A sensor module includes a circuit board, a sensor element having a detection axis along a planar direction of the circuit board, a sensor package accommodating the sensor element and mounted on the circuit board, a board land pattern used for mounting the sensor package disposed on the circuit board, and a package electrode disposed on a mounting surface of the sensor package facing the circuit board and joined to the board land pattern by a solder. A relationship of Xp≤X1 is satisfied, in which Xp is a width of the board land pattern in a first direction along the planar direction of the circuit board, and X1 is a width of the package electrode in the first direction.

There is provided an angular velocity sensor including first and second mass bodies provided within a first frame, a first flexible connector system connecting the first and second mass bodies and the first frame and that includes at least one sensor to detect displacements of the first and second mass bodies, a second flexible connector system connecting the first frame to a second frame provided separate from the first frame and that includes a driver to drive movement of the first frame relative to the second frame, so angular velocities can be measured based on the first and second mass bodies being enabled to rotate in a first axis direction and translated in a second axis direction, and based on the first frame being flexibly connected to the second frame so that a rotation displacement of the first frame is made in a third axis direction.

An acceleration sensor includes a circuit board with a recess that exposes a spring structure. The spring structure is formed from a material of the circuit board exposed by the recess and includes a vibrating element that is held in a resilient manner via at least one spring element. The sensor further includes a reference element connected rigidly to the circuit board and arranged at a distance from and opposite the vibrating element, an electrical circuit arranged on the vibrating element at a distance from the reference element, and at least one detection element. The circuit is configured to evaluate a signal that is configured to be influenced by a change in distance between the reference element and the at least one detection element in order to sense an acceleration of the acceleration sensor.

An acceleration sensor includes a circuit board with a recess that exposes a spring structure. The spring structure is formed from a material of the circuit board exposed by the recess and includes a vibrating element that is held in a resilient manner via at least one spring element. The sensor further includes a reference element connected rigidly to the circuit board and arranged at a distance from and opposite the vibrating element, an electrical circuit arranged on the vibrating element at a distance from the reference element, and at least one detection element. The circuit is configured to evaluate a signal that is configured to be influenced by a change in distance between the reference element and the at least one detection element in order to sense an acceleration of the acceleration sensor.

Small form-factor MEMS devices and methods of using the devices are disclosed. An exemplary MEMS device includes an accelerometer contact microphone. Certain devices described herein comprise nanometer scale sensing gaps in the out-of-plane direction to increase vibration sensitivity in a vacuum casing. Certain devices described herein provide a differential sensing mechanism. The disclosure also describes accelerometer contact microphones having an operational bandwidth ranging from 0 Hz and 10,000 Hz. The vibration acceleration sensitivity of certain devices described herein is better 100 μg√Hz.

Small form-factor MEMS devices and methods of using the devices are disclosed. An exemplary MEMS device includes an accelerometer contact microphone. Certain devices described herein comprise nanometer scale sensing gaps in the out-of-plane direction to increase vibration sensitivity in a vacuum casing. Certain devices described herein provide a differential sensing mechanism. The disclosure also describes accelerometer contact microphones having an operational bandwidth ranging from 0 Hz and 10,000 Hz. The vibration acceleration sensitivity of certain devices described herein is better 100 μg√Hz.

A mechanical link for microelectromechanical and/or nanoelectromechanical structure, includes a mobile component, a fixed component extending on a plane, and apparatus for detecting displacement of the mobile component relative to the fixed component. The mechanical link includes: a first link to the fixed component and mobile component, allowing rotation of the mobile component relative to the fixed component about an axis of rotation; a second link connecting the mobile component to the detection apparatus at a distance and perpendicular to the axis of rotation; a third link to the fixed component and detection apparatus, guiding the detection apparatus in a direction of translation in the plane; wherein the combination of the second link and third link can transform rotational movement of the mobile component into translational movement of the detection apparatus in the direction of translation. The detection apparatus includes a piezoresistive/piezoelectric strain gauge, resonance beam, capacitance, or combination thereof.

A mechanical link for microelectromechanical and/or nanoelectromechanical structure, includes a mobile component, a fixed component extending on a plane, and apparatus for detecting displacement of the mobile component relative to the fixed component. The mechanical link includes: a first link to the fixed component and mobile component, allowing rotation of the mobile component relative to the fixed component about an axis of rotation; a second link connecting the mobile component to the detection apparatus at a distance and perpendicular to the axis of rotation; a third link to the fixed component and detection apparatus, guiding the detection apparatus in a direction of translation in the plane; wherein the combination of the second link and third link can transform rotational movement of the mobile component into translational movement of the detection apparatus in the direction of translation. The detection apparatus includes a piezoresistive/piezoelectric strain gauge, resonance beam, capacitance, or combination thereof.

A vibration rectification error correction device includes a reference signal generation circuit configured to output a reference signal, a frequency delta-sigma modulation circuit configured to perform a frequency delta-sigma modulation on the reference signal using a measurement target signal to generate a frequency delta-sigma modulation signal, a first filter which is disposed in a posterior stage of the frequency delta-sigma modulation circuit, and operates in sync with the measurement target signal, and a second filter which is disposed in a posterior stage of the first filter, and operates in sync with a first frequency signal asynchronous with the reference signal.

A vibration rectification error correction device includes a reference signal generation circuit configured to output a reference signal, a frequency delta-sigma modulation circuit configured to perform a frequency delta-sigma modulation on the reference signal using a measurement target signal to generate a frequency delta-sigma modulation signal, a first filter which is disposed in a posterior stage of the frequency delta-sigma modulation circuit, and operates in sync with the measurement target signal, and a second filter which is disposed in a posterior stage of the first filter, and operates in sync with a first frequency signal asynchronous with the reference signal.