A non-volatile data storage device includes memory cells arranged in a plurality of blocks and a memory controller coupled to the memory cells for controlling operations of the memory cells. The memory controller is configured to determine if a given block is a bad m-bit multi-level block. In an m-bit multi-level block, each memory cell is an m-bit multi-level cell (MLC), m being an integer equal to or greater than 2. Upon determining that the given block is a good m-bit multi-level block, the memory controller assigns the given block to be an m-bit multi-level user block. Upon determining that the given block is a bad m-bit multi-level block, the memory controller determines if the given block is a good n-bit block. In an n-bit block, each memory cell is an n-bit cell, n being an integer less than m. Upon determining that the given block is a good n-bit block, the memory controller assigns the given block to be an n-bit user block or an n-bit write-buffer block.

Embodiments of the present invention include a solid state storage device for reporting actual power consumption including an internal power metering unit, a memory including flash memory, one or more components comprising at least a controller and the memory, wherein the memory has stored thereon instructions that are configured to be executed by the controller, and one or more voltage rails connecting the power metering unit to the one or more components so that the power metering unit is capable of measuring power consumed by the one or more components of the storage device.

A semiconductor memory device includes a plurality of input-output pins configured to communicate with a memory controller, a command control logic, a temperature measurement circuit and an operation limit controller. The command control logic controls an operation of the semiconductor memory device based on command signals and control signals transferred from the memory controller through control pins among the plurality of input-output pins. The temperature measurement circuit measures an operation temperature of the semiconductor memory device to generate a temperature code corresponding to the operation temperature. The operation limit controller, when it is determined based on the temperature code that the operation temperature exceeds a risk temperature, controls an internal operation of the semiconductor memory device regardless of the command signals and the control signals transferred from the memory controller to thereby decrease a power consumption of the semiconductor memory device.

A plurality of physically unclonable function (PUF) bit cells are surveyed by supplying a plurality of threshold control values to the PUF bit cells. Survey results associated with each of the threshold control values are evaluated to determine a threshold control pair having a positive threshold control value and a negative threshold control value among the plurality of threshold control values that results in a desired number PUF bit cells that are strong ones and that are strong zeros.

A method for detecting a memory chip includes the following steps coupling a detecting circuit to a first area and a second area of the memory chip, the second area is not overlapped with the first area; inputting a first detecting signal from the detecting circuit to the first area of the memory chip; burning out a cell of the detecting circuit; and inputting a second detecting signal from the detecting circuit to the second area of the memory chip.

A deterioration detection device includes a storage including a first current path and a second current path and configured such that a current is applied to the first current path and the second current path, a storage input control unit configured to compare an internal operating condition of a memory device with a target condition in a first operating mode and to select one of the first current path and the second current path of the storage based on a result of the comparison, and an output unit configured to output an output signal indicated deterioration, accumulated in one of the first current path and the second current path, in a second operating mode.

A semiconductor structure is provided. The semiconductor structure includes a transistor and a memory device. The transistor includes a source, a drain, and a gate. The memory device is disposed at a drain side of the transistor and coupled to the drain. The memory device includes a first electrode, a switch layer, a memory layer, and a second electrode disposed sequentially. The first electrode is coupled to the drain.

A process is provided to trim PCRAM cells to have consistent programming curves. Initial programming curves of PCRAM cells are measured. A target programming curve is set up for the PCRAM cells. Each PCRAM cell is then modulated individually to meet the target programming curve.

An embodiment of the present application provides a test method for tolerance against the hot carrier effect, applied to an I/O circuit of a memory, the I/O circuit having an output terminal, comprising: controlling the output terminal to alternately output a first level and a second level, the first level being higher than the second level; obtaining a degradation rate of an output performance parameter of the I/O circuit according to the first level and the second level; and obtaining tolerance of the I/O circuit against the hot carrier effect based on the degradation rate.

Methods of optimizing the placement of memories in a memory device including a substrate and an electrical component, and associated devices and systems, are disclosed herein. A representative method includes first testing the memories to determine at least one parameter for each of the memories indicating an ability of the memory to process signals from the electrical component. The method can further include labeling each memory with a label based on the parameter, the labels including at least a first label and a second label. The first label can indicate that the memories with the first label are better able to process signals from the electrical component than the memories with the second label. The method can further include electrically coupling the memories to the substrate such that the memories with the second label are positioned closer to the electrical component than the memories with the first label.