A pattern forming photo-curing layer is heated, thereby enabling quick shaping. A pattern manufacturing apparatus (100) includes a controller (101), a laser projector (102), and a heater (103). The controller (101) controls the laser projector (102) to form a pattern on a pattern forming sheet (130) placed on a stage (140). The laser projector (102) includes an optical engine (121), and the controller (101) controls the laser projector (102) to irradiate the pattern forming sheet (130) with a light beam from the optical engine (121). The heater (103) heats the pattern forming sheet (130).

A substrate treatment method for performing a treatment for forming a pattern through precursor formation and a condensation reaction of a metal-containing resist, includes: suppressing the precursor formation of a film of the metal-containing resist formed on a substrate on which exposure and a PEB treatment have been performed; and subsequent thereto, improving selectivity of the film by the condensation reaction in the film before the forming the pattern.

This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.

A separating device and method for a bonded cine film, belonging to the field of image file protection and repair technologies. The separating device comprises a pressurizing device, a separating device and a liquid nitrogen storage device. The pressurizing device is connected to the liquid nitrogen storage device; the liquid nitrogen storage device is connected to the separating device for providing liquid nitrogen thereto; the separating device comprises a film receiving chamber for accommodating a film to be separated; the pressurizing device pressurizes the liquid nitrogen storage device allowing liquid nitrogen to enter the film receiving chamber. Due to a difference between expansion coefficients of a base layer and emulsion layer of the film under low temperature, micro-pores and gaps may be generated in the base layer and the emulsion layer of a bonded film roll; the liquid nitrogen penetrates into the micro-pores and gaps of the bonded film.

The present invention discloses a separating device for a bonded cine film and a method therefor, which belong to the field of image file protection and repair technologies. The separating device comprises a pressurizing device, a separating device and a liquid nitrogen storage device; the pressurizing device is connected to the liquid nitrogen storage device for providing a pressure thereto; the liquid nitrogen storage device is connected to the separating device for providing liquid nitrogen thereto; the separating device is provided therein with a film receiving chamber for accommodating a film to be separated; the pressurizing device pressurizes the liquid nitrogen storage device to allow the liquid nitrogen to enter the film receiving chamber; due to a difference between expansion coefficients of a base layer and an emulsion layer of the film under a low temperature, micro-pores and gaps may be generated in the base layer and the emulsion layer of a bonded film roll; the liquid nitrogen penetrates into the micropores and gaps of the bonded film roll, a certain tension is generated during gasification, and viscosity of liquefied gelatin decreases under the low temperature, thereby achieving the purpose of separation; the entire separation process does not damage the pH, dimensional stability or mechanical properties of the film roll, and a non-destructive separation can be achieved.

The conductive pattern formation method according to the present invention comprises a step of providing a photosensitive conductive film including a conductive layer containing conductive fibers, a photosensitive resin layer containing a photosensitive resin and an inorganic filler, and a support film in this order, and laminating the conductive layer and the photosensitive resin layer on a base material such that the conductive layer side is closely bonded to the base material, and a step of exposing and developing the photosensitive resin layer and the conductive layer on the base material to form a conductive pattern.

The present disclosure concerns an electrical circuit pattern on a substrate, as well as a method and system for forming same. In a typical embodiment, a light pattern is projected through a transparent layer to cause a patterned release of adhesion between a continuous material layer and the transparent layer. A release layer adhered to the patterned material layer is pulled off the substrate to separate the material having lower adhesion while leaving the material that was not exposed to form the electrical circuit pattern thereon.

This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.

The present invention employs a compound represented by the following formula (0):

##STR00001## wherein R.sup.Y is a linear, branched, or cyclic alkyl group of 1 to 30 carbon atoms or an aryl group of 6 to 30 carbon atoms; R.sup.Z is an N-valent group of 1 to 60 carbon atoms or a single bond; each R.sup.T is independently an alkyl group of 1 to 30 carbon atoms optionally having a substituent, an aryl group of 6 to 40 carbon atoms optionally having a substituent, an alkenyl group of 2 to 30 carbon atoms optionally having a substituent, an alkoxy group of 1 to 30 carbon atoms optionally having a substituent, a halogen atom, a nitro group, an amino group, a cyano group, a thiol group, a hydroxy group, or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group, wherein the alkyl group, the alkenyl group, and the aryl group each optionally contain an ether bond, a ketone bond, or an ester bond, wherein at least one R.sup.T is a hydroxy group or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group; X is an oxygen atom, a sulfur atom, or not a crosslink; each m is independently an integer of 0 to 9, wherein at least one m is an integer of 1 to 9; N is an integer of 1 to 4, wherein when N is an integer of 2 or larger, N structural formulas within the parentheses [ ] are the same or different; and each r is independently an integer of 0 to 2.

The present disclosure discloses a method of manufacturing a display panel. The method includes: providing a first substrate, and forming a release layer on the first substrate; forming a thin film transistor driving layer on the first substrate; forming a display element on the first substrate, wherein a part of the display element forms above the release layer and another part of the display element forms above the thin film transistor driving layer; separating the release layer and the first substrate with a laser; removing the release layer and the display element above the release layer, and forming a hollow portion on the first substrate; packaging the display element to form a display panel, wherein the display panel at least includes a first packaging portion; and providing a through hole passing through the display panel at a region on the display panel corresponding to the hollow portion.