Presented are one or more embodiments of a device which includes a case and a sensor device. The case includes a first indent configured to secure an electronic device, the first indent in a first side of the case, a second indent in a second side of the case opposite the first side, the second indent extending from a first edge of the case in a first direction such that second indent is open at the first edge of the case, and a securing device in the second indent. The sensor device includes an outer casing configured to slide in the first direction in the second indent and at least partially prevented from leaving the second indent by the securing device, and a sensor at least partially in the outer casing.

A current measurement component including a bridging portion bridging a pair of side surface portions, a pair of coaxial components attached to the pair of side surface portions, respectively, each coaxial pair including an inner conductor that extends through a hole formed in a corresponding side surface portion of the pair of side surface portions, a connection portion electrically connecting the inner conductors of the pair of coaxial components, and a tube-like portion enclosing the connection portion with a gap formed between the tube-like portion and an outer peripheral portion of the connection portion. The pair of side surface portions and the bridging portion are electrically conductive and electrically connected, and the tube-like portion includes a base end portion electrically connected to a first side surface portion of the pair of side surface portions and a distal end portion electrically separated from the outer conductor of coaxial component pairs.

A sensor apparatus comprises an electrically conductive chip carrier comprising a busbar, a first connection and a second connection, and a differential magnetic field sensor chip which is arranged on the chip carrier and has two sensor elements. The form of the busbar is such that a measurement current path running from the first connection to the second connection through the busbar comprises a main current path and a bypass current path, wherein the main current path and the bypass current path run parallel to one another, and a bypass current flowing through the bypass current path is less than a main current flowing through the main current path. The magnetic field sensor chip is configured to capture a magnetic field induced by the bypass current.

Methods and apparatus for a current sensor having an elongate current conductor having an input and an output and a longitudinal axis. First, second, third and fourth magnetic field sensing elements are coupled in a bridge configuration and positioned in a plane parallel to a surface of the current conductor such that the second and fourth magnetic field sensing elements comprise inner elements and the first and third magnetic field sensing elements comprise outer elements. Embodiments of the sensor reduce the effects of stray fields on the sensor.

A magnetic core for a current sensor is provided. The magnetic core comprises a first and a second core part, each of which is formed from a stack made up of a plurality of sheet metal layers. The second core part has a first end piece structured such that some of the sheet metal layers are longer and protrude beyond the remaining, shorter sheet metal layers. The first core part has a second end piece which is structured inversely to the first end piece of the second core part. The first core part and the second core part are joined together at a connection point such that the longer sheet metal layers of the first end piece and the second end piece overlap at the connection point, wherein the overlap takes place at a number of interfaces that is at least two less than the number of sheet metal layers.

A current-measuring transducer device has a current transducer for measuring an electric current along a conduction path. The current transducer has a magnetic field-sensitive element for converting the magnetic field resulting from the current flow along the conduction path into at least one physical variable and a measuring device for measuring the physical variable. The current transducer device has a coil arrangement with at least one coil for simulating the magnetic field resulting from the current flow along the conduction path. There is also described a method for calibrating a corresponding current transducer and a computer program product for performing the calibration method.

A current sensor includes a magnetic detection unit capable of detecting the magnetism, a first magnetic shield and a second magnetic shield. The first magnetic shield includes a first shield section and two second shield sections respectively connected in the vicinity of the two ends thereof. The second magnetic shield includes a third shield section and two fourth shield sections respectively connected in the vicinity of the two ends thereof. Between the first shield section and the third shield section is a conductor placement region, and the magnetic detection unit is positioned between the first shield section and the conductor placement region and is provided at a magnetic field canceling position where the magnetic field in the second direction is substantially zero at non-energized times after a prescribed current has flowed in the conductor, in relationship to the length of the two fourth shield sections along the third direction.

A current sensor is described comprising an integrated circuit for sensing electric currents comprising an active side, the active side comprising at least one sensing element and at least one contact pad and a housing comprising material embedding the integrated circuit arranged for allowing electric connection to the at least two contact pads of the active side of the integrated circuit. The housing comprises at least one conductive via disposed outside the integrated circuit and connected to the at least one contact pad, for distributing signals from the at least one contact pad through the housing away from the active side of the integrated circuit.

A power semiconductor module includes: an electrically insulative frame having opposite mounting sides and a border wall that defines a periphery of the frame; a substrate seated in the frame; power semiconductor dies attached to the substrate; signal pins attached to the substrate and electrically connected to the power semiconductor dies; a busbar attached to the substrate and extending through the border wall; a receptable in the border wall configured to receive a current sensor module and that exposes part of the busbar, the exposed part of the busbar having an opening; and a rotation bar jutting out from a sidewall of the receptable and onto the exposed part of the busbar without obstructing the opening in the busbar, wherein the rotation bar forms an axis of rotation within the receptable. A power electronic assembly that incorporates the power semiconductor module and corresponding method of production are also described.

Various embodiments of the teachings herein include an apparatus for measuring a magnetic field of a conductor of an electric current. The apparatus may include three magnetic field sensors arranged on a circumference of a non-circular ellipse. The three magnetic field sensors are arranged equidistantly along the circumference of the ellipse. The magnetic field is measured without using a flux concentrator.