The present disclosure provides a method of safely activating and deactivating hot-swap circuitry powered off of a bus bar. One aspect of the present technology provides a method that includes receiving a bus bar connector. The bus bar connector includes a housing having first and second electrical contacts. The first and second electrical contacts are configured to connect with a bus bar. The bus bar connector also includes a short pin detector attached to the housing. The short pin detector is configured to transmit one or more signals. The method includes engaging the first and second electrical contacts with the bus bar. In response to engaging of the first and second electrical contacts, a first signal can be transmitted indicating that the housing is connected to the bus bar and a hot-swap payload associated with the bus bar connector is activated.

This disclosure pertains to methods and apparatus for interfacing an onsite power generation system with an existing main electric panel. The interfacing is performed by: attaching a fifth jaw connector to a neutral bridge within an existing meter socket; wiring AC supply lines from the onsite power generation system to load side jaws of a five blade meter socket adapter; and wiring a neutral line from the onsite power generation system to a fifth terminal of the meter socket adapter. The lines from the onsite power generation system are routed through an opening formed in the meter socket adapter. The meter socket adapter is then inserted into the meter socket so that five jaws in the socket receive all five blades of the meter socket adapter. The blades of the meter are then plugged into the jaws on the opposite end of the meter socket adapter.

A vehicular diagnostic tool interface device that may be connected to a vehicular diagnostic tool, typically through an available port thereof, that enhances the functionality of the overall tool. The interface device is configured in such a manner as to provide physical protection to more sensitive components such as, for example, wireless transceivers. The interface device is also configured to minimize the distance that it protrudes from the diagnostic tool. Also, a method of operating such a vehicular diagnostic tool.

The present invention may provide a plug for an RF coaxial cable, to which the RF coaxial cable is coupled, comprising: a first body in which the RF coaxial cable is inserted; a first conductor disposed in the first body; a coupling nut which is arranged on the outside of the first body and rotatably coupled to the first body; and a first magnet of an annular shape which is fixed in the coupling nut and rotated along with the coupling nut, wherein the first magnet has a first pole and a second pole having different polarities which are alternately arranged in the circumferential direction.

The invention relates to a method for manufacturing an electric current sensor (SHE) comprising the following steps: a) providing a metal or metal alloy substrate (SBT), b) making a non-through cavity (CVT) in said substrate so that said cavity separates the substrate into two areas (Z1, Z2), c) producing a resistive element (ER) in said cavity (CVT) by additive manufacturing, d) annealing the resulting assembly, e) removing a part of the substrate (SBT) to leave only the resistive element (ER) between the two areas (Z1, Z2) of the substrate, and f) defining, within each area (Z1, Z2), a connection terminal (BCE1, BCE2) to obtain electrodes (PEL, DEL).

A power supply processing device includes three electric control valve groups, a positive output terminal and a conversion control switch group. The conversion control switch group includes a selection switch group configured to selectively connect the current valve control components in each electric control valve group to the positive output terminal or the phase output terminal, and a connection switch group configured to connect or disconnect a current path between two electric control valve groups connected one another. In such a way, both AC experiments and DC experiments of high voltage and large capacity may be performed to the connectors without changing experimental site and experimental equipment, thereby effectively reducing the experimental cost.

A wafer testing cassette is provided. The wafer testing cassette includes a first housing, a second housing and a magnetic force generating assembly. The first housing include a probe card, the probe card includes at least one probe having a paramagnetic property. The second housing is combined with the first housing and has a magnetic force generating assembly arranged corresponding to the at least one probe. A wafer located in the second housing, and the at least one probe electrically contacts at least one pad of the wafer with a predetermined contact force. When the magnetic force generating assembly is configured to generate a first magnetic attraction force, the magnetic force generating assembly attracts the at least one probe, so that the at least one probe electrically contacts the at least one pad with a first contact force which is greater than or equal to the predetermined contact force.

A wafer test system is provided. The wafer test system includes a wafer test cassette, a carrier, and a test equipment. The wafer test cassette includes a first magnetic member. The carrier includes a second magnetic member. The wafer test cassette is fixed on the carrier through magnetic attraction generated between the first magnetic member and the second magnetic member. The test equipment includes a tester and a test cabinet. The test cabinet has a plurality of test spaces used to accommodate the wafer test cassettes and the carriers, and the tester is electrically connected to the wafer test cassette.

A wafer test cassette, a wafer test system, and a wafer test method are provided. The wafer test cassette includes a first housing including a first magnetic member, a second housing including a second magnetic member corresponding to the first magnetic member, a first fluid port, and a gas supply device. The first housing and the second housing are tightly coupled to each other by which a test space is defined. The first housing includes a probe card, and the second housing carries a wafer. When the first housing and the second housing are coupled, a probe is electrically in contact with a pad of the wafer. The first fluid port is disposed in the first housing or the second housing, and receives an external gas to the test space. After the test space receives the external gas, an air pressure value thereof is greater than an atmospheric pressure.

A wafer test cassette having a fluid inlet and a fluid outlet, includes a first housing, a second housing, a heat source, and an isolation device. The first housing includes a probe card including probes. The second housing is coupled to the first housing, so that a test space is defined. The second housing carries a wafer arranged in the test space, and the probes are electrical contact with an upper surface of the wafer. The heat source heats a lower surface of the wafer, and a high temperature region is defined between the lower surface and the second housing. The solation device surrounds the high temperature region for thermally isolating the high temperature region from the test space. The fluid inlet receives a gas, the gas flows between the probe card and the upper surface of the wafer, and exits through the fluid outlet.