The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer.

An evaluation jig comprises a pair of female terminals connectable to a pair of male terminals of a charging connector, and an adjustment member that can adjust contact resistance of the female terminal and the male terminal. The female terminal is reducible in diameter. The adjustment member can apply an external force to the female terminal to reduce the female terminal in diameter.

A connecting device for electrically connecting signal contact portions of an electrical device under test includes a lower modular unit and an upper modular unit. The lower modular unit includes a port substrate and a plurality of lower connecting terminals electrically connected with the port substrate. The upper modular unit is disposed above the lower modular unit and includes a plurality of upper connecting terminals movable relative to an upper wall. The upper connecting terminals are movable as a result of a downward pressing of the electrical device to the upper modular unit to project outwardly of the upper wall and to electrically connect with the signal contact portions. The upper connecting terminals are electrically connected with the lower connecting terminals.

The present invention provides a test connector device for testing a component to be tested having conductive portions. The test connector device includes a base, a terminal block, and a limiting member. The terminal block is disposed on the base. The terminal block includes a substrate and terminals arranged in multiple rows and formed in an integral form with the substrate. Each of the terminals includes a first contact end and a second contact end corresponding to each other. The component to be tested is placed on the limiting member and movably assembled to one side of the base. The limiting member includes a positioning assembly and limiting slots where the first contact ends protrude out. The positioning assembly is movably fastened to the base, so that the first contact ends contact the conductive portions. Accordingly, the present invention enhances reliability, stability, and transmission efficiency during tests.

A test carrier carried in a state of accommodating a device under test (DUT) includes: a carrier body that holds the DUT; and a lid member that covers the DUT and is attached to the carrier body. The carrier body has contactors provided to correspond to terminals of the DUT, external terminals electrically connected to the contactors, and a first through-hole for positioning that is provided to face the DUT. The first through-hole penetrates the carrier body so that a part of the DUT is seen from an outside through the first through-hole.

The invention relates to a housing comprising a terminal block intended to receive at least one end of a multi-strand cable and therefore comprising at least one recess (6a, 6b, 6c, 6d) for receiving the end of the cable, the recess being provided with a wall (8) in which an opening (7a, 7b, 7c, 7d) is arranged and through which the end of the cable extends during use, and a flank (10a, 10b, 10c, 10d) arranged opposite the wall with the opening, at least one surface of the flank facing the inside of the recess being rough in order to limit the risk of at least one strand detached from the end of the cable sliding through a space between the flank and the rest of the housing.

The invention relates to a probe card (PC) for use with an automatic test equipment (ATE), wherein the probe card (PC) comprises a probe head (PH) on a first side thereof, and wherein the probe card (PC) is adapted to be attached to an interface (IF) and wherein the probe card (PC) comprises a plurality of contact pads on a second side in a region opposing at least a region of the interface (IF), arranged to contact a plurality of contacts of the interface (IF), and wherein the probe card (PC) comprises one or more coaxial connectors (CCPT) arranged to mate with one or more corresponding coaxial connectors (CCPT) of the interface (IF). The invention relates further to pogo tower (PT) for connecting a wafer probe interface (WPI) of an automatic test equipment with the probe card (PC).

An apparatus has at least substrate having at least two conductive paths, a least two connectors positioned in a first plane, and a movable stage connected to one of the at least one substrate to move the one substrate perpendicular to the first plane form an electrically conductive path between two of the at least two connectors.

A notched test signal is generated across a frequency band, the notched test signal includes a plurality of frequency notches, each frequency notch associated with one of a plurality of test frequencies. The notched test signal is provided to a device under test at a plurality of different input power levels. An notched output signal is received from the device under test. The notched output signal is filtered to provide a bandpass response at the plurality of test frequencies to generate a filtered notched output signal. A power level of the filtered notched output signal at each of the plurality of test frequencies is measured. A noise performance metric associated with the device under test is determined based at least in part on the power level of the filtered notched output signal.

A test adapter assembly for an interface. The test adapter assembly has a test adapter frame having a first pair of opposing sides, a second pair of opposing sides and an engagement mechanism support member, the second pair of opposing sides being shorter than the first pair of opposing side, the first and second pairs of opposing sides forming a test adapter face; and a collar support member, the collar support member having plate portion mounted to one of the second pair of opposing sides of the test adapter frame and a collar mounting portion extending from the plate portion at an angle of 40-50° relative to the face of the test adapter frame.