Methods, systems, and devices for defect detection for a memory device are described. A segmented digital die defect detector may include multiple signal lines, each coupled with a test circuit, and a control circuit to form a path. At least part of the path may extend through an internal portion of the die. A test circuit may generate a digital feedback signal that indicates a condition of a respective signal line. The control circuit may generate a single output signal, indicative of the condition of the signal lines. By utilizing digital testing circuitry and a single digital output signal, a layout area of the segmented digital die defect detector may be reduced and a power consumption associated with the testing operation may be reduced.

Provided are multi-chip packages. A multi-chip package includes a first memory chip and a second memory chip on a printed circuit board; a memory controller electrically connected to the first memory chip and the second memory chip via a first bonding wire and a second bonding wire; and a strength control module configured to control a drive strength of each of a first output driver of the first memory chip and a second output driver of the second memory chip, wherein the memory controller includes an interface circuit configured to receive each of first test data and second test data from the first output driver and the second output driver in which the drive strength is set by the strength control module, and output detection data for detecting whether the first bonding wire and the bonding wire are short-circuited based on the first and second test data.

Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures, the subset of bits comprise compressed code. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.

A group of non-volatile, solid state memory cells are transferred from an active list that includes memory cells accessible to a host to a temporary list that includes memory cells temporarily inaccessible to the host. The memory cells included in the temporary list are maintained at a temperature that is substantially the same as or lower than that of memory cells included in the active list. The memory cells are transferred from the temporary list to the active list in response to satisfaction of a trigger condition.

The present invention provides a semiconductor device comprising a storage chip and a temperature detection module for detecting a temperature of the storage chip. When the temperature detected by the temperature detection module reaches a set threshold, the storage chip is activated. The present invention utilizes the temperature detection module to detect the temperature of the storage chip so as to provide a reference for the activation and operation of the storage chip, avoiding the activation and operation of the storage chip under low temperatures, shortening write time, and improving the stability of the storage chip write; the temperature detection module has a simple circuit structure and is easy for implementation, with a small occupied area, exerting no influence on the active area of the storage chip.

A semiconductor device is provided, including multiple memory chips and a temperature detection module. The temperature detection circuit includes: multiple temperature sensitive units, arranged on the memory chips to detect temperatures of the memory chips; and a processing unit. The multiple temperature sensitive units share the processing unit with each other. The processing unit is configured to process a signal of at least one of the temperature sensitive units. The processing unit includes a calibration value memory cell and a calibration unit. The calibration value memory cell is configured to store a calibration value corresponding to the temperature sensitive unit. The calibration unit is configured to calibrate the temperature sensitive unit according to the calibration value.

To provide a semiconductor device capable of retaining data for a long period. The semiconductor device includes a memory circuit and a retention circuit. The memory circuit includes a first transistor, and the retention circuit includes a second transistor. The memory circuit is configured to write data by turning on the first transistor and to retain the data by turning off the first transistor. The retention circuit is configured to supply a first potential at which the first transistor is turned off to a back gate of the first transistor by turning on the second transistor and to retain the first potential by turning off the second transistor. Transistors having different electrical characteristics are used as the first transistor and the second transistor.

Methods, systems, and devices for life expectancy monitoring for memory devices are described. Some memory devices may degrade over time, and this degradation may include or refer to a reduction of an ability of the memory device to reliably store, read, process, or communicate information, among other degradation. In accordance with examples as disclosed herein, a system may include components configured for monitoring health or life expectancy of the memory device, such as components that perform comparisons between signals or other operating characteristics resulting from operating at the memory device and one or more threshold values that may be indicative of a life expectancy of the memory device. In various examples, a memory device may perform a subsequent operation based on such a comparison, or may provide an indication of a life expectancy to a host device based on one or more comparisons or determinations about health or life expectancy.

A memory system includes a memory array comprising a plurality of memory cells. Each of the memory cells includes a transistor coupled to a first capacitor and a second capacitor in series, respectively. The memory system includes an authentication circuit operatively coupled to the memory array. The authentication circuit is configured to generate a Physically Unclonable Function (PUF) signature based on respective logic states of the plurality of memory cells, and wherein the logic state of each of the plurality of memory cells is determined based on a preceding breakdown of either the corresponding first capacitor or second capacitor.

A device includes a voltage regulator, an auxiliary signal generator, and a circuit cell. The voltage regulator is configured to output a write voltage. The auxiliary signal generator is configured to output an auxiliary signal. The circuit cell is configured to receive both of the write voltage and the auxiliary signal according to a first select signal and a second select signal.