An image acquisition system includes a radiation source configured to output radiation toward an object, a rotating stage configured to rotate the object around a rotation axis, a radiation camera having an input surface to which the radiation transmitted through the object is input and an image sensor capable of TDI control, and an image processing apparatus configured to generate a radiographic image of the object at an imaging plane P based on the image data. The angle formed between the rotation axis of the rotating stage and the input surface of the radiation camera is set in accordance with the FOD which is the distance between the radiation source and an imaging plane in the object. The radiation camera is configured to perform TDI control in the image sensor in synchronization with the rotational speed of the object rotated by the rotating stage.

A fast industrial CT scanning system and a method are provided. The scanning system includes X-ray sources, detectors, a rotating table, control boxes, and a control unit. The X-ray sources, the detectors, the rotating table, and the control boxes are all connected to the control unit. The rotating table is used for placing a specimen detected. Three X-ray sources are annularly and uniformly arranged at an interval of 120° by taking an axis of the rotating table as a center. Distances from the three X-ray sources to the specimen detected are equal. Each X-ray source is mounted in a corresponding control box. Three detectors are annularly and uniformly arranged at an interval of 120° by taking the axis of the rotating table as a center. Distances from the three detectors to the specimen detected are equal.

Provided is a fine structure determination method capable of easily determining tilt angles of columnar scattering bodies that are long in a thickness direction, and provided are an analysis apparatus and an analysis program thereof. There is provided an analysis method for a fine structure of a plate-shaped sample formed to have columnar scattering bodies that are long in a thickness direction and periodically arranged, comprising the steps of preparing scattering intensity data from the plate-shaped sample, that is generated via transmission of X-rays; and determining tilt angles of the scattering bodies in the plate-shaped sample with respect to a reference rotation position at which a surface of the plate-shaped sample is perpendicular to an incident direction of the X-rays, based on the prepared scattering intensity data.

A tomographic imaging system and a connection assembly thereof are disclosed. The connection assembly includes a carrying platform and a holding bed. The carrying platform includes a rotatable component, a first circuit board and a connecting component. The rotatable component has a first end coupled to a rotor and rotates relative to the first circuit board and the connecting component. The holding bed includes a holding component, a bearing, and a second circuit board. The holding component includes an engaging portion and a holding portion. The second circuit board is coupled to the holding component through the bearing. The engaging portion is detachably connected to the second end of the rotatable component, and the second conductive terminals of the second circuit board abut against the first conductive terminals of the first circuit board to achieve an electric connection, so as to identify the holding bed.

A spectroscopic element and a detector are disposed along a circumference of one Rowland circle. The spectroscopic element has a spectral surface whose length, measured along the Rowland circle, is shorter than a length in the Rowland circle plane, of an irradiation surface irradiated with excitation beams emitted to a sample holder. The spectroscopic element and the sample holder are disposed to separate a group of characteristic X-rays within a common spectral range of the spectroscopic element.

In order to sufficiently capture spatial distortion specific to an X-ray CT device and evaluate the three-dimensional shape measurement accuracy of the X-ray CT device, in a utensil, by attaching support rods fixing spheres to the tip thereof and having different lengths to a base spheres are arranged in an XYZ space on the base. On a flat surface on the top of the base, the support rods supporting the spheres and having different lengths are arranged at predetermined intervals. In doing so, the spheres are arranged in the XYZ space respectively at appropriate inter-sphere distances.

In order to sufficiently capture spatial distortion specific to an X-ray CT device and evaluate the three-dimensional shape measurement accuracy of the X-ray CT device, in a utensil, by attaching support rods fixing spheres to the tip thereof and having different lengths to a base spheres are arranged in an XYZ space on the base. On a flat surface on the top of the base, the support rods supporting the spheres and having different lengths are arranged at predetermined intervals. In doing so, the spheres are arranged in the XYZ space respectively at appropriate inter-sphere distances.

A system and method are provided including an inclusion module to receive a powder sample from a powder source; a computed tomography equipment; a memory for storing program instructions; an inclusion processor, coupled to the memory, and in communication with the inclusion module, and operative to execute program instructions to: receive the powder sample; execute a computed tomography (CT) scan process of the received sample to generate a first dataset including one or more images; identify inclusions in the one or more images, via a segmentation process; reconstruct, via a reconstruction process, the identified inclusion into a 3D representation; measure the identified inclusion; mark the inclusions on one or more image slices from the 3D representations; and determine whether the powder source is contaminated based on the one or more marked images. Numerous other aspects are provided.

A system and a method of measuring grain orientations of a metal component. The method includes defining a series of measurement locations on the metal component at which to take a series of measurements indicative of grain orientations at corresponding measurement locations. The method further includes defining a nominal grain orientation at each measurement location. The method further includes loading the measurement locations into a computer-controllable fixture suitable for positioning the metal component. The method further includes locating the metal component in the computer-controllable fixture. The method further includes taking the series of measurements at the series of measurement locations. The method further includes analysing the measurement at each measurement location relative to the nominal grain orientation at the corresponding measurement location.

Disclosed are a method, an apparatus, and a system for inspecting a ball grid array-type semiconductor chip package. A first embodiment of the present invention provides an apparatus for inspecting a semiconductor chip package, the apparatus comprising: a first image acquisition unit for acquiring a reference image using a three-dimensional image of a semiconductor chip serving as a reference, the reference image being obtained by removing a region of interest from the three-dimensional image; a second image acquisition unit for acquiring a two-dimensional image of a semiconductor chip to be inspected; and an image processing unit for deriving an image of a region of interest of the semiconductor chip to be inspected, from the difference between the reference image and the two-dimensional image.