First and second measurement probes come into contact with first and second electrode pads, respectively, and third and fourth measurement probes come into contact with the first and second electrode pads, respectively. A current flows in a current path including the first and second electrode pads and a plurality of lines through the first and second measurement probes. A value of the current in the current path is measured, and a value of a voltage between the third and fourth measurement probes is measured. Conductivity between the first and second electrode pads is inspected based on the measured value of the current and the measured value of the voltage.

A system for testing multiple devices includes a connector holder having a plurality of holes, wherein each hole included in the plurality of holes is configured to hold a respective cable connector that connects to a cable; a device holder that is configured to hold a first device in a testing position; and an engagement mechanism that supports the connector holder and is operable to move the connector holder to an engaged position, wherein when the first device is being held by the device holder in the testing position, and a first hole included in the plurality of holes holds a first cable connector, a contact point associated with the first cable connector contacts a signal pad associated with the first device.

A test system for a memory card includes a first circuit board. One side of the first circuit board is provided with a plurality of contact groups spaced apart from each other along a row direction. Another side of the first circuit board is provided with slots disposed along the row direction. The test system further includes a second circuit board. The second circuit board is provided with a test circuit, and is inserted into the slot along a direction perpendicular to the first circuit board. The second circuit board provides a test signal to the contact groups.

A circuit board testing apparatus detects sparking and partial discharge between wiring patterns on a circuit board to determine if the circuit board is defective. A constant current source feeds a constant current to a wiring pattern to be tested. A voltage measurement part measures the resulting voltage at the wiring pattern. A normal state voltage gradient calculation part calculates a voltage gradient in a normal state where there is no sparking or partial discharge. A determination part determines whether the voltage gradient remains invariant, by comparing voltage measurement results within a predetermined range with an estimated value of the voltage based on the voltage gradient in the normal state. The determination part determines whether a circuit board is defective, on the basis of whether the voltage gradient remains invariant.

A printed board with a wiring pattern for detecting deterioration includes an insulating substrate, a wiring pattern group that is formed on the insulating substrate and includes a wiring pattern for detecting deterioration; and a solder resist covering the wiring pattern group, in which the board has a thin film section, and a thick film section in which a thickness of the solder resist is larger than the thin film section, and the wiring pattern for detecting deterioration is formed in the thin film section whose entire surrounding area or partial surrounding area is surrounded by the thick film section.

The present disclosure provides a test probe and an apparatus for testing a printed circuit board, wherein the test probe comprises a test pin; and an insulating protection sleeve with adhesive attached therein, wherein the insulating protection sleeve is sleeved on the test pin, and wherein a first end of the test pin protrudes from the insulating protection sleeve.

An inspection system and an inspection method of a bare circuit board are provided. The inspection system is used for inspecting a bare circuit board. The bare circuit board includes a chip pad and an antenna. The inspection system includes an adapter board, a test device and a measure device. The adapter board includes a chip and a contact structure. The chip is electrically connected to the contact structure. The contact structure touches the chip pad so that the chip is electrically connected to the chip pad. The test device includes a transceiver antenna. The test device and the bare circuit board separate. The measure device is electrically connected to the chip or the transceiver antenna.

A board inspection apparatus system includes a first apparatus, a second apparatus, a third apparatus and an information transfer section. The first apparatus acquires first three-dimensional information of a solder paste on a board, and inspects whether the solder paste is formed good by a first tolerance based on the first three-dimensional information. The second apparatus mounts an electronic component on the board to join the electronic component and the solder paste. The third apparatus acquires second three-dimensional information of a solder joint, and inspects whether the electronic component is mounted good by a second tolerance based on the second three-dimensional information. The information transfer section transfers the first three-dimensional information to the third apparatus, or transfers the second three-dimensional information to the first apparatus. Thus, a more effective inspection condition may be established, and a rate of defect for each apparatus may be greatly reduced.

A flying probe includes a test module and a processor. The test module measures a plurality of delta capacitances associated with a plurality of vias in a printed circuit board. The plurality of vias include first, second, third and fourth vias. Each different delta capacitance is measured between a different pair of the vias. The processor compares all the delta capacitances to a threshold value. In response to multiple delta capacitances associated with the first via being greater than or equal to the threshold value, the processor detects a possible via stripping issue for the first via.

An anisotropic conductive sheet, in which the arrangement interval of the structure that exhibits conductivity in a planar section is relatively small, comprises an elastic layer having resin as the main component, and a plurality of CNT pillars that are formed from CNT fiber bundles and penetrate the elastic layer in the thickness direction. The electrical inspection head measures electrical characteristics between a plurality of measurement points of a measurement target, and comprises a measurement substrate having a plurality of electrode pads on its surface that opposes the measurement points, and an anisotropic conductive sheet laminated on that surface. The method for manufacturing an anisotropic conductive sheet comprises growing a plurality of CNT pillars formed from CNT fiber bundles by chemical vapor deposition by arranging catalysts on the surface of a growth substrate, and filling the space between the plurality of CNT pillars with a resin composition.