Patent classifications
G11C16/0408
Precision programming circuit for analog neural memory in deep learning artificial neural network
Various embodiments of high voltage generation circuits, high voltage operational amplifiers, adaptive high voltage supplies, adjustable high voltage incrementor, adjustable reference supplies, and reference circuits are disclosed. These circuits optionally can be used for programming a non-volatile memory cell in an analog neural memory to store one of many possible values.
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
In a method of manufacturing a semiconductor device, a memory cell structure covered by a protective layer is formed in a memory cell area of a substrate. A mask pattern is formed. The mask pattern has an opening over a first circuit area, while the memory cell area and a second circuit area are covered by the mask pattern. The substrate in the first circuit area is recessed, while the memory cell area and the second circuit area are protected. A first field effect transistor (FET) having a first gate dielectric layer is formed in the first circuit area over the recessed substrate and a second FET having a second gate dielectric layer is formed in the second circuit area over the substrate as viewed in cross section.
Semiconductor Memory Having Both Volatile and Non-Volatile Functionality and Method of Operating
Semiconductor memory having both volatile and non-volatile modes and methods of operation. A semiconductor storage device includes a plurality of memory cells each having a floating body for storing, reading and writing data as volatile memory. The device includes a floating gate or trapping layer for storing data as non-volatile memory, the device operating as volatile memory when power is applied to the device, and the device storing data from the volatile memory as non-volatile memory when power to the device is interrupted.
Semiconductor memory having both volatile and non-volatile functionality and method of operating
Semiconductor memory having both volatile and non-volatile modes and methods of operation. A semiconductor storage device includes a plurality of memory cells each having a floating body for storing, reading and writing data as volatile memory. The device includes a floating gate or trapping layer for storing data as non-volatile memory, the device operating as volatile memory when power is applied to the device, and the device storing data from the volatile memory as non-volatile memory when power to the device is interrupted.
Sense amplifier look-through latch for FAMOS-based EPROM
In one example a semiconductor device has a data latch that includes first and second transmission gates and first and second inverters. The first inverter is connected between a first terminal of the first transmission gate and a first terminal of the second transmission gate. The second inverter is connected between a second terminal of the first transmission gate and a second terminal of the second transmission gate. The data latch is configured to store a datum received at the connection between the first transmission gate and the second inverter, and to store a datum received at the connection between the second transmission gate and the first inverter.
Three dimension memory device and ternary content addressable memory cell thereof
A three dimension memory device and a ternary content addressable memory cell are provided. The ternary content addressable memory cell includes a first memory cell, a second memory cell, a first search switch, and a second search switch. The first memory cell is disposed in a first AND type flash memory line. The second memory cell is disposed in a second AND type flash memory line. The first search switch is coupled between a first bit line corresponding to the first AND type flash memory line and a match line, and is controlled by a first search signal to be turned on or cut off. The second search switch is coupled between a second bit line corresponding to the second AND type flash memory line and the match line, and is controlled by a second search signal to be turned on or cut off.
Nonvolatile storage element and analog circuit provided with same
There is provided a nonvolatile storage element having excellent charge holding characteristics capable of reducing variations in electric characteristics and an analog circuit provided with the same. A nonvolatile storage element is provided with a charge holding region and an insulator surrounding the entire surface of the charge holding region and having halogen distributed in at least one part of a region surrounding the entire surface.
Supporting responses for memory types with non-uniform latencies on same channel
Systems, apparatuses, and methods for identifying response data arriving out-of-order from two different memory types are disclosed. A computing system includes one or more clients for processing applications. A memory channel transfers memory traffic between a memory controller and a memory bus connected to each of a first memory and a second memory different from the first memory. The memory controller determines a given point in time when read data is to be scheduled to arrive on the memory bus from memory. The memory controller associates a unique identifier with the given point in time. The memory controller identifies a given command associated with the arriving read data based on the given point in time.
Method for programming a memory system
A memory system includes a plurality of blocks of memory blocks, each including a plurality of memory cells. The method for programming the memory system includes during a program process, performing a first program operation to program a first memory block, waiting for a delay time after the first program operation is completed, after waiting for the delay time, performing an all-level threshold voltage test to determine if threshold voltages of the first memory block are greater than corresponding threshold voltages, and performing a second program operation to program the first memory block according to a result of the all-level threshold voltage test.
Integrated assemblies and methods of forming integrated assemblies
Some embodiments include an integrated assembly having a source structure, and having a stack of alternating conductive levels and insulative levels over the source structure. Cell-material-pillars pass through the stack. The cell-material-pillars are arranged within a configuration which includes a first memory-block-region and a second memory-block-region. The cell-material-pillars include channel material which is electrically coupled with the source structure. Memory cells are along the conductive levels and include regions of the cell-material-pillars. A panel is between the first and second memory-block-regions. The panel has a first material configured as a container shape. The container shape defines opposing sides and a bottom of a cavity. The panel has a second material within the cavity. The second material is compositionally different from the first material. Some embodiments include methods of forming integrated assemblies.