The disclosure describes a test support module for supporting a test of at least one device under test (DUT). The test support module comprises a plurality of pogo pins configured to establish a connection to at least one of a load board or a probe card of an automated test equipment and at least one electronic support component configured to support a test of at least one DUT. The at least one electronic support component is electrically coupled to the pogo pins. The test support module is configured to be inserted into a pogo block frame of the automated test equipment to position the pogo pins in an alignment position to contact at least one of the load board or the probe card. The testing innovation is more efficient in view of customization, life duration of the components, high signal performance, tester channel resources, re-usability, and costs.

Embodiments of the present invention provide an automated test equipment (a “tester”) for testing a device under test, including a bidirectional dedicated real-time handler interface. Some embodiments include an interface having a trigger function, a fixed endpoint interface, an interface arranged on a test head, and/or a number of lines/communication channels adapted to a specific communication task, without separate signal lines, for example. The bidirectional dedicated real-time handler interface can be used to transmit a synchronization signal or other information to the handler in real-time, and the transmitted signal can be test site specific. The real-time signaling advantageously improves testing accuracy and efficiency.

An apparatus for performing multiple tests on a device under test (DUT) are provided. The apparatus includes at least one non-transitory computer-readable medium having stored thereon computer-executable instructions and at least one processor coupled to the at least one non-transitory computer-readable medium. The computer-executable instructions are executable by the at least one processor and cause the apparatus to perform operations of inputting a plurality of test patterns to a test apparatus, performing each of the plurality of test patterns on the DUT without interruption, and obtaining a respective result for the DUT in response to each of the plurality of test patterns.

A method and non-transitory computer-readable medium for performing multiple tests on a device under test (DUT) are provided. The method includes inputting a plurality of test patterns to a test apparatus, performing each of the plurality of test patterns on the DUT without interruption, and obtaining a respective result for the DUT in response to each of the plurality of test patterns.

Embodiments are directed to a computer implemented method and system for the testing, characterization and diagnostics of integrated circuits. A system might include a device under test, such as an integrated circuit, that includes an adaptive microcontroller. The method includes loading a testing program for execution by the adaptive microcontroller, causing the microcontroller to execute the testing program. Once results from the testing program are received, the testing program can be adaptively modified based on the results. The modified testing program can be run again. The testing program can modify parameters of the integrated circuit that are not externally accessible. Other embodiments are also disclosed.

An automatic robot control system and methods relating thereto are described. These systems include components such as a touch screen panel (“TSP”) robot controller for controlling a TSP robot, a camera robot controller for controlling a camera robot and an audio robot controller for controlling an audio robot. The TSP robot operates inside a TSP testing subsystem, the camera robot operates inside a camera testing subsystem, and the audio robot operates inside an audio testing subsystem. Inside the audio testing subsystem, an audio signals measurement system, using a bi-directional coupling, controls the operation of the audio robot controller. In this control scheme, a test application controller is designed to control the different types of subsystem robots.

Methods relating to TSP, camera, and audio robots, and their controllers, taken individually or in combination, for automatic testing of device functionalities are also described.

A clamp circuit comprises an output transistor and a replica transistor coupled as a current minor pair, wherein the replica transistor is scaled in size to the output transistor by a size ratio; a first current source configured to set a current in the replica transistor, wherein the output current is set at a clamped output current value that is a sum of current of the first current source and a scaled value of the current of the first current source determined according to the size ratio; and a register circuit, wherein a register value stored in the register circuit sets the clamped output current value.

An automatic robot control system and methods relating thereto are described. These systems include components such as a touch screen panel (“TSP”) robot controller for controlling a TSP robot, a camera robot controller for controlling a camera robot and an audio robot controller for controlling an audio robot. The TSP robot operates inside a TSP testing subsystem, the camera robot operates inside a camera testing subsystem, and the audio robot operates inside an audio testing subsystem. Inside the audio testing subsystem, an audio signals measurement system, using a bi-directional coupling, controls the operation of the audio robot controller. In this control scheme, a test application controller is designed to control the different types of subsystem robots. Methods relating to TSP, camera, and audio robots, and their controllers, taken individually or in combination, for automatic testing of device functionalities are also described.

A substrate rotator configured to rotate one or more substrates includes a body, a body actuator coupled to the body and configured to rotate the body, and a first and second gripper coupled to the body. A substrate edge metrology system that measures side chips or other defects on all sides of the substrate is also described. The metrology system includes two metrology stations and the substrate rotator. Methods for measuring side chips or other defects on a substrate are also provided. The method includes performing metrology on a first set of sides of the first substrate, rotating the first substrate by a first angle, and performing metrology on the second set of sides of the first substrate.

A method for analyzing device test data includes accessing a core analytics rule that is based on manufacturing data of a plurality of devices. Each of the plurality of devices are produced in one of a plurality of manufacturing facilities and are of a same type as a first device being tested on a tester. The method also includes receiving initial test results of a plurality of other devices of a same type tested at a testing facility, generating, based on the initial test results, an edge analytics rule, modifying the core analytics rule based on the edge analytics rule, wherein the modified core analytics rule including modified binning limits, applying the modified core analytics rule to testing data obtained by testing the first device, and determining, based on applying the modified core analytics rule, that the first device is an outlier with respect to the modified binning limits.