A system-on-chip integrated circuit device includes a plurality of functional circuit modules, at least a first circuit module of the plurality of functional circuit modules operating under a first protocol, the first protocol being an interface protocol for communicating outside the system-on-chip integrated circuit device, an interconnect fabric coupled to the functional circuit modules in the plurality of functional circuit modules, and a built-in self-test circuit module coupled to the interconnect fabric. The built-in self-test circuit is configured to test one or more selected functional circuit modules in the plurality of functional circuit modules, including at least the first circuit module under the first protocol for communicating outside the system-on-chip integrated circuit device, by routing test data through the one or more selected functional circuit modules.

The fully-automatic closed-loop detection method includes: comparing a SCD file of a to-be-tested substation with a device-type data template file, so as to determine whether configuration information about the to-be-tested substation is correct; when the configuration information about the to-be-tested substation is correct, parsing the SCD file of the to-be-tested substation and generating a SSD topological diagram of the to-be-tested substation; and acquiring a testing item from a predetermined testing item library in accordance with the SSD topological diagram of the to-be-tested substation, generating a testing scheme for the to-be-tested substation, performing a testing operation and outputting a testing result.

An integrated circuit includes a sub-system and a reference sub-system. The reference sub-system is substantially identical to the sub-system but is non-operating by default. The integrated circuit includes a test circuit that obtains a parameter value of the sub-system and a reference parameter from the reference sub-system. The integrated circuit detects deterioration of the sub-system based on the parameter value and the reference parameter. The integrated circuit deactivates the sub-system and activates the reference sub-system responsive to detecting deterioration of the sub-system.

Manufacturers perform tests on chips before the chips are shipped to customers. However, defects can occur on a chip after the manufacturer testing and when the chips are used in a system or device. The defects can occur due to aging or the environment in which the chip is employed and can be critical; especially when the chips are used in systems such as autonomous vehicles. To verify the structural integrity of the IC during the lifetime of the product, an in-system test (IST) is disclosed. The IST enables self-testing mechanisms for an IC in working systems. The IST mechanisms provide structural testing of the ICs when in a functional system and at a manufacturer's level of testing. Unlike ATE tests that are running on a separate environment, the IST provides the ability to go from a functional world view to a test mode.

The disclosure provides using test processors to provide a more flexible solution compared to the existing DFX blocks that are used for controlling test networks in chips. The test processors provide a highly flexible solution since programming of the test processors can be changed at any time; even after manufacturing, and can support practically an unlimited number of core chips in any configuration. The high flexibility provided via the test processors can reduce engineering effort needed in design and verification, accelerate schedules, and may prevent additional tapeouts in case of DFX design bugs. By making debug and diagnosis easier by providing an opportunity to change debug behavior as needed, the time-to-market timeline can be accelerated. Accordingly, the disclosure provides a chip with a test processor, a multi-chip processing system with a test processor, and a method of designing a chip having a test processor.

In an embodiment, a method for performing scan includes: entering scan mode; receiving a test pattern; applying the test pattern through a first scan chain by asserting and deasserting a scan enable signal to respectively perform shift and capture operations to the first scan chain; while applying the test pattern through the first scan chain, controlling a further scan flip-flop with the first scan chain without transitioning a further scan enable input of the further scan flip-flop; and evaluating an output of the first scan chain to detect faults.

Methods and apparatus for self test of safety logic in safety critical devices is provided in which the safety logic includes comparator logic coupled to a circuit under test (CUT) in a safety critical device and the self test logic is configured to test the comparator logic. The self test logic may be implemented as a single cycle parallel bit inversion approach, a multi-cycle serial bit inversion approach, or a single cycle test pattern injection approach.

The present invention provides a method, device, and system for testing devices under testing (DUTs). The method comprises: sending a scan activated signal and a synchronous clock signal via the second signal line, and sending a first preset signal via the serial signal line, wherein each bit of the first preset signal is transmitted to a corresponding scan chain unit in a sequence of serial connection of the plurality of scan chain units with according to the synchronous clock signal, the corresponding scan chain unit is one of the plurality of scan chain units connected serially and coupled to the plurality of DUTs via a third signal line; sending a scan deactivated signal via the second signal line, to deactivate the scan chain units from identifying and receiving the first preset signal; and sending a second preset signal via the second signal line, and sending a test signal via the first signal line.

A system comprises a testing mode register, a set of pins, and a test access port controller. The test access port controller initiates a first testing mode by configuring the set of pins according to a first pin protocol. The test access port controller configures a first pin to receive first test pattern data based on a first convention and configures a second pin to output first test result data based on the first test pattern data. Based on detecting a register command stored in the testing mode register, the test access port controller initiates a second testing mode by configuring the set of pins according to a second pin protocol. The test access port controller configures the first pin to receive a second test pattern data generated based on a second convention and configures the second pin to output a second test result data based on the second test pattern data.

The invention discloses an extended joint test action group based controller and a method for functional debugging using the extended joint test action group based controller. The object of the invention to lower the power dissipation (dynamic and leakage) but providing the same functionality of the testing and debugging procedures at the same time will be solved by an extended joint test action group (JTAG) controller for testing flip-flops of a register of an integrated circuit (IC) using a design for testing scan infrastructure on the IC which comprises at least one scan chain, wherein an external debugger is connected to the design for testing scan infrastructure via the JTAG controller which is extended by a debug controller, whereas a feedback loop is formed from an output of the scan chain to an input multiplexer of the scan chain which is activated according to the extended JTAG controller.