A sensor arrangement for indirect detection of a torque of a rotatably mounted shaft includes a sensor with at least one sensor element arranged in the surroundings of a bearing of the shaft. The bearing is linked to a supporting structure. The sensor element is configured to detect a proportion of a bearing force acting in a predetermined direction. The torque of the shaft is configured to be calculated from the acting proportion of the bearing force. The sensor has at least one sensor body with an outer contour that supports a corresponding sensor element and is pressed into a receiving hole. The sensor element has a predetermined distance and a predetermined angle to the bearing.

Provided is a pressure detection device including a pressure detection unit configured to detect a pressure to be transmitted to a pressure sensor, and a flow channel unit on which the pressure detection unit is disposed. The pressure detection unit) includes a pressure sensor and a conductive protective film disposed in contact with the pressure sensor, the conductive protective film breaking contact between the pressure sensor and a fluid. The conductive protective film is formed of a conductive fluororesin material including a fluororesin material and a conductive material dispersed in the fluororesin material and is connected to a ground portion maintained at a ground potential.

In order to produce accurate sensor element in a simple way, the invention provides a method for producing a sensor element (10) for a pressure or force sensor, comprising the steps:

a) providing a component (13) to be deformed,

c) applying to the component (13) a sensor function and contact layer (24) consisting of a material with a k-factor between 2 and 10,

d) planar ablation of the material of the sensor function and contact layer (24) by means of a laser, in such a manner that strain gauges (44) with a resistance structure with a meandering shape and contact pads (46.1, 46.2, 46.3, 46.4) remain standing,

wherein, for ablating the material, laser pulses from the group of laser pulses comprising:

laser pulses in the sub-ps range,

laser pulses from a broadband laser source (28) with a wavelength bandwidth of 10 nm to 70 nm

laser pulses from a broadband laser source (28) with a fundamental wavelength and a wavelength bandwidth of at least 1%, preferably at least 2%, most preferably at least 3% of the fundamental wavelength,

laser pulses compressed by a pulse compression process, and

laser pulses conducted through a hollow-core fiber.

are used.

The present disclosure relates to differential pressure transducers. The teachings thereof may be embodied in diaphragm-beam configurations for measuring small values of differential pressure and/or a bridge circuit for converting mechanical strains into an electric output signal. For example, a diaphragm-beam structure for measuring differential pressure may include: a frame; a paddle; a resilient beam member; a diaphragm; and a gap defined between the paddle and the frame. The diaphragm flexes under pressure on one surface. The resilient beam member anchors the paddle to the frame. The second surface of the diaphragm is mounted to the first surface of the paddle and the frame to bridge the gap. The paddle moves due to flexure of the diaphragm. The resilient beam member bends due to movement of the paddle. The thickness of the diaphragm is less than 50 micrometers.

Aspects of the present disclosure relate to a piezoelectric device having at least one piezoelectric element, which has a support plane oriented to a force introduction element, wherein in the event of a thermal loading of the piezoelectric device in the support plane, expansion differences between the piezoelectric element and the force introduction element occur. To compensate for shear loadings, at least one transition element is arranged between the piezoelectric element and the force introduction element, the E-module of which is smaller than the E-module of the piezoelectric element in the support plane.

In a microelectromechanical system (MEMS) pressure sensor, thin and fragile bond wires that are used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC) for the input and output signals between these two chips are replaced by stacking the ASIC on the MEMS pressure sensing element and connecting each other using conductive vias formed in the ASIC. Gel used to protect the bond wires, ASIC and MEMS pressure sensing element can be eliminated if bond wires are no longer used. Stacking the ASIC on the MEMS pressure sensing element and connecting them using conductive vias enables a reduction in the size and cost of a housing in which the devices are placed and protected.

A MEMS pressure sensor includes a resistive sensing bridge with a first sensing resistor and a second sensing resistor, each having variable resistance values in response to change in a sensed physical variable. An oscillator generates an oscillation signal with a frequency or period that is a function of an oscillator control signal. A sensor reference module generates the oscillator control signal as a function of the resistance value of a resistor coupled therewith. This sensor reference module is couplable with the first sensing resistor or second sensing resistor. A processing circuit coupled to the oscillator provides a sensor signal indicative of the frequency or period of the oscillation signal. The sensor signal has first and second values with the sensor reference module coupled with the first sensing resistor and with the second sensing resistor, respectively, the first and second values being thus jointly indicative of the physical variable sensed.

A pressure transducer comprises a housing including a body section and at least one end cap at one end of the body section, which are made of piezoelectric crystal, and a piezoelectric resonator in the housing. The body section and the end cap are bonded by an atomic diffusion bonding method.

A pressure sensor die assembly for a differential pressure sensor comprises a base substrate including a first overpressure stop structure on a first surface, and a diaphragm structure coupled to the first surface. The diaphragm structure comprises a first side with a cavity section that includes a first cavity and a second cavity surrounding the first cavity, and a second side opposite from the first side. A pressure sensing diaphragm portion is defined by the first cavity and is located over the first overpressure stop structure. An overpressure diaphragm portion is defined by the second cavity. A top cap coupled to the second side of the diaphragm structure includes a second overpressure stop structure. The overpressure stop structures are each sized to support substantially all of a strained area of the pressure sensing diaphragm portion at an increasing overpressure on the first or second sides of the diaphragm structure.

Systems and methods are disclosed for a switched, multiple range sensor system including multiple transducers. In one embodiment, a method is provided that includes receiving and measuring at a first transducer and a second transducer, a pressure to generate a respective first and second pressure signal; amplifying the first and second pressure signals with corresponding first and second fixed-gain amplifier to generate first and second amplified pressure signals; selecting for monitoring, the first or second amplified pressure signal; converting the selected amplified pressure signal to an intermediate digital pressure signal; measuring, at a thermal sensor associated with the selected amplified pressure signal, a temperature; compensating, based on the measured temperature, the intermediate digital pressure signal to generate a compensated digital pressure output signal; and outputting the compensated digital pressure output signal.