Technology for two-sided adjacent memory cell interference mitigation in a non-volatile storage system is disclosed. During reading of target memory cells, the storage system applies a suitable magnitude read pass voltage to a first unselected word line adjacent to a target word line to compensate for interference from adjacent cells on the first unselected word line while applying a suitable magnitude read reference voltage to the target word line to compensate for interference from adjacent cells on a second unselected word line on the other side of the target word line. The read pass voltage may compensate for interference due to charge being added to when programming cells on the first unselected word line after programming the target cells. The read reference voltage may compensate for interference due to charge movement near the target cells that results from charge stored in the cells on the second unselected word line.

A storage device includes: a memory device including a plurality of memory cells configured to store data and a plurality of word lines connected to the plurality of memory cells and a memory controller in communication with the memory device and configured to control the memory device, including controlling the memory device to perform a read operation perform, upon a failure of the read operation on the memory cell, a read retry operation by changing the read voltage based on a history read table, and wherein the memory controller is further configured to update the history read table, upon a success of the read retry operation, based on whether the word line connected to the memory cell is a last programmed word line according to a program order among word lines connected to the group of memory cells.

According to one embodiment, a semiconductor memory includes a first memory cell array including a plurality of first memory cells; and a second memory cell array including a plurality of second memory cells. Each of threshold voltages of the first memory cells and the second memory cells is set to any of a first threshold voltage, a second threshold voltage higher than the first threshold voltage, and a third threshold voltage higher than the second threshold voltage. Data of three or more bits including a first bit, a second bit, and a third bit is stored using a combination of a threshold voltage of the first memory cell and a threshold voltage of the second memory cell.

A semiconductor device includes a memory string connected between a source line and a bit line. The memory string includes first memory cells stacked along a first channel layer, second memory cells stacked along a second channel layer, and at least one switching memory cell connected between the first memory cells and the second memory cells. A method for operating the semiconductor device includes programming a selected first memory cell among the first memory cells, selecting a second memory cell to be programmed among the second memory cells, applying a program voltage to a word line connected to the selected second memory cell, turning off the switching memory cell such that the first channel layer and the second channel layer are electrically isolated from each other, and applying a pass voltage to word lines connected to unselected memory cells among the first and second memory cells.

At least one address scheduling method includes selecting a first bit line, selecting a first string connected to the first bit line, performing address scheduling on N pages of each of multi-level cells in the first string sequentially from a bottom word line to a top word line, and after completing the address scheduling on all word lines in the first string, performing address scheduling on second to k-th strings sequentially in the same manner as performed with respect to the first string, where “k” is 2 or a natural number greater than 2.

A method for reading data stored in a flash memory includes at least the following steps: controlling the flash memory to perform a plurality of read operations upon a plurality of memory cells included in the flash memory; obtaining a plurality of bit sequences read from the memory cells, respectively, wherein the read operations read bits of a predetermined bit order from the memory cells by utilizing different control gate voltage settings; and determining readout information of the memory cells according to binary digit distribution characteristics of the bit sequences.

A storage system has a memory with primary and secondary blocks. Data is stored redundantly in the primary and secondary memory blocks but in a different programming order. For example, data is programmed in the first memory block starting at a first wordline and ending at a last wordline, while data is programmed in the second memory block starting at the last wordline and ending at the first wordline.

Provided herein is a memory device and a method of operating the same. The memory device may include a plurality of memory cells, a peripheral circuit, and a control logic. The peripheral circuit may be configured to perform a plurality of program loops, each including a program pulse apply operation and a program verify operation, on selected memory cells of the plurality of memory cells. The control logic may be configured to control, in response to a suspend command, the peripheral circuit to suspend an n-th program loop of the plurality of program loops, where n is a natural number of 1 or more, and configured to control, in response to a resume command, the peripheral circuit to resume the suspended n-th program loop after performing a recovery pulse apply operation compensating for charges detrapped from a channel area of the selected memory cells.

Data storage circuits are connected to the bit lines in a one-to-one correspondence. A write circuit writes the data on a first page into a plurality of 5 first memory cells selected simultaneously by a word line. Thereafter, the write circuit writes the data on a second page into the plurality of first memory cell. Then, the write circuit writes the data on the first and second pages into second memory cells adjoining l0 the first memory cells in the bit line direction.

A nonvolatile memory device includes a peripheral circuit region and a memory cell region vertically connected with the peripheral circuit region, the peripheral circuit region including at least one first metal pad, and the memory cell region including at least one second metal pad directly connected with the at least one first metal pad. A method of programming the nonvolatile memory device incudes: receiving a programming command, data for a plurality of pages, and an address corresponding to a selected word-line; programming the data for one of the pages to an unselected word-line; reading data of a previously programmed page from the selected word-line; and programming the data for the remaining pages and the data of the previously programmed page to the selected word-line.