A laser scanning imaging method, a system, a storage medium, and a computer program. The laser scanning imaging method comprises: determining parameter information related to an effective area, where the effective area comprises an imaging area satisfying a preset condition (S101); receiving a galvanometer scanning synchronization signal generated by a driving unit (S102); generating a clock signal based on the galvanometer scanning synchronization signal and the parameter information related to the effective area (S103); and sampling, according to the clock signal, a fluorescence signal received through galvanometer scanning and obtaining fluorescence image information of the effective area (S104). By means of the method, the generated clock signal can be flexibly changed along with the change of the range of the effective area, thereby obtaining the fluorescence image of the effective area, and presenting, for a user, a scanning imaging result meeting requirements.

Provided is a mirror device including a mirror which is supported to be flappable around a fast axis and supported to be flappable around a slow axis and in which a resonance frequency of flapping thereof with respect to the fast axis is a first value and a resonance frequency of the flapping thereof with respect to the slow axis is a second value lower than the first value; a signal extracting portion configured to obtain from a slow axis coil a synthesized signal including an induced signal generated in the slow axis coil due to an operation of flapping the mirror around the fast axis and configured to extract the induced signal from the synthesized signal; and a signal generating portion configured to generates a driving signal so that the flapping of the mirror with respect to the fast axis is in a resonance state according to the induced signal.

Provided is a microscope provided with: a scanner that scans an excitation beam coming from a light source; an objective optical system that focuses the scanned excitation beam onto a sample and that collects fluorescence generated at individual scanning positions in the sample; a detector that detects the collected fluorescence; a light blocking member that is disposed between the detector and the system and that partially blocks the collected fluorescence; a switching portion that switches the positional relationship between the member and a light-focusing point of the excitation beam in the sample between an optically conjugate positional relationship, in which an in-focus fluorescence generated at the light-focusing point passes through the member, and a non-conjugate positional relationship, in which the in-focus fluorescence is blocked by the member; and a computing portion that computes a difference between fluorescence signals acquired by the detector in the two positional relationships.

In a method and apparatus, a property of an optically diffuse medium including a first optical absorber having a first concentration and a second optical absorber having a second concentration is determined. A surface area of the medium is imaged at multiple wavelengths around an isosbestic wavelength of the first absorber and the second absorber. A reflectance spectrum of the medium at the surface area at the multiple wavelengths is determined. A derivative of the determined reflectance spectrum around the isosbestic wavelength is determined. From the derivative, a concentration ratio of the first concentration and the second concentration is estimated.

There are provided a welding monitoring system which can multidimensionally monitor a welding portion with high accuracy and a monitoring method thereof, by using a relatively simple configuration.

There is provided a welding monitoring system which monitors a subject, including: a mechanical portion; and an imaging portion, in which the mechanical portion includes a transport arm which transports the subject, a subject holding portion which holds the subject, and an energizing device which causes welding with respect to the subject to be performed, and in which the imaging portion includes imaging means for obtaining imaging data of the subject, a data recording portion which records the imaging data, an analyzing portion which extracts predetermined characteristics from the imaging data, a comparison determination portion which compares the extracted characteristics and normal characteristics to each other to determine the presence or absence of abnormality, and a determination result output portion which outputs a determination result by the comparison determination portion.

A side surface inspection device is provided for a cylindrical battery having a side surface defining a first region and a second region as a remainder of the side surface. The device includes a first light to emit light to the side surface of the cylindrical battery; a first mirror and a second mirror on respective sides of the cylindrical battery to each reflect light from respective portions of the first region of the cylindrical battery; and a camera to capture a first image from the light reflected by the first mirror, and to capture a second image from the light reflected by the second mirror. The first region of the cylindrical battery is more than half of the side surface of the cylindrical battery. The first and second images corresponds to a full region of the first region of the cylindrical battery.

There are provided a welding monitoring system which can multidimensionally monitor a welding portion with high accuracy and a monitoring method thereof, by using a relatively simple configuration.

There is provided a welding monitoring system which monitors a subject, including: a mechanical portion; and an imaging portion, in which the mechanical portion includes a transport arm which transports the subject, a subject holding portion which holds the subject, and an energizing device which causes welding with respect to the subject to be performed, and in which the imaging portion includes imaging means for obtaining imaging data of the subject, a data recording portion which records the imaging data, an analyzing portion which extracts predetermined characteristics from the imaging data, a comparison determination portion which compares the extracted characteristics and normal characteristics to each other to determine the presence or absence of abnormality, and a determination result output portion which outputs a determination result by the comparison determination portion.

A device for measuring wafers includes an optical coherence tomograph, which generates a measuring light beam and directs it onto the wafer via an optical system. A scanning device deflects the measuring light beam in two spatial directions. A control unit controls the scanning device so that the measuring light beam scans the surface of the wafer successively at several measuring points. Two measuring points have a distance d.sub.max of 140 mmd.sub.max600 mm. An evaluation unit calculates distance values and/or thickness values from the interference signals provided by the optical coherence tomograph and, based on the distance values and/or thickness values, at least one characteristic quantity of the wafer such as TTV, warp or bow.

A system and method for mapping a tissue sample is provided. The system includes a light source, a scanner, a digital mirror device (DMD), a light detector, and an analyzer. The DMD has an array of micromirrors. The analyzer controls the light source, controls the scanner, controls the DMD to have on-state micromirrors aligned with a light beam, and other micromirrors in an off-state. The on-state micromirrors direct the light beam to a tissue sample. The analyzer assigns one or more location codes to the on-state micromirrors, controls the light detector to receive Raman light emitted from the tissue sample, correlates the location codes of the on-state micromirrors with light detector signals representative of the Raman emitted light, and produces a spatial map of the Raman emitted light.

A wafer defect inspection system is disclosed, and comprises a line light source, a camera and a processor, wherein the processor is configured to control the line light source to provide an inspection light to be incident on a wafer, wherein an included angle between the inspection light and the surface of the wafer ranges from 450 to 90. After incidence on the wafer, the inspection light travels inside the wafer according to the principle of total reflection, and when encountering a crack, part of the inspection light exits from the surface of the wafer through the crack. Moreover, the processor controls the camera to obtain a wafer image containing at least one defect feature, and after processing the wafer image into an inspection wafer image, compares the wafer image with a reference wafer image, so as to know the at least one defect feature.