Embodiments relate to testing LEDs by applying a voltage difference between anode electrodes and cathode electrodes of the LEDs using transistors and probe pads and determining whether the LEDs satisfy a threshold level of operability. A final substrate has transistors that apply the voltage difference to the LEDs via conductive traces and probe pads during testing mode. A gate voltage is applied to gate terminals of the transistors, a first voltage is applied to anode electrodes of the LEDs, and a second voltage is applied to cathode electrodes of the LEDs. After applying the voltages, turning on of the LEDs is observed. Embodiments also relate to testing current leakage in the final substrate with the transistors and the LEDs.

A method of testing a semiconductor wafer comprising a scribe line and a plurality of dies. The method includes implementing a first landing pad on the scribe line and implementing a first interconnect on the scribe line and between the first landing pad and a first cluster of the plurality of dies, thereby coupling the first landing pad to the first cluster of dies. The method also includes performing the testing of the first cluster of dies using automated test equipment (ATE) coupled to a probe tip by contacting the first landing pad with the probe tip and applying an ATE resource to the first cluster of dies.

A contact terminal may include a tubular body made of an electrically conductive material; and stick-shaped first and second central conductors made of an electrically conductive material. The first and second central conductors may include first and second stick-shaped bodies, first and second clasped portions configured to have a diameter greater than that of each of the first and second stick-shaped bodies, and first and second swell portions configured to have a diameter greater than that of each of the first and second stick-shaped bodies. The first and second central conductors are arranged to have a distal end portion of the first and second swell portions inserted into a joining portion of the tubular body, and to have a distal end surface of the first swell portion and a distal end surface of the second swell portion opposite each other with a gap therebetween.

An electrical connector assembly which has a first connector and a second connector. The first connector and second connector have connector housings with first latching areas extending from the top surfaces of the connector housings and second latching areas extending from the bottom surfaces of the connector housing. Sealing members are positioned proximate wire-receiving faces of the connector housings. Rear seal cover members are positioned in the connector housings. The rear seal cover members are configured to cooperate with the sealing members to prevent the rear seal cover members from being latched to the connector housing when the terminals are not fully inserted into the terminal receiving cavities of the connector housings.

A device includes a test pad on a chip. A first microbump has a first surface area that is less than a surface area of the test pad. A first conductive path couples the test pad to the first microbump. A second microbump has a second surface area that is less than the surface area of the test pad. A second conductive path couples the test pad to the second microbump.

A mobile transformer test device (10) for testing a power transformer (40) has connectors (12) for the detachable connection of the transformer test device (10) to the power transformer (40). The transformer test device (10) has a source (5) for generating a test signal. The mobile transformer test device (10) has an evaluation circuit (6) for determining, based on the test signal and a test response of the power transformer (40), information regarding a B-H curve (50, 60) of the power transformer (40).

A voltage and or current sensor device for use in medium- or high voltage application, wherein a sensor or sensors of the sensor device is or are arranged in a housing. To enhance communication between the sensor and an electronical device, in order to use maximum possible accuracy potential of the voltage and current sensors, a signal and/or data memory element is integrated in the sensor housing, or placed near the sensor such that the sensor device output signal can be directly evaluated.

An electrical contact device includes a tubular element, a crown spring in the tubular element, a solid or hollow cylinder slideably received in the crown spring and a coil spring engaged with the cylinder for applying force while the cylinder is pressed against a test item and for returning the cylinder to a relaxed position. The crown spring holds the cylinder in the tubular element and allows the cylinder to slide back and forth while providing electrical connectivity between the cylinder and the tubular element. An electrical contact device includes a rod-shaped probe having a contact end and a contact sheet fixed to the probe, where the contact sheet has a plurality of prongs bent over the contact end of the probe for providing a plurality of contact points between the probe and a test item.

An electrical contact terminal in a testing apparatus that is provided with dual contacts, one for force and the other for sense. This allows both force and sense contacts to establish an electrical connection with the device pin, even when the device pin has a lateral deviation from its desired position. The present invention also teaches of a method of assembly of the contact terminal that overcomes the space constraint that results from having two contacts instead of just one in the given space.

A film test structure and an array substrate are provided. The film test structure includes a conductive film to be tested; a plurality of test leads arranged at a different layer from the conductive film to be tested and electrically connected with the conductive film to be tested respectively; and a plurality of test terminals electrically connected with the plurality of test leads respectively.