A method of failure analysis for locating open circuit defect in a metal layers, comprising: providing a chip sample having a metal layer, with an open circuit defect; delaminating the chip to expose the metal layer; depositing a metal conductive layer on the metal layer; removing a portion of the metal conductive layer to expose the metal layer; depositing a non-conductive protective layer to cover the exposed metal layer and any remaining portions of the metal conductive layer; preparing a TEM slice sample which comprises the metal layer, the remaining portions of the metal conductive layer, and the non-conductive protective layer; performing a VC analysis on the TEM slice sample to determine the defect position of the open circuit defect; and analyzing the defect position of the open circuit defect.

This fluorescent X-ray analysis apparatus is provided with an X-ray irradiation unit 20 for irradiating a sample S with: X-rays, having an energy that exceeds the energy absorption edge value of Ag which is selected as a measurement target element, and that is no greater than the energy absorption edge value of Sn which is an adjacent element having a higher energy absorption edge value than Ag; and X-rays having an energy exceeding the energy absorption edge value of Sn which is selected as a measurement target element.

A method for analyzing the quality of a thin layer surface of PCB includes steps of taking a region to be tested from the PCB as a sample by scissors or an automatic sampler; performing gold spraying treatment; fixing a sample to be tested onto a metal sample platform, and then mounting the sample platform on the inclined surface of a test platform; depositing a first protective layer by an electron beam; after deposition with the electron beam is completed, depositing a second protective layer by a focused ion beam; adjusting the angle of inclination of the test platform to ensure that the surface of the sample can be cut perpendicular to the direction of the focused ion beam; and finally adjusting angle of inclination of the sample to perform observation. The method can avoid influences of chemical solutions, mechanical stress, and impurity contamination in the sample preparation process.

A measurement system is provided, including a measurement machine and a computer. The measurement machine is configured to measure a thickness T1 of a to-be-tested circuit board and a drilling depth D1 of the to-be-tested circuit board. The computer calculates a length S1 of a residual conductive portion in a back drilled hole of the to-be-tested circuit board according to a thickness T of a reference circuit board, a drilling depth D of the reference circuit board, a length S of a residual conductive portion in a back drilled hole of the reference circuit board, the thickness T1 of the to-be-tested circuit board and the drilling depth D1 of the to-be-tested circuit board.

A metrology target includes a first set of pattern elements compatible with a first metrology mode along one or more directions, and a second set of pattern elements compatible with a second metrology mode along one or more directions, wherein the second set of pattern elements includes a first portion of the first set of pattern elements, and wherein the second set of pattern elements is surrounded by a second portion of the first set of pattern elements not included in the second set of pattern elements.

An inspection position identification method that allows accurate inspection to be performed without in-advance identification of the position of an inspection plane in an inspected target. A three-dimensional image generation method that allows generation of a three-dimensional image for inspection without in-advance identification of the position of an inspection plane in an inspected target and then allows inspection to be performed. An inspection device including the methods. An inspection device includes a storage unit, which stores a radiation transmission image of an inspected object and a three-dimensional image generated from the radiation transmission image, and a control unit. The process carried out by the control unit for identifying an inspection position in a three-dimensional image includes identifying the position of a transmission picture of the inspection position in the radiation transmission image and identifying the inspection position in the three-dimensional image from the position of the transmission picture.

An inspection position identification method that allows accurate inspection to be performed without in-advance identification of the position of an inspection plane in an inspected target. A three-dimensional image generation method that allows generation of a three-dimensional image for inspection without in-advance identification of the position of an inspection plane in an inspected target and then allows inspection to be performed. An inspection device including the methods. An inspection device includes a storage unit, which stores a radiation transmission image of an inspected object and a three-dimensional image generated from the radiation transmission image, and a control unit. The process carried out by the control unit for identifying an inspection position in a three-dimensional image includes identifying the position of a transmission picture of the inspection position in the radiation transmission image and identifying the inspection position in the three-dimensional image from the position of the transmission picture.

The present invention relates to a transmission image-based non-destructive inspecting method, a method of providing a non-destructive inspection function, and a device therefor. Specifically, when transmission images of industrial parts or electronic parts including an electronic circuit board mounted therein exist, the present invention enables various inspection methods to be used for the transmission images, so that a user can easily perform a defect inspection according to various situations.

Aspects of the technology employ real-time monitoring and feedback for a printed circuit board fabrication system. An x-ray simulator can be used to aid in understanding metallurgical phase transformations in real time to ensure acceptable and reliable solder connections. This includes real-time data gathering and evaluation of solder-related printed circuit board data, including peak temperature, time above liquidus (TAL), ramp up and ramp down rates. Such information is used to identify the exact melting point and view specific soldering behavior in order to achieve an optimized soldering solution. This approach can provide effective solder joint analysis, which can reduce the likelihood of failure of a circuit board intended to operate in extreme environments for an extended period of time, such as the stratosphere.

An inspection position identification method that allows accurate inspection to be performed without in-advance identification of the position of an inspection plane in an inspected target. A three-dimensional image generation method that allows generation of a three-dimensional image for inspection without in-advance identification of the position of an inspection plane in an inspected target and then allows inspection to be performed. An inspection device including the methods. An inspection device includes a storage unit, which stores a radiation transmission image of an inspected object and a three-dimensional image generated from the radiation transmission image, and a control unit. The process carried out by the control unit for identifying an inspection position in a three-dimensional image includes identifying the position of a transmission picture of the inspection position in the radiation transmission image and identifying the inspection position in the three-dimensional image from the position of the transmission picture.