An apparatus for testing a device under test (DUT) is provided. The apparatus includes a power supply device and a data generating device. The power supply device is configured to provide a first voltage and a second voltage to the DUT. The data generating device is configured to provide first data to the DUT. The power supply device is configured to provide the first voltage to the DUT in a first time duration. The data generating device is configured to provide the first data to the DUT in the first time duration. The power supply device is configured to provide the second voltage to the DUT in a second time duration after the first time duration. The second voltage is different from the first voltage.

An apparatus configured to test an electrical system including one or more power supplies, a load, and one or more protective-isolation devices disposed between the one or more power supplies and the load is disclosed. The apparatus has a first measurement assembly configured to sense a first voltage or a first current at an input side of the one or more power supplies, a second measurement assembly configured to sense a second voltage or a second current at an output side of the one or more power supplies, and a third voltage or a third current between the one or more protective-isolation devices and the load, and a power controller electrically disposed between the second or third measurement assembly and a fault assembly. The fault assembly and the power controller are configured to selectively induce a fault, which is selected from a plurality of fault types, either to the output side of the electrical system or between the one or more protective-isolation devices and the load.

Methods for testing an application specific integrated circuit (ASIC). A set of representations is created that overlays power density information and clock gate physical locations of a set of clock gates in a critical sub-chip of the ASIC for test mode power analysis. The set of representations are further grouped in the sub-chip into various groups based on overlapping of the set of representations. Then, a set of test control signals is generated corresponding to each of the set of clock gates during at-speed test mode of operation such that each clock gate with overlapping representations receive different test control signals. Further, patterns are generated using a virtual constraint function to selectively enable the set of test control signals such that the set of test control signals are not activated simultaneously.

In an embodiment a method for testing a digital electronic circuit includes coupling an external test equipment to a digital electronic circuit in order to apply an external voltage signal to the digital electronic circuit when an automatic test pattern generation (ATPG) procedure with a given test pattern is performed, wherein a value of the external voltage signal is controlled by the external test equipment and measuring, at the external test equipment, the digital supply voltage at an output of the voltage regulator and at an input of the internal digital circuitry, wherein the external voltage signal is applied to the differential inputs of the op-amp voltage regulator through an adaptation circuit to obtain determined values of the digital supply voltage.

A method for testing a lifetime of a surface state carrier of a semiconductor, including the following steps, 1) a narrow pulse light source is used to emit a light pulse, and coupled to an interior of a near-field optical probe, and the near-field optical probe produces a photon-generated carrier on a surface of a semiconductor material under test through excitation. 2) The excited photon-generated carrier is concentrated on the surface of the semiconductor material, and recombination is conducted continuously with a surface state as a recombination center. 3) A change in a lattice constant is produced due to an electronic volume effect, a stress wave is produced, and a signal of the stress wave is detected in a high-frequency broadband ultrasonic testing mode. 4) Fitting calculation is conducted on the signal of the stress wave to obtain the lifetime of the surface state carrier τ.sub.c.

The invention discloses an extended joint test action group based controller and a method for functional debugging using the extended joint test action group based controller. The object of the invention to lower the power dissipation (dynamic and leakage) but providing the same functionality of the testing and debugging procedures at the same time will be solved by an extended joint test action group (JTAG) controller for testing flip-flops of a register of an integrated circuit (IC) using a design for testing scan infrastructure on the IC which comprises at least one scan chain, wherein an external debugger is connected to the design for testing scan infrastructure via the JTAG controller which is extended by a debug controller, whereas a feedback loop is formed from an output of the scan chain to an input multiplexer of the scan chain which is activated according to the extended JTAG controller.

A power verification circuit is provided. The power verification circuit includes a current source, a resistive random access memory (RRAM) cell and a Zener diode. The current source is coupled to a power terminal. The RRAM cell is coupled between the current source and a ground terminal. The Zener diode has an anode coupled to the RRAM cell and a cathode coupled to the power terminal. The impedance of the RRAM cell is determined by the power voltage applied to the power terminal.

An apparatus for providing a supply voltage to a device under test includes a controlled source configured to provide a voltage in dependence on one or more control signals; a switchable resistor circuited between the output of the controlled source and a DUT port, having first and second resistances in first and second switch states, respectively, the second resistance being smaller than the first resistance; a regulator configured to provide a control signal to the controlled source, to regulate a voltage to be provided to the DUT in dependence on information about a desired voltage; a capacitor circuited in parallel to the switchable resistor at least during switching of the switchable resistor and configured to slow a voltage change across the switchable resistor which is caused by changing a switch state of the switchable resistor; the apparatus being configured to change a switch state of the switchable resistor while a voltage is provided to the DUT via the switchable resistor.

Aspects of the invention include systems and methods directed to a portable chip tester. A non-limiting example of a system includes a housing, a printed circuit board mounted on the housing, in which the printed circuit board includes a first interface operable to permit electrical communication between the printed circuit board and a device under test. The system further includes a mount operable to enable an electrical connection with an integrated circuit, in which the integrated circuit is operable to manage testing the device under test under a testing protocol. The system further includes a power supply and a software platform that includes a memory having computer readable instructions and one or more processors for executing the computer readable instructions. The computer readable instructions controlling the processors to perform operations including directing the integrated circuit to manage testing of the device under test pursuant to the testing protocol.

A multi-bit flip-flop (MBFF) has flip-flops connected to form an internal scan chain. One of the flip-flops outputs a first data-out signal at a first data output terminal of the MBFF, and includes a selection circuit, a latch-based circuit, and a data-out stage circuit. The selection circuit transmits a data signal or a test signal to an output node of the selection circuit to serve as an input signal. The latch-based circuit generates a first signal according to the input signal. The data-out stage circuit receives the first signal, and generates the data-out signal according to the first signal. When the MBFF operates in a test mode, the selection circuit transmits the test signal to serve as the input signal, and the data-out stage circuit keeps the data-out signal at a fixed voltage level regardless of a voltage level of the test signal.