Methods, apparatuses and systems for providing gas detecting apparatuses (e.g., electrochemical detectors) are disclosed herein. An example gas detecting apparatus may comprise a sensing component comprising: a housing configured to receive a sample gaseous substance comprising a target gaseous substance and an interferent gaseous substance; a reference electrode, disposed within the housing; a counter electrode disposed within the housing; and a sensing electrode disposed within the housing that is operatively coupled to a bias voltage circuit.

Methods, apparatuses and systems for providing gas detecting apparatuses (e.g., electrochemical detectors) are disclosed herein. An example gas detecting apparatus may comprise a sensing component comprising: a housing configured to receive a sample gaseous substance comprising a target gaseous substance and an interferent gaseous substance; a reference electrode, disposed within the housing; a counter electrode disposed within the housing; and a sensing electrode disposed within the housing that is operatively coupled to a bias voltage circuit.

Various example embodiments described herein relate to an electrochemical gas sensor. The electrochemical gas sensor can include a sensor cap having one or more solid features disposed on a surface of the sensor cap. The electrochemical gas sensor can include a counter electrode configured to generate a gas during use of the electrochemical gas sensor. The electrochemical gas sensor can include a vent assembly adapted to release at least a portion of the gas generated at the counter electrode out from the electrochemical gas sensor. The vent assembly can include a vent conduit and a vent membrane that defines a passage for the gas to flow from an extended portion of the counter electrode, to the vent conduit, via the vent membrane, so as to be vented from the electrochemical gas sensor.

Various example embodiments described herein relate to an electrochemical gas sensor. The electrochemical gas sensor can include a sensor cap having one or more solid features disposed on a surface of the sensor cap. The electrochemical gas sensor can include a counter electrode configured to generate a gas during use of the electrochemical gas sensor. The electrochemical gas sensor can include a vent assembly adapted to release at least a portion of the gas generated at the counter electrode out from the electrochemical gas sensor. The vent assembly can include a vent conduit and a vent membrane that defines a passage for the gas to flow from an extended portion of the counter electrode, to the vent conduit, via the vent membrane, so as to be vented from the electrochemical gas sensor.

A moisture regulating electrochemical sensor includes a sensor electrolyte housed in a chamber of a casing configured with electrodes connected electrically to the sensor electrolyte and configured to be connected electrically to an exterior circuit, an inlet, a vent, and a membrane permeable only to moisture, the chamber between the inlet and the vent each to the sensor electrolyte in the chamber, the inlet allowing a target gas to pass through from an exterior target gas environment to the sensor electrolyte in the chamber, and the membrane operatively coupled to the vent, allowing only moisture to translate through the vent between an exterior vent environment and the sensor electrolyte in the chamber.

A moisture regulating electrochemical sensor includes a sensor electrolyte housed in a chamber of a casing configured with electrodes connected electrically to the sensor electrolyte and configured to be connected electrically to an exterior circuit, an inlet, a vent, and a membrane permeable only to moisture, the chamber between the inlet and the vent each to the sensor electrolyte in the chamber, the inlet allowing a target gas to pass through from an exterior target gas environment to the sensor electrolyte in the chamber, and the membrane operatively coupled to the vent, allowing only moisture to translate through the vent between an exterior vent environment and the sensor electrolyte in the chamber.

A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.

Apparatuses and methods of measuring a hydrogen diffusivity of a metal structure including during operation of the metal structure, are provided. A hydrogen charging surface is provided at a first location on an external surface of the structure. In addition, a hydrogen oxidation surface is provided at a second location adjacent to the first location on the external surface of the structure. Hydrogen flux is generated and directed into the metal surface at the charging surface. At least a portion of the hydrogen flux generated by the charging surface is diverted back toward the surface. A transient of the diverted hydrogen fluxes measured, and this measurement is used to determine the hydrogen diffusivity of the metal structure in service.

Apparatuses and methods of measuring a hydrogen diffusivity of a metal structure including during operation of the metal structure, are provided. A hydrogen charging surface is provided at a first location on an external surface of the structure. In addition, a hydrogen oxidation surface is provided at a second location adjacent to the first location on the external surface of the structure. Hydrogen flux is generated and directed into the metal surface at the charging surface. At least a portion of the hydrogen flux generated by the charging surface is diverted back toward the surface. A transient of the diverted hydrogen fluxes measured, and this measurement is used to determine the hydrogen diffusivity of the metal structure in service.

An apparatus and method of adjusting a plating solution are described. Suppressor is added to the plating solution until a comparison to reference data of an RDE potential taken at a first time during a constant current experiment indicates a threshold suppressor concentration is present. The amount of suppressor added to reach the threshold suppressor concentration is used to determine suppressor concentration of the solution. Another amount of suppressor is added to a new plating solution so that the new plating solution has a specific suppressor concentration. The RDE potential or slope of RDE potential change of the new plating concentration with the specific suppressor concentration taken at a second time during another constant current experiment is compared with the reference data to determine the leveler concentration. The suppressor and leveler concentrations of the original plating solution are adjusted before a semiconductor substrate is plated.