According to one embodiment, a memory system includes first and second memory cells and a controller. The controller obtains first and second data based on a first read operation from the first and second memory cells, respectively. The controller obtains third and fourth data based on a second read from the first and second memory cells, respectively. The second read operation is different from the first read operation in a read voltage. The controller sets first and second values indicating likelihood of data stored in the first and second memory cells, respectively, based on information indicating locations of the first and second memory cells. The controller performs error correction on data read from the first and second memory cells using at least the third data and the first value, and using at least fourth data and the second value, respectively.

A semiconductor memory device includes a memory block including plurality of string groups, a peripheral circuit, and control logic. The peripheral circuit performs a program operation on source select transistors included in the memory block. The control logic controls the program operation of the peripheral circuit. Each of the plurality of string groups includes at least one cell string, and the at least one cell string includes inner source select transistors located adjacent to memory cells and outer source select transistors located adjacent to a common source line. The control logic controls the peripheral circuit to perform program operations on the outer source select transistors and the inner source select transistors by an ISPP method. The control logic controls the peripheral circuit to perform a verify operation by dividing the inner source select transistors into at least two groups during the program operation of the inner source select transistors.

Memory devices might include a first latch to store a first data bit; a second latch to store a second data bit; a data line selectively connected to the first latch, the second latch, and a string of series-connected memory cells; and a controller configured to bias the data line during a programing operation of a selected memory cell. The controller may with the first data bit equal to 0 and the second data bit equal to 0, bias the data line to a first voltage level; with the first data bit equal to 1 and the second data bit equal to 0, bias the data line to a second voltage level; with the first data bit equal to 0 and the second data bit equal to 1, bias the data line to a third voltage level; and with the first data bit equal to 1 and the second data bit equal to 1, bias the data line to a fourth voltage level.

Methods, systems, and devices for triggering a refresh for non-volatile memory are described. A host system may communicate with a memory system, where the host system and memory system may be included within a vehicle (e.g., an automotive system). The host system may receive an indication that the vehicle is powering down and may enter a power off state in response to the indication. The host system may detect a trigger (e.g., using a time or temperature input) to switch back to a power on state while the vehicle is powered down, the trigger associated with performing a refresh operation at the memory system. The host system may enter the power on state and may transmit a power on command to the memory system. The memory system may perform the refresh operation on one or more memory cells while the vehicle remains in the powered down state.

A memory device is provided to include: a plurality of memory cells; a peripheral circuit configured to perform an operation on the plurality of memory cells; a temperature circuit configured to measure a temperature of the memory device; a monitoring component configured to generate, based on whether a measured temperature is within a reference range, monitoring information representing an operation mode that is either a normal mode in which the operation is performed or a protection mode in which the operation is suspended; and an operation controller configured to output a signal for controlling the operation according to the monitoring information. The monitoring component is further configured to store the monitoring information and output the monitoring information to the operation controller in response to receiving the measured temperature from the temperature circuit.

A method of operating a non-volatile memory device is provided. The device includes a latch, a page buffer and blocks, each of which includes pages. The method includes: receiving a page command for a write operation corresponding to a page of one of the blocks; receiving a write command for writing data to the page buffer; latching preexisting latched data or random data generated as latched data; writing the latched data to a page of a new block from among the plurality of blocks that corresponds to a page address based on the write command; and repeatedly updating the page address and repeatedly writing the latched data to additional pages corresponding to each updated page address until each page of the new block has been written to.

A memory die includes an alternating stack of insulating layers and electrically conductive layers through which memory opening fill structures vertically extend. The memory die includes at least three memory array regions interlaced with at least two contact regions, or at least three contact regions interlaced with at least two memory array regions in the same memory plane. A logic die including at least two word line driver regions can be bonded to the memory die. The interlacing of the contact regions and the memory array regions can reduce lateral offset of boundaries of the word line driver regions from boundaries of the contact regions.

A current operating characteristic value of a unit of the memory device is identified. An operating characteristic threshold value is identified from a set of operating characteristic thresholds, where the current operating characteristic value satisfies an operating characteristic threshold criterion that is based on the operating characteristic threshold value. A set of write-to-read (W2R) delay time thresholds that corresponds to the operating characteristic threshold value is identified from a plurality of sets of W2R delay time thresholds. Each of the W2R delay time thresholds in the set is associated with a corresponding read voltage level. A W2R delay time threshold associated with a W2R delay time threshold criterion is identified from the set of W2R delay time thresholds, where the W2R threshold criterion is satisfied by a current W2R delay time of the memory sub-system. A read voltage level associated with the identified W2R delay time threshold is identified.

A memory device includes a memory block, a peripheral circuit, and a control logic. The memory block includes a plurality of string groups respectively connected to a corresponding select line, among a plurality of select lines. The peripheral circuit performs a program operation of data on the memory block. The control logic controls the program operation of the peripheral circuit. The memory block is connected to first to n-th word lines. The control logic is configured to control the peripheral circuit to perform a first program operation on a physical page, among physical pages that are included in a first string group, connected to an i-th word line, performs a second program operation on a physical page that is connected to an (i−1)-th word line, and perform a dummy program operation on a physical page that is connected to an (i+1)-th word line. Here, n is a natural number equal to or greater than 3, and i is a natural number greater than 0 and less than n−1.

The present technology relates to an electronic device. A memory device according to the present technology includes a plurality of memory cells connected to a word line, an operation controller configured to apply a first or a second read voltage to the word line and to obtain data that is stored in the plurality of memory cells through bit lines that are respectively connected to the plurality of memory cells, and a read voltage controller configured to control the operation controller to read the data that is stored in the plurality of memory cells by using the second read voltage, and to read the data that is stored in the plurality of memory cells by using the first read voltage according to the number of off cells that are counted based on the data that is read by using the second read voltage, in response to a read command.