Various apparatus and methods associated with a compact electronics test system having user programmable device interfaces and on-board functions adapted for use in various environments are provided. Exemplary embodiments can include a variety of apparatuses and methods to realize an advanced field programmable gate array adapted to perform functional tests on digital electronics within an exemplary 48-pin DIP footprint. One aspect of the invention can include a testing device comprised of components to produce a product that is inexpensive and consumable. A small size of an exemplary embodiment of the invention further allows for desirable shielding to be placed around a highly portable and highly programmable and adaptable testing device in order to protect it from external dangers found in harsh environments (e.g., high levels of radiation when operating in space, etc.).

Embodiments herein described an optical system for testing the bandwidth of a photodiode (PD) in a photonic integrated circuit (PIC). In one embodiment, a first optical signal is provided to bias one or more PDs in the PIC which generate a DC bias (e.g., DC voltage) across the PD whose bandwidth is being tested. A second optical signal is directed to the PD being tested, thereby generating an AC signal. The second optical signal can be a tunable optical signal where its frequency/wavelength is varied to test the bandwidth of the PD. The AC signal generated by the PD being tested is passed through a heating element (e.g., a resistor) which generates heat. This heat is then measured by an interferometer. The output of the interferometer can be correlated to a bandwidth of the PD.

A test system for a memory card includes a first circuit board. One side of the first circuit board is provided with a plurality of contact groups spaced apart from each other along a row direction. Another side of the first circuit board is provided with slots disposed along the row direction. The test system further includes a second circuit board. The second circuit board is provided with a test circuit, and is inserted into the slot along a direction perpendicular to the first circuit board. The second circuit board provides a test signal to the contact groups.

An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.

Techniques for testing connectivity between a first integrated circuit (IC) and a second IC of an electronics package are described. An example technique involves controlling a switch(es) in the first IC to configure a bias direction of a photodiode of the second IC to forward biased. A connectivity test between the first and second ICs is performed, when the photodiode is forward biased. Another technique involves controlling a switch(es) in the first IC to configure a bias direction of a photodiode in the second IC to reverse biased. A first voltage is measured at an input of a transimpedance amplifier (TIA) in the first IC when the photodiode is reverse biased. The switch(es) are controlled to change the bias direction of the photodiode to forward biased. A second voltage is measured at the input of the TIA when the photodiode is forward biased.

In some embodiments, an apparatus includes an automatic integrated circuit (IC) handler having a change kit. The change kit has a plunger moveably disposable onto an automatic test equipment (ATE). In such embodiments, the ATE is configured to receive an integrated circuit having an optical interface. The plunger has a first position and a second position. In such embodiments, the plunger is out of contact with the integrated circuit when the plunger is in the first position. The plunger includes an optical connector operatively coupled to the optical interface of the integrated circuit when the plunger is in the second position.

An optical coupler device includes, on a substrate, a first light-receiving element coupled to a first light-emitting element and a second light-receiving element coupled to a second light-emitting element. First, second, and third terminals are disposed on the first substrate. A first transistor pair and a second transistor pair are disposed on the first substrate. The first transistor pair is configured to electrically connect and disconnect the first and second terminals in response to a first light signal received by the first light-receiving element. The second transistor pair is configured to electrically connect and disconnect the second and third terminals in response to a second light signal received by the second light-receiving element.

A method and apparatus for determining a presence, color and/or brightness of a plurality of components in a printed circuit board, where the components are biased either with constant current or with a current pulse.

In some embodiments, an apparatus includes an automatic integrated circuit (IC) handler having a change kit. The change kit has a plunger moveably disposable onto an automatic test equipment (ATE). In such embodiments, the ATE is configured to receive an integrated circuit having an optical interface. The plunger has a first position and a second position. In such embodiments, the plunger is out of contact with the integrated circuit when the plunger is in the first position. The plunger includes an optical connector operatively coupled to the optical interface of the integrated circuit when the plunger is in the second position.

A multi-order optical modulator and modulation method for on-chip optical matrix calculation are provided. The modulator includes: input waveguides, a 22 optical beam splitter, initial phase modulators, multi-order phase modulators, a 22 optical beam combiner, and an output waveguide; the input waveguides include a first input waveguide and a second input waveguide; the initial phase modulators include a first initial phase modulator and a second initial phase modulator; the multi-order phase modulators include a first multi-order phase modulator and a second multi-order phase modulator which are connected to the first initial phase modulator and the second initial phase modulator; and two input ends of the 22 optical beam combiner are respectively connected to the first multi-order phase modulator, the second multi-order phase modulator, and the output waveguide.