A semiconductor memory device according to an embodiment includes a string, a bit line, a well line, and a sequencer. The string includes first and second select transistors, and memory cell transistors using a ferroelectric material. The bit line and the well line are connected to the first and second select transistors, respectively. At a time in an erase verify operation, the sequencer is configured to apply a first voltage to the memory cell transistors, to apply a second voltage lower than the first voltage to the first select transistor, to apply a third voltage lower than the first voltage to the second select transistor, to apply a fourth voltage to the bit line, and to apply a fifth voltage higher than the fourth voltage to the well line.

A method comprises determining a verify voltage for a next iteration of a verify operation to be performed on memory cells a first set of memory cells of a selected word line, and determining data states for a second set of memory cells of at least one neighboring word line. The method further comprises determining, based on the data states, a verify voltage configuration that includes bit line voltage biases or sense times, and performing the next iteration of the verify operation on the selected word line by using the verify voltage configuration to iteratively verify whether respective memory cells, of the second set of memory cells, have threshold voltages above the verify voltage, wherein determining the data states, determining the verify voltage configuration, and performing the next iteration are to be repeated until a program stop condition is satisfied.

According to one embodiment, a memory system includes a semiconductor memory and a controller. The semiconductor memory includes first to fourth word lines and first to fourth memory cells. The controller is configured to issue first and second instructions. The controller is further configured to execute a first operation to obtain a first read voltage based on a threshold distribution of the first memory cell, and a second operation to read data from the second memory cell.

According to an embodiment, a circuit in a semiconductor memory device sets threshold voltages of a plurality of memory cells such that two first distributions are formed in a first section on a lowest voltage side in 2.sup.N sections. After that, the circuit sets threshold voltages of the plurality of memory cells such that 2.sup.(1+M) second distributions are separately formed two by two. The circuit then sets 2.sup.N third distributions for the 2.sup.N sections.

The memory device includes a plurality of dies, and each die includes a plurality of blocks with a plurality of word lines. Some of the word lines are arranged in a plurality of exclusive OR (XOR) sets with each XOR set containing word lines in the same positions across the plurality of dies. The memory device further includes a controller that is configured to program the word lines of the blocks of at least one of the dies in a first programming direction. The controller is further configured to program the word lines of the blocks of at least one other die in a second programming direction that is opposite of the first programming direction.

According to one embodiment, a memory system includes n memory cells, each capable of storing j bits of data; and a controller. The controller is configured to write a first portion of each of first data to n-th data from among n×j data with consecutive logical addresses to the n memory cells one by one. The first data has a lowest logical address among the n×j pieces of data. The first data to the n-th data have ascending consecutive logical addresses. The controller is configured to write the first portion of one of the first to n-th data as a first bit of the j bits, and write the first portion of another one of the first to n-th data except said one of the first to n-th data as a second bit of the j bits.

A memory system includes a first memory die including multiple planes each including a plurality of memory cells and a controller configured to perform data communication with the first memory die through a first channel, and transfer at least two commands from among commands for an erase operation, a read operation, a program operation, and a check operation to the first memory die. After transferring an erase command to a plane among the multiple planes, the controller transfers a read command, a program command, or a check command to another plane among the multiple planes while the first memory die performs an erase operation corresponding to the erase command in the plane.

A memory device includes: a memory cell array; a control logic circuit; and a row decoder. The row decoder is configured to activate string selection lines based on control of the control logic circuit. A program interval is formed between a first program operation and a second program operation. The control logic circuit includes a reprogram controller configured to control the row decoder so that a program interval differs in the memory cells connected to different string selection lines among the memory cells connected to a first wordline.

A data storage device including, in one implementation, a non-volatile memory and a controller. The non-volatile memory includes a memory block. The memory block includes a plurality of word lines that are written sequentially from a first end of the memory block to a second end of the memory block. The controller is coupled to the non-volatile memory. The controller is configured to determine a last written word line of the memory block. The controller is also configured to set a non-selected word line voltage based on the last written word line of the memory block. The controller is further configured to apply the non-selected word line voltage to non-selected word lines of the memory block.

A memory cell array is configured to have a plurality of memory cells arranged in a matrix, each of the memory cells being connected to a word line and a bit line and being capable of storing n values (n is a natural number equal to or larger than 3). A control circuit controls the potentials of the word line and bit line according to input data and writes data into a memory cell. The control circuit writes data into the memory cell to a k-valued threshold voltage (k<=n) in a write operation, precharges the bit line once, and then changes the potential of the word line an i number of times to verify whether the memory cell has reached an i-valued (i<=k) threshold voltage.