Patent classifications
G01D5/2405
SENSING OF OBJECTS
A pest monitoring system may include a sensor and a sensor unit. The sensor may be configured to measure a change in fringe capacitance. The sensor unit may include a housing, at least one microprocessor, a non-volatile memory, a transceiver, a clock, and a connector operatively connected to the sensor. The housing may include a power source. The sensor unit may be programmed to manage power usage.
POSITION INDICATOR, POSITION INDICATING DEVICE, AND DETECTION METHOD OF TILT OF POSITION INDICATOR
A position indicator includes a transmission signal generating circuit, a resonant circuit coupled to the transmission signal generating circuit, a first electrode connected to a first node of the resonant circuit, and a second electrode connected to a second node of the resonant circuit. The first electrode, in operation, transmits a first signal. The second electrode, in operation, transmits a second signal that is different from the first signal.
ANALYSING A SUBJECT'S GRIP
According to an aspect, there is provided a grip measurement system (300) comprising a door handle (100') comprising a first sensor (108) configured to measure a first parameter indicative of an amount of a part of a user’s hand in contact with the first sensor; a storage device (304); and a processor (302) configured to estimate, based on the measured first parameter, a force applied onto the first sensor by the part of the user’s hand; and store an indication of the estimated force in the storage device.
Sensing of objects
A sensor unit may include a sensor, a housing, at least one microprocessor, a non-volatile memory, a transceiver, a clock, and a connector. The sensor may be configured to measure a change in fringe capacitance and may be tuned to at least one of detect and identify a given animal. The housing may include a power source. The connector may operatively connect the sensor to the housing. The at least one microprocessor may be programmed to continuously recalibrate a baseline capacitance.
Enhancing sensitivity and robustness of mechanical rotation and position detection with capacitive sensors
Described example user interface control apparatus includes a first structure, with a first side, conductive capacitor plate structures spaced along a first direction on the first side, a movable second structure with an auxiliary conductive structure, and an interface circuit to provide excitation signals to, and receive sense signals from, the conductive capacitor plate structures to perform a mutual capacitance test and a self-capacitance test of individual ones of the conductive capacitor plate structures to determine a position of the second structure or a user's finger relative to the first structure along the first direction.
DIFFERENTIAL CAPACITIVE SENSING BASED WEAR DETECTION
A wearable electronic device with one or more receiver electrodes and a plurality of transmitter electrodes, with differential mutual-capacitance measurements used to determine wear status of the device, is described. Mutual-capacitance between receiver and transmitter electrodes is increased to compensate for weak coupling between grounded structures of the device and a surrounding electrical earth. Due to the nature of differential measurements used, the device may maintain mutual-capacitance sensing sensitivity despite said increase. Differential output channels may be dynamically identified and selected to ensure accurate wear detection.
STEERING WHEEL AND HEAT-CONDUCTING DEVICE
A steering wheel and a heat-conducting device are provided. The steering wheel includes a body, a handle, a heating device, an electronic control unit, a heat-conducting member and a base. The handle is adjacent to the body, and the heating device is disposed in the handle and receives a driving signal to generate heat accordingly. The electronic control unit is electrically connected to the heating device through a driving wire, and provides the driving signal to the heating device. The heat-conducting member forms a waste heat path, and the heat-conducting member and the heating device are located at different locations in the handle. The base is connected to the electronic control unit, collects waste heat from the electronic control unit, and is connected to the heat-conducting member through a heat dissipation wire to transfer the waste heat to the heat-conducting member.
Operation device
An operating apparatus is disposed on a surface of a detection panel including a transparent panel and a sensor panel. An operation body includes an upper wall, an inner peripheral wall, and an outer peripheral wall. A rotary assembly is housed in the operation body. The rotary assembly includes a supporter fixed to the detection panel and a rotational operation member rotatably supported by the supporter. The rotational operation member is rotatable together with the operation body. A press detection conductor is provided at a conductor supporting portion of the operation body. A rotation detecting conductor is provided at the rotational operation member.
Nonvolatile multitum rotation sensor with magnetic particle following a spiral track
A non-volatile, absolute rotation sensor employs a radial guide and spiral guide rotating with respect to each other to move a marker element continuously along the radial guide so that a distance of the marker element along the radial guide provides an indication of shaft movement over multiple turns. A sensor system senses the distance of the marker element along the radial guide to provide an electric output.
WAFER PROCESSING EQUIPMENT HAVING CAPACITIVE MICRO SENSORS
Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, a particle monitoring device for particle detection includes several capacitive micro sensors mounted on a wafer substrate to detect particles under all pressure regimes, e.g., under vacuum conditions. In an embodiment, one or more capacitive micro sensors is mounted on a wafer processing tool to measure material deposition and removal rates in real-time during the wafer fabrication process. Other embodiments are also described and claimed.