G11C7/1084

DEVICE AND METHOD FOR READING DATA IN MEMORY

In a compute-in-memory (“CIM”) system, current signals, indicative of the result of a multiply-and-accumulate operation, from a CIM memory circuit are computed by comparing them with reference currents, which are generated by a current digital-to-analog converter (“DAC”) circuit. The memory circuit can include non-volatile memory (“NVM”) elements, which can be multi-level or two-level NVM elements. The characteristic sizes of the memory elements can be binary weighted to correspond to the respective place values in a multi-bit weight and/or a multi-bit input signal. Alternatively, NVM elements of equal size can be used to drive transistors of binary weighted sizes. The current comparison operation can be carried out at higher speeds than voltage computation. In some embodiments, simple clock-gated switches are used to produce even currents in the current summing branches. The clock-gated switches also serve to limit the time the cell currents are on, thereby reducing static power consumption.

SEMICONDUCTOR DEVICE AND MEMORY DEVICE COMPRISING THE SAME

A semiconductor device including an error amplifier configured to receive a voltage of an output node and a reference voltage, a flipped voltage follower (FVF) circuit configured to receive an output of the error amplifier and maintain the voltage of the output node at the reference voltage, and a bias current control circuit configured to receive first to third mode signals, control a magnitude of a bias current flowing through the FVF circuit based on the first to third mode signals, control the bias current of a first magnitude, based on the first mode signal, control the bias current of a second magnitude smaller than the first magnitude, based on the second mode signal, and control the bias current of a third magnitude smaller than the second magnitude, based on the third mode signal.

PROGRAMMABLE LINEAR-FEEDBACK SHIFT REGISTER SYSTEMS AND METHODS
20220366992 · 2022-11-17 ·

Various techniques are provided to implement programmable linear-feedback shift register (LFSR) circuits. In one example, the LFSR circuit includes state storage elements. Each state storage element is configured to store a state signal. The LFSR circuit further includes programmable logic stage circuits each configured to selectively receive an input signal and a set of state signals, determine an output signal based at least on the set of state signals, and provide the output signal. Each programmable logic stage circuit is connected to at least one other programmable logic stage circuit. The LFSR circuit further includes pipeline elements. Each pipeline element is configured to selectively connect at least two programmable logic stage circuits. The LFSR circuit further includes sets of latency balance elements. Related systems and methods are provided.

INTERFACE CIRCUIT AND OPERATING METHOD THEREOF TO COMPENSATE FOR SUPPLY VOLTAGE VARIATIONS

An interface circuit includes: a buffer circuit configured to receive an input signal and to generate an output signal having a delay time, the delay time being determined based on a current level of a bias current and a voltage level of a power supply voltage; and a bias generation circuit configured to vary a voltage level of a bias control voltage so that the delay time is constant by compensating for a change in the voltage level of the power supply voltage, the bias generation circuit being further configured to provide the bias control voltage to the buffer circuit.

Memory device for generating pulse amplitude modulation-based DQ signal and memory system including the same

A memory device includes a memory cell array and a transmitter, wherein the transmitter includes a pulse amplitude modulation (PAM) encoder configured to generate a PAM-n first input signal (where n is an integer greater than or equal to 4) from data read from the memory cell array; a pre-driver configured to generate a second input signal based on the first input signal and based on a calibration code signal, and output the second input signal using a first power voltage; and a driver configured to output a PAM-n DQ signal using a second power voltage lower than the first power voltage in response to the second input signal.

Timing signal delay compensation in a memory device
11587602 · 2023-02-21 · ·

Methods, systems, and devices for timing signal delay compensation in a memory device are described. In some memory devices, operations for accessing memory cells may be performed with timing that is asynchronous relative to an input signal. To support asynchronous timing, a memory device may include delay components that support generating a timing signal having aspects that are delayed relative to an input signal. In accordance with examples as disclosed herein, a memory device may include delay components having a variable and configurable impedance, where the configurable impedance may be based at least in part on a configuration signal generated at the memory device. A configuration signal may be generated based on fabrication characteristics of the memory device, or based on operating conditions of the memory device, or various combinations thereof.

Multi-level signal receivers and memory systems including the same

A multi-level signal receiver includes a data sampler having (M−1) sense amplifiers therein, which are configured to compare a multi-level signal having one of M voltage levels with (M−1) reference voltages, to thereby generate (M−1) comparison signals. The data sampler is further configured to generate a target data signal including N bits, where M is an integer greater than two and N is an integer greater than one. An equalization controller is provided, which is configured to train the (M−1) sense amplifiers by: (i) adjusting at least one of (M−1) voltage intervals during a first training mode, and (ii) adjusting levels of the (M−1) reference voltages during a second training mode, based on equalized values of the (M−1) comparison signals, where each of the (M−1) voltage intervals represents a difference between two adjacent voltage levels from among the M voltage levels.

Channel equalization for multi-level signaling
11502881 · 2022-11-15 · ·

A memory interface may include a transmitter that generates multi-level signals made up of symbols that convey multiple bits of data. The transmitter may include a first data path for a first bit (e.g., a least significant bit (LSB)) in a symbol and a second data path for a second bit (e.g., the most significant bit (MSB)) in the symbol. Each path may include a de-emphasis or pre-emphasis buffer circuit that inverts and delays signals received at the de-emphasis or pre-emphasis buffer circuit. The delayed and inverted data signals may control de-emphasis or pre-emphasis drivers that are configured to apply de-emphasis or pre-emphasis to a multi-level signal.

SEMICONDUCTOR SYSTEM AND METHOD OF OPERATING THE SAME
20230046234 · 2023-02-16 · ·

A semiconductor system may include a first semiconductor device and a second semiconductor device. The first semiconductor device compares a received signal with an original signal to generate a driving force control signal. The first semiconductor device also drives the original signal using a driving force in accordance with the driving force control signal to output an external transmission signal. The second semiconductor device receives the external transmission signal to generate a positive signal and a negative signal. The second semiconductor device also generates a restoration signal in response to the positive signal and the negative signal. The second semiconductor device additionally outputs the restoration signal as the external transmission signal to the first semiconductor device.

APPARATUS FOR TRANSMITTING AND RECEIVING A SIGNAL, A METHOD OF OPERATING THE SAME, A MEMORY DEVICE, AND A METHOD OF OPERATING THE MEMORY DEVICE

A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.