A method for forming at least one freestanding microstructure on a diamond crystal includes the step of removing material from the diamond crystal so as to form a structured surface, wherein the removing of the material includes creating at least two trenches, each trench having a bottom and two side walls and wherein adjacent side walls of the at least two trenches form side walls of the structured surface. The method also includes the steps of depositing at least one masking layer on the structured surface, removing at least a portion of the at least one masking layer from the bottom of each of the at least two trenches, removing additional material from the diamond crystal at least along the side walls so as to deepen the trenches, and undercutting the diamond crystal so as to form the freestanding microstructure.

Apparatus and methods of manufacture are disclosed. In one example the apparatus includes a first substrate that has a first surface, a first optical waveguide that is at or near the first surface of the first substrate, a second substrate that has a second surface. The second substrate is coupled to the first substrate at an interface. The apparatus also has a photonic integrated circuit (PIC) with a portion at or near the second surface. The PIC is in alignment with and optically coupled to the first optical waveguide across the interface.

A light distribution structure 10 and a related element 100, such as a light guide, are provided. The structure 10 is preferably an optically functional layer comprising an at least one feature pattern 11, 11A established in a light-transmitting carrier by a plurality of three-dimensional optical features variable in terms of at least one of the cross-sectional profile, dimensions, periodicity, orientation and disposition thereof within the feature pattern. In some instances, the optical features are embodied as internal optical cavities 12 capable to establish the total internal reflection (TIR) function at a horizontal surface and at an essentially vertical surface thereof. A method for manufacturing the light distribution structure is further provided.

Structures for an edge coupler and methods of fabricating a structure for an edge coupler. A waveguide core includes a waveguide core section that has a first notched sidewall, a second notched sidewall, and an end surface connecting the first notched sidewall to the second notched sidewall. Segments are positioned with a spaced arrangement adjacent to the end surface of the waveguide core section, and a slab layer is adjoined to the segments, the first notched sidewall of the waveguide core section, the second notched sidewall of the waveguide core section, and the end surface of the waveguide core section. The segments and the waveguide core section have a first thickness, and the slab layer has a second thickness that is less than the first thickness.

Embodiments disclosed herein include electronic packages with a core that includes an optical waveguide and methods of forming such electronic packages. In an embodiment, a package substrate comprises a core, and a photonics die embedded in the core. In an embodiment, the electronic package further comprises an optical waveguide embedded in the core. In an embodiment, the optical waveguide optically couples the photonics die to an edge of the core.

Various embodiments provide for computational systems including multiple circuit packages, each circuit package comprising an electronic integrated circuit having multiple processing elements and intra-chip bidirectional photonic channels connecting the processing elements into an electro-photonic network, with inter-chip bidirectional photonic channels connecting the processing elements across the electro-photonic networks of the multiple circuit packages into a larger electro-photonic network.

Optical beam forming at the inputs/outputs of a photonic chip and to the spectral broadening of the light coupled to the chip. The photonic chip comprises an optical waveguide layer supported on a substrate. The chip includes an optical waveguide structure made of silicon and a coupling surface grating. The photonic chip has a front face on the side facing the coupling surface grating and a rear face on the side facing the substrate. A reflecting collimation structure is integrated in the rear face to modify the mode size of an incident light beam. The coupling surface grating is designed to receive light from the optical waveguide structure and to form a light beam directed to the reflecting collimation structure. The invention further relates to the method for producing such a chip.

A method includes forming a layer made of a first insulating material on a first layer made of a second insulating material that covers a support, defining a waveguide made of the first material in the layer of the first material, covering the waveguide made of the first material with a second layer of the second material, planarizing an upper surface of the second layer of the second material, and forming a single-crystal silicon layer over the second layer.

A semiconductor structure according to the present disclosure includes a buried oxide layer, a first dielectric layer disposed over the buried oxide layer, a first waveguide feature disposed in the first dielectric layer, a second dielectric layer disposed over the first dielectric layer and the first waveguide feature, a third dielectric layer disposed over the second dielectric layer, and a second waveguide feature disposed in the second dielectric layer and the third dielectric layer. The second waveguide feature is disposed over the first waveguide feature and a portion of the second waveguide feature vertically overlaps a portion of the first waveguide feature.

An integrated optical component, including a transparent pad arranged on the upper face of the basic optical component, the transparent pad including a plane mirror at its upper face, and the basic optical component including a convergent mirror at its upper face, the plane and convergent mirrors being arranged such that the light beam is propagated between the internal light gate and the external light gate by passing through the transparent pad by reflection on the plane mirror and by reflection on the convergent mirror.