Patent classifications
G01R31/31712
Device for detecting margin of circuit operating at certain speed
Disclosed is a device for detecting the margin of a circuit operating at an operating speed. The device includes: a signal generating circuit generating an input signal including predetermined data; a first adjustable delay circuit delaying the input signal by a first delay amount and thereby generating a delayed input signal; a circuit under test performing a predetermined operation based on a predetermined operation timing and thereby generating a to-be-tested signal according to the delayed input signal; a second adjustable delay circuit delaying the to-be-tested signal by a second delay amount and thereby generating a delayed to-be-tested signal; a comparison circuit comparing the data included in the delayed to-be-tested signal with the predetermined data based on the predetermined operation timing and thereby generating a comparison result; and a calibration circuit determining whether the circuit under test passes a speed test according to the comparison result.
CONFIGURABLE HARDWARE PLATFORM FOR MEASUREMENT OR CONTROL
Systems for monitoring or control can include reconfigurable input and output channels. Such reconfigurable channels can include as few as a single terminal and a ground pin, or such channels can include three or four terminal configuration such as for use in four-terminal resistance measurements. Channel reconfiguration can be accomplished such as using software-enabled or firmware-enabled control of channel hardware. Such channel hardware can include analog-to-digital and digital-to-analog conversion capability, including use of a digital-to-analog converter to provide field power or biasing. In an example, the interface circuit can provide a selectable impedance.
SYSTEM AND METHOD FOR TESTING CRITICAL COMPONENTS ON SYSTEM-ON-CHIP
A system-on-chip (SoC) includes multiple critical components and a testing system to test the critical components. The critical components include an intellectual property (IP) core and an associated logic circuit. The testing system includes a controller, a fault injector, and a masking circuit. The controller is configured to receive a test initiation request and generate first and second select instructions. The fault injector is configured to generate and inject a set of fault inputs in the logic circuit based on the first select instruction to test the associated logic circuit and the IP core. The IP core is configured to generate a set of responses that is associated with the testing of the logic circuit and the associated IP core. The masking circuit is configured to mask and output the set of responses when the second select instruction indicates a first value and a second value, respectively.
Device monitoring using satellite ADCS having local voltage reference
Systems and methods for monitoring a number of operating conditions of a programmable device are disclosed. In some implementations, the system may include a root monitor including circuitry configured to generate a reference voltage, a plurality of sensors and satellite monitors distributed across the programmable device, and a network-on-chip (NoC) interconnect system coupled to the root monitor and to each of the plurality of satellite monitors. Each of the satellite monitors may be in a vicinity of and coupled to a corresponding one of the plurality of sensors via a local interconnect.
Implementing a JTAG device chain in multi-die integrated circuit
An example integrated circuit (IC) die in a multi-die IC package, the multi-die IC package having a test access port (TAP) comprising a test data input (TDI), test data output (TDO), test clock (TCK), and test mode select (TMS), is described. The IC die includes a Joint Test Action Group (JTAG) controller having a JTAG interface that includes a TDI, a TDO, a TCK, and a TMS, a first output coupled to first routing in the multi-die IC package, a first input coupled to the first routing or to second routing in the multi-die IC package, a master return path coupled to the first input, and a wrapper circuit configured to couple the TDI of the TAP to the TDI of the JTAG controller, and selectively couple, in response to a first control signal, the TDO of the TAP to either the master return path or the TDO of the JTAG controller.
Scan output flip-flop with power saving feature
A scan output flip-flop includes a selection circuit, a control circuit, and a scan-out stage circuit. The selection circuit is controlled by a first test enable signal to transmit a data signal on a first input terminal or a test signal on a second input terminal to an output terminal to serve as an input signal. The control circuit is controlled by a first clock signal and a second clock signal to generate a first control signal and a second control signal according to the input signal. The scan-out stage circuit receives only one of the first control signal and the second control signal, and is controlled by the first test enable signal and a second test enable signal to generate a scan-out signal.
Method for characterization of standard cells with adaptive body biasing
A method for an improved characterization of standard cells in a circuit design process is disclosed. Adaptive body biasing is considered during the design process by using simulation results of a cell set, a data-set for performance of the cell set, and a data-set for a hardware performance for a slow, typical and fast circuit property. Static deviations in a supply voltage are considered by determining a reference performance of a cell and a reference hardware performance monitor value at a PVT corner. A virtual regulation and adapting of body bias voltages of the cell set is performed such that the reference performance of the cell or the reference hardware performance monitor value will be reached at each PVT corner and for compensating the static deviation in the supply voltage. The results are provided in a library file.
Electronic chip with analog input and output
An electronic chip includes an analog input connection pad and an analog output connection pad. A switch is coupled between the analog input connection pad and the analog output connection pad. In one embodiment, the chip operates in a self-test mode and in an active mode. The switch is closed only in the self-test mode.
Safety circuit and method for testing a safety circuit in an automation system
A safety circuit for the multi-channel processing of an input signal. The safety circuit includes an analog-to-digital conversion device having a first analog input and a second analog input and at least one digital output for processing the input signal. Furthermore, the safety circuit has a test device which is set up to apply a test signal at the first and/or second input of the A/D conversion device in such a way that the test signal superposes the input signal such that the test signal dominates the input signal.
Frequency-based built-in-test for discrete outputs
A method is provided for testing discrete output signals of a device-under-test (DUT). The method includes receiving an electrical quantity at each conductive path of a plurality of conductive paths that are each coupled to respective discrete output signals of the DUT in one-to-one correspondence. The method further includes controlling application of the electrical quantity to each of the conductive path independent of application of the electrical quantity along the other conductive paths, so that a the electrical quantity is applied simultaneously to all of the conductive paths, the electrical quantity applied to each conductive path being toggled at a unique frequency having a unique period. Accordingly, a characteristic of the electrical quantity at each of the respective test output conductors over the duration of the longest period of the unique periods is indicative of any disturbance between the discrete output signals associated with the test output conductor and all of the other discrete output signals.