using the temperature sensor is also provided.

Low-cost techniques for sensing ambient temperatures in a container or package using phase change materials are provided. In one aspect, a temperature sensor is provided. The temperature sensor includes: at least one phase change material configured to transition from an amorphous state to a crystalline state upon exposure to temperatures above a predetermined threshold temperature for a given duration. A method of monitoring temperature exposure of a consumer good using the temperature sensor is also provided.

Temperature sensing circuits for devices described herein include a substrate material, a first conductive portion, a second conductive portion, and a third conductive portion associated with the substrate material, and a plurality of thermistors associated with the substrate material for sensing a temperature associated with the device. The plurality of thermistors include a first thermistor and a second thermistor. The first thermistor is connected to the first conductive portion. The first thermistor and the second thermistor are both connected to the second conductive portion. The second thermistor is connected to the third conductive portion.

The present invention provides a thermal sensor integrated IC having a resistor and a converting circuit. The resistor is implemented by at least one metal line, wherein a resistance of the resistor is varied with a temperature of the resistor, the resistor has a first terminal and a second terminal, and one of the first terminal and the second terminal is arranged to provide a voltage signal corresponding to the resistance. The converting circuit is coupled to the resistor, and is configured to convert the voltage signal to an output signal for determining the temperature. In one embodiment, the at least one metal line is made by copper.