A damage predicting device of a power semiconductor switching element includes a resistor connected to a gate of the power semiconductor switching element, and control circuitry. The control circuitry compares a detection voltage matching a voltage generated between two ends of the resistor and a reference voltage, and predicts that predetermined damage has been accumulated in a gate insulating layer in the power semiconductor switching element when the detection voltage exceeds the reference voltage.

An audio system includes an H-bridge. The audio system implements one or more techniques for ensuring a transistor within the H-bridge does not turn on in the event of the detection of a short-circuit on the output of the H-bridge. Other transistors within the H-bridge can turn and thus audio can still be played to a speaker.

Disclosed are a method and apparatus for determining electrical characteristics of a transistor, and a computer-readable storage medium. The method for determining electrical characteristics of a transistor includes: determining mobility characteristics of carriers in channels of the transistor at a transistor operating temperature condition; and determining electrical characteristics of the transistor based on the mobility characteristics of the carriers, semiconductor material properties of the transistor, and structural features of the transistor.

An object is to provide a semiconductor device that implements cost reduction as well as determination of withstand voltage characteristics. A semiconductor substrate includes a semiconductor element on the front surface thereof and a back surface electrode on the back surface thereof that controls the operation of the semiconductor element. A first electrode and a second electrode are provided in a terminal region outside an active region in which the semiconductor element is formed. An insulating film is provided between the first electrode and the second electrode. The second electrode is provided on an insulating interlayer film provided on the front surface of the semiconductor substrate. The first electrode is in contact with the front surface of the semiconductor substrate and is provided on the semiconductor substrate closer to an end portion thereof than the second electrode is, and is electrically connected to the back surface electrode.

A power system including a gate driver configured with test circuitry to detect faults is disclosed. The power system may be configured to test the fault detection circuitry in order to confirm its ability to detect faults. Various methods and circuit implementations are disclosed to determine the ability of the system to detect faults. The testing may include different configurations and protocols in order to make conclusions about which components are likely responsible for a failure. These components may include components included in the gate driver or externally coupled to the gate driver. The disclose approach does not significantly add complexity because a test input to initiate a test may be communicated from a low voltage side to a high voltage side over a shared communication channel.

A circuit for detecting faults affecting a power transistor comprises a conditioning circuit, a first fault status circuit, and a fault signaling circuit. The power transistor is turned on and off by assertion and de-assertion, respectively, of an input signal. The conditioning circuit produces a conditioned gate voltage signal from a gate voltage of the power transistor. The first fault status circuit asserts a first fault indication when the conditioned gate voltage signal is greater than a first fault reference voltage during a first interval after the assertion of the input signal. The fault signaling circuit asserts a fault signal in response to the first fault indication being asserted, and de-asserting the fault signal in response to the input signal being de-asserted.

An apparatus and methods to operate the same to provide fast fault-detection on power semiconductor devices such as power transistors are disclosed. In some embodiment, a desaturation based fault-detection circuit for a power transistor is provided. The fault-detection circuit has an adaptable blanking time and a disconnect switch in the blanking mechanism that allow for quick enabling of fault-detection mechanisms to achieve fast fault detection times on power semiconductor devices.

In an embodiment, a method for testing a functional integrity of a transistor component, the method includes causing a first change of a charge state of an internal capacitance between control terminals of the transistor component; determining a capacitance value of the internal capacitance based on the first change of the charge state; causing a second change of the charge state of the internal capacitance; and evaluating a resistance value of an internal resistance between the control terminals based on the determined capacitance value and the second change of the charge state.

A power conversion device including a switching element includes: a temperature change estimation unit estimating temperature change in a semiconductor chip containing the switching element; a number calculator calculating the number of power cycles to fracture of the semiconductor chip due to power cycles; and a degradation degree calculator computing a degree of degradation of the semiconductor chip caused by the power cycles. The temperature change estimation unit calculates a maximum value and a minimum value of temperature of the semiconductor chip in one power cycle based on a first threshold of temperature fall allowed when it is determined that the temperature of the semiconductor chip is rising, and a second threshold of temperature rise allowed when it is determined that the temperature of the semiconductor chip is falling. The number calculator calculates the number of power cycles to fracture based on the maximum value and the minimum value.

Methods of characterizing electrical properties of a semiconductor layer structure on a wafer with topside semiconductor layers on an insulating or semi-insulating substrate, the semiconductor layer structure including a high electron mobility transistor (HEMT) heterostructure with a two-dimensional electron gas (2DEG) at a heterointerface between the semiconductor layers of the heterostructure. The methods include: (a) physically contacting the topside of the wafer within a narrow border zone at an edge of the wafer with a flexible metal cantilever electrode of a contacting device, wherein the flexible metal cantilever electrode contacts one or more of the semiconductor layers exposed at the narrow border zone so that the flexible metal cantilever electrode is in electrical contact with the 2DEG; and (b) applying corona charge bias and measuring a surface voltage of the semiconductor layers using a non-contact probe while maintaining the electrical contact with the 2DEG. The physical contacting to the topside of the wafer is noncontaminating and noninvasive to the semiconductor layers.