To provide a pressure sensor that has high pressure resistance performance, small measurement error by suppressing hysteresis with respect to pressure, and high sensitivity and high productivity, a pressure sensor includes a diaphragm unit with a first main surface that receives a measurement target fluid's pressure and a second main surface located on the opposite side of this first main surface, a housing, and a sensing unit that outputs the diaphragm unit's deformation as an electric signal, in which at least part of the diaphragm unit has a multi-layer structure in which a plurality of thin plate members are stacked, and the plurality of thin plate members are deformed independently of each other while at least part of the plurality of thin plate members is in press-contact to each other in a pressure receiving state in which the measurement target fluid's pressure is applied to the first main surface.

Shaped body, in particular for a pressure sensor, having a membrane and having a supporting section supporting the membrane, the membrane being produced at least in sections from a ceramic material by means of additive manufacturing, in particular 3D screen printing, and having an outer circumferential shape with at least one corner.

Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or eliminating defects that may have occurred during production. The membrane is bonded to the sensor housing at a point outside the tensioning ring, preventing the process of bonding the membrane to the housing from introducing defects into the tensioned portion of the membrane. A dielectric may be introduced into the gap between the membrane and the counter electrode in a capacitive pressure sensor, resulting in an improved dynamic range.

In an embodiment a method includes providing a semiconductor body, forming a sacrificial layer above a surface of the semiconductor body, applying a diaphragm on the sacrificial layer and removing the sacrificial layer by introducing an etchant into openings of the diaphragm, wherein applying the diaphragm comprises applying a first layer, reducing a roughness of a surface of the first layer facing away from the semiconductor body thereby providing a processed surface, and patterning and structuring the first layer to form the openings.

A pressure sensor device of a pressure sensor, in particular a low- or medium-pressure sensor, for example a tire-pressure sensor, includes a sensing device that has a sensing side that can be turned toward a sensing environment having a fluid to be sensed; and, directly and/or indirectly on the sensing side, a fluid-pressure transmitting device, through which a fluid pressure of the fluid to be sensed is transmittable to the sensing device.

A pool cleaning robot that may include a hollow body, a fluid input, a fluid output, a propulsion unit for moving the pool cleaning robot within a pool, a filtering unit, and a sensing module that comprises a gas pressure sensor, a first space, a second space and a diaphragm; wherein the diaphragm seals the second space and separates the first space from the second space; wherein the diaphragm, via the first space, is fluidly coupled to the filtering unit; wherein the diaphragm is configured to define a gas pressure within the second space as a function of, at least, a fluid pressure within the first space; wherein the gas pressure sensor is located within the second space and is configured to measure the gas pressure within the second space.

A pressure sensor assembly includes a pressure sensor, a pedestal and an electrically conductive header having a header cavity. The pressure sensor includes, an electrically conductive sensing layer having a sensor diaphragm, an electrically conductive backing layer having a bottom surface that is bonded to the sensing layer, an electrically insulative layer having a bottom surface that is bonded to a top surface of the backing layer, and a sensor element having an electrical parameter that changes based on a deflection of the sensor diaphragm in response to a pressure difference. The pedestal is bonded to the electrically insulative layer and attached to the header within the header cavity.

A pressure sensor assembly, which includes a support substrate, circuitry mounted to the support substrate, at least one conductor mounted to the support substrate and in electrical communication with the circuitry, and at least one vertically conductive path connected to and in electrical communication with the at least one conductor. The pressure sensor assembly also includes a diaphragm, at least one sealing glass section connected to the diaphragm and the support substrate, and at least one lateral conductive feed-through mounted to the diaphragm. At least one conductive joint is connected to the vertically conductive path and the lateral conductive feed-through, and the conductive joint provides electrical communication between the vertically conductive path and the lateral conductive feed-through.

A pressure sensor includes an input terminal configured to receive an electrical input signal and an output terminal configured to provide an electrical output signal in response to the electrical input signal. The pressure sensor also includes an acousto-mechanical diaphragm and an electrically conductive element formed on the acousto-mechanical diaphragm. The pressure sensor further includes a distributed element filter configured to capacitively couple the input terminal to the output terminal. The distributed element filter is spaced from the electrically conductive element by an air gap. The air gap changes in response to a deflection of the acousto-mechanical diaphragm caused by a change in pressure on the acousto-mechanical diaphragm.

Shaped body, in particular for a pressure sensor, having a membrane and having a supporting section supporting the membrane, the membrane being produced at least in sections from a ceramic material by means of additive manufacturing, in particular 3D screen printing, and having at least in sections a thickness of less than 0.5 mm.