A method includes placing an electronic die and a photonic die over a carrier, with a back surface of the electronic die and a front surface of the photonic die facing the carrier. The method further includes encapsulating the electronic die and the photonic die in an encapsulant, planarizing the encapsulant until an electrical connector of the electronic die and a conductive feature of the photonic die are revealed, and forming redistribution lines over the encapsulant. The redistribution lines electrically connect the electronic die to the photonic die. An optical coupler is attached to the photonic die. An optical fiber attached to the optical coupler is configured to optically couple to the photonic die.

Memory devices having electro-optical substrates are described herein. In one embodiment, a memory device includes a plurality of memories carried by an electro-optical substrate. The electro-optical substrate can include a circuit board and an optical routing layer on the circuit board. The memories can be (a) electrically coupled to the circuit board and (b) optically coupled to the optical routing layer. In some embodiments, the optical routing layer is a polymer waveguide.

Memory devices having electro-optical substrates are described herein. In one embodiment, a memory device includes a plurality of memories carried by an electro-optical substrate. The electro-optical substrate can include a circuit board and an optical routing layer on the circuit board. The memories can be (a) electrically coupled to the circuit board and (b) optically coupled to the optical routing layer. In some embodiments, the optical routing layer is a polymer waveguide.

The present disclosure provides devices, systems, circuits, and effective methods for advanced optical applications using plasmonics and ENZ materials. The disclosure provides for enhancement of the optical tunability of phase and amplitude of propagating plasmons, nonlinear-optical effects, and resonant network in optical fiber tip nanocircuits and integrates the tunable plasmonic and ENZ effects for in-fiber applications to provide optical fiber with high operating speed and low power consumption. The invention yields efficient coupling of a plasmonic functional nanocircuit on the facet of an optical fiber core. The invention also can use gate-tunable ENZ materials to electrically and nonlinear optically tune the plasmonic nanocircuits for advanced light manipulation. The invention efficiently integrates and manipulates the voltage-tuned ENZ resonance for phase and amplitude modulation in optical fiber nanocircuits.

The present disclosure provides devices, systems, circuits, and effective methods for advanced optical applications using plasmonics and ENZ materials. The disclosure provides for enhancement of the optical tunability of phase and amplitude of propagating plasmons, nonlinear-optical effects, and resonant network in optical fiber tip nanocircuits and integrates the tunable plasmonic and ENZ effects for in-fiber applications to provide optical fiber with high operating speed and low power consumption. The invention yields efficient coupling of a plasmonic functional nanocircuit on the facet of an optical fiber core. The invention also can use gate-tunable ENZ materials to electrically and nonlinear optically tune the plasmonic nanocircuits for advanced light manipulation. The invention efficiently integrates and manipulates the voltage-tuned ENZ resonance for phase and amplitude modulation in optical fiber nanocircuits.

Disclosed is a micro-optical interconnect component including an optical platform including, arranged onto a substrate, at least one optical alignment structure fixing an optical component and/or arranged as alignment structure to adapt another interconnect component. The optical platform includes a light deflecting element, having a total volume of less than 1 mm3, and made of a material having a refractive index higher than 1. The light deflecting element includes a face, facing the optical alignment structure, and has a curved reflecting surface so that an incident light beam onto the first face is deflected by an angle between 60° and 120°, the incident light beam may be provided from the outside or the inside of the substrate. Also disclosed are optical devices including at least one optical interconnect component and to optical systems including at least one optical device, as well as a batch fabrication process of the optical interconnect component

A device includes a first lens), a second lens, and an adjustment platform. The first lens is arranged between a first end surface and a second end surface, and enlarges the mode field diameter of light that is guided through a first optical waveguide and is emitted from the first end surface. The second lens is arranged between the first lens and a second end surface, and collects light that has passed through the first lens. The first lens is mounted on the adjustment platform. The distance between the optical axis of the first optical waveguide and the principal point of the first lens is adjusted on a plane orthogonal to the optical axis of the first optical waveguide using the adjustment platform.

An optical module capable of suppressing deterioration of an adhesive layer and having a resistance to high-power light even when high-energy light propagates is configured by connecting an optical fiber to a PLC. The optical fiber is provided with an etching face at a recessed area where a cladding region on its side face is partially removed over a length L in a light propagation direction from an input/output end connected to the PLC, and the PLC is also provided with an etching face at a recessed area where a cladding layer is partially removed over the length L in the light propagation direction from an input/output end connected to the optical fiber. The adhesive layer made of a UV cured resin is interposed between the etching faces to bond and fix the etching faces to each other, and a core of the optical fiber and a core layer of the PLC form a directional coupler for linearly dispersing energy density.

An optical module capable of suppressing deterioration of an adhesive layer and having a resistance to high-power light even when high-energy light propagates is configured by connecting an optical fiber to a PLC. The optical fiber is provided with an etching face at a recessed area where a cladding region on its side face is partially removed over a length L in a light propagation direction from an input/output end connected to the PLC, and the PLC is also provided with an etching face at a recessed area where a cladding layer is partially removed over the length L in the light propagation direction from an input/output end connected to the optical fiber. The adhesive layer made of a UV cured resin is interposed between the etching faces to bond and fix the etching faces to each other, and a core of the optical fiber and a core layer of the PLC form a directional coupler for linearly dispersing energy density.

An apparatus arranged for deflecting an optical component for alignment purposes of the optical component with a further optical component, wherein the apparatus comprises a plurality of adjacently placed elongate carriers, extending mutually parallel to each other in a longitudinal direction, wherein two adjacently placed elongate carriers have a spacing between them for receiving a first optical component such that the received optical component rests against two adjacently placed elongate carriers, wherein the two elongate carriers have slopes such that the spacing between the two adjacently placed elongate carriers is smaller at a bottom side compared to the spacing at a top side of the carriers, wherein the carriers comprise piezoelectric material configured to deflect the carriers in a direction perpendicular to the longitudinal direction by actuating the piezoelectric material.