An example integrated circuit (IC) die in a multi-die IC package, the multi-die IC package having a test access port (TAP) comprising a test data input (TDI), test data output (TDO), test clock (TCK), and test mode select (TMS), is described. The IC die includes a Joint Test Action Group (JTAG) controller having a JTAG interface that includes a TDI, a TDO, a TCK, and a TMS, a first output coupled to first routing in the multi-die IC package, a first input coupled to the first routing or to second routing in the multi-die IC package, a master return path coupled to the first input, and a wrapper circuit configured to couple the TDI of the TAP to the TDI of the JTAG controller, and selectively couple, in response to a first control signal, the TDO of the TAP to either the master return path or the TDO.

A built-in self test system comprises an integrated circuit device comprising a plurality of functional units coupled to built-in self test circuitry; a low power control unit operable to switch the integrated circuit device into a low power mode and to generate a BIST wake-up signal during or before entering the low power mode; and a built-in self test control unit coupled to the built-in self test circuitry and the low power control unit and arranged to initiate a built-in self test when receiving the BIST wake-up signal.

A wafer-level method of testing an integrated circuit (IC) device includes: (i) applying a plurality of test operation signals to a wafer containing the IC device, (ii) generating a test enable signal in response to detecting, on the wafer, a toggling of at least one of the plurality of test operation signals, and then (iii) testing at least a portion of the IC device in response to the generating the test enable signal. The generating may also include generating a test enable signal in response to detecting, on the wafer, an inactive-to-active transition of a toggle detection signal.

Systems and methods for testing printed circuit boards (PCBs) are disclosed herein. In one embodiment, a tester for printed circuit boards (PCBs) includes a test fixture having a plurality of electrical contacts for contacting the PCBs that are units under test (UUTs). The test fixture carries a remote test peripheral master (RTPM) module, and a remote test peripheral slave (RTPS) module. The RTPM module and the RTPS module are connected through a remote test peripheral (RTP) bus.

Presented embodiments facilitate efficient and effective flexible implementation of different types of testing procedures in a test system. In one embodiment, a test system comprises pre-qualifying test components, functional test components, a controller, a transceiver, and a switch. The pre-qualifying test components are configured to perform pre-qualifying testing on a device under test. The functional test components are configured to perform functional testing on the device under test. The controller is configured to direct selection between the pre-qualifying testing and functional testing. The transceiver is configured to transmit and receive signals to/from the device under test. The switch is configured to selectively couple the transceiver to the pre-qualifying test components and functional test components.

Multi-bit data flip-flops are disclosed that provide bit initialization through propagation of scan bits. Input multiplexers are configured to select between input data bits and input scan bits based upon mode select signals. Master latches receive and latch outputs from the input multiplexers. Slave latches receive and latch outputs from the master latches and also provide propagated input scan bits to the input multiplexers. A first state for the mode select signals selects the input data bits for a data mode of operation, and a second state for the mode select signals selects the input scan bits for a scan mode of operation. Further, the input multiplexers, master latches, and slave latches are configured to operate in an initialization mode to pass a fixed input scan bit through the multi-bit data flip-flop based upon initialization signals (e.g., set and/or reset signals).

A method to bypass a voltage regulator of a system on a chip (SOC) comprising powering a first power domain using a voltage regulator; powering a second power domain using the voltage regulator; coupling a third power domain with an external voltage source; raising an external voltage supply from the external voltage source above a threshold level of the voltage regulator; coupling the first second power domains to the external voltage source; turning OFF the voltage regulator of the SOC after coupling the first power domain of the SOC and the second power domain of the SOC to the external voltage source; and powering the first power domain of the SOC, the second power domain of the SOC, and the third power domain of the SOC with the external voltage source, the external voltage source bypassing the voltage regulator.

A deskew fixture includes first and second deskew probe points for contacting first and second probes, respectively, during deskew calibration, a signal generating circuit for generating a calibration signal provided to the first and second deskew probe points, and a feedback loop for automatically self-calibrating the deskew fixture. The feedback loop includes first and second analog to digital converters (ADCs) for digitizing the calibration signal at the first and second deskew probe points while contacting the first and second probes, respectively, to provide first and second digitized calibration signals, and a processing unit programmed to determine inherent skew of the deskew fixture between the first and second skew probe points using the first and second digitized calibration signals, and to provide the determined inherent skew to a test instrument for use in the deskew calibration of the first and second probes.

The present disclosure provides a method of testing a single device under test (DUT) through multiple cores in parallel, which includes steps as follows. The test quantity of the DUT is calculated; the test quantity of the DUT is evenly allocated to to a plurality of test cores, so as to control a period of testing the DUT through the test cores in parallel.

Disclosed is an integrated circuit (1) including two electrical power supply terminals (2a, 2b), respectively positive and ground, forming part of a first electrical power supply system (2) internal to the integrated circuit and providing its electrical power supply using an electrical power supply source external to the integrated circuit. The integrated circuit includes two pins (3a, 3b), respectively positive and ground, forming part of a second electrical power supply system (3) and providing an auxiliary electrical connection of the integrated circuit with the outside, the second power supply system being in parallel with the first power supply system, the first power supply system being open when the second power supply system is closed and vice versa.