The present disclosure provides an electrical test fixture, comprising a base provided with an accommodating slot for accommodating therein a circuit board to be detected, and a printed circuit board for providing an electrical test signal, the accommodating slot being provided therein with a connector electrically connected to the printed circuit board; and an upper cover movably connected to the base in a first state in which the upper cover is opened in such a manner that the circuit board to be detected is capable of being placed in the accommodating slot and in a second state in which the upper cover is engaged with the base and is capable of abutting against the circuit board to be detected in the accommodating slot in such a manner that the circuit board to be detected comes into contact and is connected with the connector.

A testing unit including a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate, a plurality of end traces having a height and a width with each end trace extending from an end of a respective pin trace towards the edge of the substrate, a plurality of branch traces having a height and a width and each extending from a side of a respective pin trace, a plurality of traces extending from the end of a respective end trace, branch trace or pin trace to the edge of the substrate.

A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal cable. In one embodiment, the probe apparatus includes: a chassis; a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe to the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe; and a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with a distal end of the signal cable side by side.

A probe device of a vertical probe card is provided and includes a die assembly and at least one pin assembly. The die assembly includes a first die, a second die, and a middle die disposed between the first die and the second die. The at least one pin assembly has a first pin, a second pin, and at least one electrical connector. The at least one electrical connector is connected to the first pin and the second pin. The at least one pin assembly is electrically contacted with at least one contact pad of a device under test. The at least one contact pad leans against the at least one pin assembly, so that the at least one pin assembly generates a deformation in a longitudinal direction.

An electrical connection member capable of detecting discontinuities in an electrical network is provided. The connection member includes a casing having at least three branches, each of the branches including, at the end of same, at least one terminal for electrical connection to a respective piece of equipment, and least one main conductor linking two terminals at the ends of two branches in the casing, at least one secondary conductor linking at least one terminal of the end of the third branch in the casing, and including an electrical coupler designed to inject an electrical test signal from the secondary conductor into the main conductor, and to transmit, to the secondary conductor, an electrical response signal generated by the reflection of the electrical test signal against a discontinuity encountered in the electrical network.

A probe connector assembly includes a carrier plate, multiple probes and multiple positioning members. The multiple probes are mounted into multiple probe holes of the carrier plate. Each positioning member is securely mounted into the carrier plate and partially protrudes into corresponding probe holes to contact probe trunks of corresponding probes, such that the probe trunk of each probe is positioned in a corresponding probe hole of the carrier plate by friction resistance generated between the probe trunk and positioning members adjacent to the probe trunk. Thus, the probe connector assembly is advantageous in a simplified structure of the carrier plate and reduced thickness of the carrier plate and probe length.

A method and apparatus for docking a test head to a peripheral. A docking pin (150) is moved past a projection (803) in a catch (802). The docking pin is further moved until the catch rotates and the projection in the catch engages a notch or indentation (152, 156) in the docking pin. A piston (620) is moved on to the catch so that the catch is prevented from rotating. The piston is further moved so that the test head is docked to the peripheral.

A method of testing a semiconductor device against electrostatic discharge includes operating the semiconductor device, and, while operating the semiconductor device, monitoring a functional performance of the semiconductor device. The monitoring includes monitoring one or more signal waveforms of respective one or more signals on respective one or more pins of the semiconductor device to obtain one or more monitor waveforms, and monitoring one or more register values of one or more registers of the semiconductor device to obtain one or more monitor register values as function of time. The method includes applying an electrostatic discharge event to the semiconductor device while monitoring the functional performance of the semiconductor device. The method can further comprise determining a functional change from the one or more monitor waveforms and the one or more monitor register values as function of time.

A probe includes a self-aligning connector set, a moveable probe tip, a cable, a housing, and a spring. When the probe tip is pressed to a test point on a device-under-test, the probe tip moves within the housing to cause a first connector and a second connector of the self-aligning connector set to be connected through an adapter of the self-aligning connector set, thereby establishing a signal path through the probe. The first connector, second connector, and adapter are structured so that their respective ground conductors become connected prior to their respective signal conductors becoming connected. Electro-static charge present at the test point is safely discharged through a resistor to ground before the signal path through the probe is established, thereby preventing damage to the probe and connected host instrument. When the probe tip is removed from the device-under-test, the spring forces a disconnection of the first and second connectors.

A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.