An automated test equipment (ATE) for testing semiconductor devices, the test equipment comprises a test handler, a spare part, or a contactor socket, and a semiconductor devices tester, The spare part comprises an electronic component for storing and or processing data regarding the spare part or a portion thereof, The test equipment comprises an operator terminal comprising a display or GUI and a data exchange interface which is connected or connectable to the electronic component within the spare part, for at least displaying data stored therein. The ATE further comprises a data buffer unit for buffering the data, a maintenance planning and control unit for planning and controlling maintenance actions of the test equipment, and a dedicated database residing in a control computer.

A first base plate includes a plurality of first positioning hole portions, an accommodation portion that accommodates an optical module, a first opening portion, a first pressing portion, and a first engagement portion. A second base plate has a second positioning hole portion that is disposed at a position corresponding to the first positioning hole portion, a second opening portion that is disposed at a predetermined positional relationship with respect to the second positioning hole portion, a second holding portion, a conduction portion, a second pressing portion, a substrate portion, a cover portion, a second hinge portion, and a second engagement portion.

According to a certain embodiment, a pin plunger includes: a first contact member; a second contact member that faces the first contact member and is apart from the first contact member; a spring arranged between the first contact member and the second contact member; and a housing that houses the first contact member, the second contact member, and the spring. The housing comprises a bimetal inside or outside the housing. The bimetal comprises a first metal and a second metal, the first metal having a thermal expansion coefficient different from a thermal expansion coefficient of the second metal. The elastic force decreased or increased by contracting or expanding of the spring due to a temperature change is compensated with a warping force due to stretching of the first metal and the second metal.

A reconfigurable load board clamp is disclosed. The reconfigurable load board clamp includes first and second slotted ends; first and second opposing sides laterally coupled to the first and second slotted ends; and a MCPCB pin board removably coupled to the first and second slotted ends. The pin board includes a card edge connector plugged into an end of the pin board and multiple spring-loaded pin connectors. In implementations, multiple pin boards may be removed and added to the reconfigurable load board clamp to form a pin array suitable for a particular load board.

Provided are a socket for a semiconductor chip test, and a method of manufacturing the same, the socket for the semiconductor chip test including: a film layer; a semiconductor chip test terminal disposed on the film layer and connected to a terminal of a semiconductor chip; and a conductive elastic pad disposed on the film layer and connected to a ground terminal of the semiconductor chip.

A test device for testing electric properties of an object. The test device includes an object support unit configured to support an object; a cover unit configured to include a cover body coupled to the object support unit and a pusher supported by the cover body so as to move toward and away from the object; and a pressure adjuster configured to include a multi-stage adjusting cam which is rotatably provided in the cover body while contacting the pusher and has a multi-stage contact pressing portion with contact radii varied depending on rotated angles so that the pusher can be in a moving-back position and be positioned at a plurality of pressing distances from the cover body, and an operation unit which operates the multi-stage adjusting cam.

A laminated heater socket useful in association with an integrated circuit (IC) device tester is having a socket with an embedded integrated heater. This laminated heater socket configuration allows for good thermal conductivity and better electrical signal transmission specially for testing high-speed integrated circuits.

A manufacturing method of contact probes for a testing head comprises the steps of:—providing a substrate made of a conductive material; and—defining at least one contact probe by laser cutting the substrate. The method further includes at least one post-processing fine definition step of at least one end portion of the contact probe, that follows the step of defining the contact probe by laser cutting, the end portion being a portion including a contact tip or a contact head of the contact probe. The fine definition step does not involve a laser processing and includes geometrically defining the end portion of the contact probe with at least a substantially micrometric precision.

Embodiments provided herein include methods, compositions, and uses of aromatic alcohols to increase the potency of antifungal agents.

A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.