A leakage voltage detection system can be easily mounted on a ground structure such as an existing street light or a traffic light and can detect a leakage voltage of an electric structure in real time. The leakage voltage detection system includes a sensor node mounted on a ground structure, and an equipment management server that determines a risk of a leakage voltage in the ground structure based on detection voltage information from the sensor node. The sensor node includes an electric field probe that measures a potential difference caused by an electric field detected by electrodes, and a sensor box that detects the potential difference between the electrodes of the electric field probe and transmits the potential difference to the equipment management server as a detection voltage. The equipment management server determines the risk of the leakage voltage where the sensor node is mounted based on the received detection voltage from the sensor node, and outputs information on determination of the risk of the leakage voltage.

A measurement probe for producing a test signal for a measurement instrument includes a probe head structured to be connected to at least a first testing point and a second testing point of a Device Under Test (DUT), a current detector in the measurement probe structured to determine a current flowing between the first testing point and the second testing point of the DUT, a first selectable signal path that causes a voltage signal from the first testing point or a voltage signal from the second testing point to be routed to the measurement instrument as a selected voltage test signal, and a second selectable signal path that causes a current signal from an output of the current detector to be routed to the measurement instrument as a selected current test signal. Methods of testing a DUT using the measurement probe are also described, as well as a system for measuring signals from a DUT using the measurement probe.

A wafer inspection method and inspection apparatus that perform a voltage inspection of a die on a wafer by a probe module. The probe module includes a processing module, a first probe coupled to a first electrode point of the die, and a second probe coupled to a second electrode point of the die. The first probe is coupled to the processing module, and the second probe is grounded. The processing module provides the die with a driving current through the first probe, and obtains an inspection voltage corresponding to the die. The processing module generates an inspection result of the inspection voltage based on two reference voltages respectively representing a high critical threshold value and a low critical threshold value of the die under a normal operation. The inspection result indicates an operating status of the die. Thus, inspection costs are reduced and inspection efficiency is enhanced.

A direct current (DC) power rail probe includes a single-ended probe tip, and a two-path circuit having an input coupled to the single-ended probe tip and an output configured for connection to measurement equipment such as an oscilloscope. The two-path circuit includes an alternating current (AC) path in parallel with a feed-forward (FF) path, the AC path including a capacitive element, and the FF path including a series connection of at least one resistive element and an amplifier. The probe tip and two-path circuit are selectively operable in a non-attenuating mode and an attenuating mode.

In a measurement system, a signal probing circuit may provide probed signals by probing voltages and currents and/or incident and reflected waves at a port of a device under test (DUT). A multi-channel receiver structure may include receivers that receive two probed signals from the signal probing hardware circuit, each receiver having its own sample clock derived from a master clock and further having a respective digitizer for digitizing a corresponding one of the two probed signals. A synchronization block, external to the receivers and including a reference clock derived from the master clock, may enable the two probed signals to be phase coherently digitized across the receivers by synchronizing the respective sample clocks of the receivers while the reference clock is being shared with the receivers. A signal processing circuit may then process the phase coherently digitized probed signals.

An isolated voltage probe includes: a conductor including a positive lead, a negative lead, and a resistance via which the positive lead and the negative lead are connected to each other; a magnetic sensor for measuring a magnetic field in a non-contact manner, the magnetic field being generated by a current flowing through the conductor; and a coaxial cable for transmitting a signal that is based on an output supplied from the magnetic sensor.

A detection data storage device includes a detection probe, an inspection instrument, a processor and a storage controller. The processor includes a software component. The storage controller includes a key and a prompt lamp. When a circuit is detected by the detection probe, a detection signal is generated. After the detection signal is received by the inspection instrument, a detection data is generated and transmitted to the software component of the processor. If the software component judges that the detection data matches a standard value, the software components issues a prompt signal to the prompt lamp of the storage controller. In response to the prompt signal, the prompt lamp emits a light beam. After the light beam from the prompt lamp is received by the user and the key is pressed, the detection data is stored in a storage unit.

The present disclosure provides a measurement probe comprising a probe tip for contacting a device under test, a probe handle that accommodates the probe tip at least in part, an electrical interface for coupling the measurement probe to a measurement device, and a switch comprising a control input, a first load input that is electrically coupled to the probe tip and a second load input that is electrically coupled to the electrical interface, wherein in a closed state the switch electrically closes the connection between the probe tip and the electrical interface, and in an open state electrically interrupts the connection between the probe tip and the electrical interface. The present disclosure also provides a respective method.

The present disclosure provides a circuitry distortion corrector for correcting distortions of electrical signals. The circuitry distortion corrector comprises a first correction filter that filters the received signals, and a second correction filter that is coupled to the first correction filter and filters the signals that are filtered by the first correction filter. The first correction filter operates based on first filter coefficients that are based on first value tuples, each first value tuple comprising a first frequency and a respective first circuitry characterizing value, and wherein the first frequencies are equally spaced apart, and the second correction filter operates with second filter coefficients that are based on second value tuples, each second value tuple comprising a second frequency and a respective second circuitry characterizing value, wherein the second frequencies are logarithmically spaced apart.

Herein is provided a device for optimizing bandwidth during oscilloscope measurements. The device is connectable to a probe for electrically connecting a test point and an oscilloscope. The device may include at least two grounding connectors with different inductances for electrically connecting ground to the probe and a tuning network comprising circuitry configured to compensate for the different inductances of said at least two grounding connectors, the tuning network being switchable between different modes, each mode being configured to compensate for a specific inductance of said at least two grounding connectors. A method for optimizing bandwidth during oscilloscope measurements is also provided.