A manufacturing jig for an electrical connection device includes a jig including a first guide plate and a second guide plate each including a through hole penetrating from a first surface to a second surface, the first guide plate and the second guide plate laminated to be movable relative to each other along the first surface. The through hole includes a common portion extending in a first direction in a plan view, a first guide part extending from the common portion in a second direction different from the first direction, and a second guide part extending from the common portion in a third direction different from the first and second directions. The jig is configured so that probes can be inserted into each of the first guide part and the second guide part, through the first guide plate and the second guide plate successively.

A low power switch for use low voltage electrical monitoring circuits provided with signals from a low power instrument transformer such as found in substation facilities that signals via a communication protocol the operational status of potential, current and signal secondary circuits when connected to protection and monitoring devices (or test devices) such as protective relays, fault recorders or any other monitoring and controlling device. The low power switch includes various safety features to prevent damage to the equipment or harm to a technician.

An input connector assembly, which is for detecting residual current and adapted for connecting power sources to electric equipment of electric vehicles, includes a wire terminal block, lock and release mechanisms, a residual current sensor, and a support holder. The wire terminal block has wire terminals for receiving electrical wires. The lock and release mechanisms are connected to the wire terminal block for fixing electrical wires to conductors in the wire terminals. The residual current sensor is adapted to be mounted to a flat surface. The support holder is designed to be placed above the residual current sensor and to be connected to the flat surface. The support holder is further adapted for supporting the wire terminal block in a position above the residual current sensor. Conducting connection pins run from the conductors in the wire terminals through openings in the residual current sensor to the flat surface.

A contact inspection device includes a support; a contact inspection module including an inspection terminal which contacts and inspects an target; a crank module coupling the contact inspection module with the support and having a double crank structure; and a driving cylinder coupled to the support and the contact inspection module and moving the contact inspection module, where the driving cylinder applies a force to the contact inspection module to move, the force being oblique to the contact inspection module.

An inspection jig for a semiconductor device provided with a plurality of lead pins includes: a contact portion in which contact electrodes are formed at troughs of first saw teeth; and a pressing portion in which second saw teeth are formed. During inspection of the semiconductor device, the contact portion is disposed such that the troughs of the first saw teeth correspond to the plurality of lead pins, the pressing portion is disposed such that the second saw teeth apply, to the plurality of lead pins, pressure toward the troughs of the first saw teeth, and the pressing portion applies pressure to the contact portion in a direction in which the plurality of lead pins extend, so that the pressing portion and the contact portion integrally move in the direction in which the plurality of lead pins extend.

An inspection device includes a carrier, an input electrode, a metal layer and a contact electrode. The input electrode is disposed on the carrier. The metal layer includes a fixed portion and an extending portion. The fixed portion is disposed on the carrier, the fixed portion has one end connected to the input electrode, and has another end that extends in a direction far away from the carrier. The extending portion is electrically connected to the another end of the fixed portion, the extending portion is separated from the carrier by a spacing to form a buffer region. The contact electrode is disposed on the extending portion of the metal layer, and electrically connected to the extending portion of the metal layer. The contact electrode has a concave surface facing away from the carrier.

Proposed are a test device and a manufacturing method of the test device capable of testing a test object that is provided with an electrode which has a size and/or a pitch distance ranging from 1 to 100 micrometers (m).

The present disclosure provides a testing station, testing module and testing method for testing a plurality of image intensifier tubes. In an embodiment, a testing station includes a first testing module and a second testing module. The first testing module has a first input connector, a first output connector and a plurality of first testing sections each configured to test an image intensifier tube. The second testing module has a second input connector, a second output connector and a plurality of second testing sections each configured to test an image intensifier tube. The first testing module and the second testing module are configured to be removably attached to each other in a first orientation and a second orientation. The first input connector is connected to the second output connector in the first orientation, and the second input connector is connected to the first output connector in the second orientation.

A method for inspecting electronic components and an electronic device are provided. The electronic device includes electronic elements, signal lines, an inspection structure, a substrate and a first driving element electrically connected to the signal lines. The signal lines include a first and a second signal lines. The electronic components include a first group of electronic components electrically connected to the first signal line and a second group of electronic components electrically connected to the second signal line. The first signal line has a first portion overlapping a first inspection region and a second portion overlapping the first driving element. The second signal line has a third portion overlapping a second inspection region and a fourth portion overlapping the first driving element. A distance between the second portion and the fourth portion is smaller than a distance between the first portion and the third portion.

An engaging device of a Mass-Interconnect includes an interchangeable test adapter (ITA) and a locking mechanism. The locking mechanism includes a slide movable between an engaged position and a disengaged position, a dual cam including a first cam arm and a second cam arm respectively configured to contact a first slide leg and a second slide leg to drive the slide between the engaged and disengaged positions, and plurality of contact pads disposed on the slide at regions engaged by the dual cam, the contact pads being made of a resilient polymeric material. The contact pads provide elastic compressibility that enables the receiver and ITA to achieve a substantially zero-gap condition at their mating surfaces while the locking mechanism advances into an over-dead-center locked state.